AMENDMENT NO. 1 TO DEPOSIT AGREEMENTDeposit Agreement • August 6th, 2009 • Himax Technologies, Inc. • Semiconductors & related devices
AMENDMENT NO. 1, dated as of August 10, 2009 (the “Amendment”), to the Deposit Agreement (the "Deposit Agreement") dated as of March 30, 2006 among HIMAX TECHNOLOGIES INC., a company incorporated under the laws of the Cayman Islands (the "Company"), DEUTSCHE BANK TRUST COMPANY AMERICAS, an indirect wholly owned subsidiary of Deutsche Bank A.G., acting in its capacity as depositary, and any successor depositary hereunder (the “Depositary”), and (iii) all Holders and Beneficial Owners of American Depositary Shares evidenced by American Depositary Receipts issued thereunder.
44,173,484 Ordinary Shares HIMAX TECHNOLOGIES, INC. ORDINARY SHARES, PAR VALUE US$0.30 PER SHARE in the form of American Depositary Shares UNDERWRITING AGREEMENTUnderwriting Agreement • June 13th, 2013 • Himax Technologies, Inc. • Semiconductors & related devices • New York
Share Exchange Agreement (English Translation)Share Exchange Agreement • March 13th, 2006 • Himax Technologies, Inc.
THIS SHARE EXCHANGE AGREEMENT (this “Agreement”) is entered into on the 16th day of June, 2005 (the “Effective Date”), by and between Himax Technologies, Inc. (“HIMAX”) and Himax Technologies Limited (“LISTCO”).
Plant Facility Service Agreement [Translation]Plant Facility Service Agreement • June 3rd, 2010 • Himax Technologies, Inc. • Semiconductors & related devices
This Agreement is made by and between Chimei Innolux Corporation (hereinafter “Party A”) and Himax Display, Inc. (hereinafter “Party B”) on April 22, 2010. The parties agree to the following terms and conditions with respect to the use by Party B of a plant facility located in Tainan Science and Industrial Park and owned by Party A and the services to be provided by Party A to Party B.
AGREEMENT AND PLAN OF MERGER By and Among Himax Display, Inc. as the Purchaser, Spatial Photonics, Inc. as the Company, AND Wen Hsieh, as the Stockholder Representative Dated November 8, 2010Merger Agreement • May 20th, 2011 • Himax Technologies, Inc. • Semiconductors & related devices
THIS AGREEMENT AND PLAN OF MERGER (this “Agreement ”) is made and entered into this 8th day of November, 2010 (the “Agreement Date”), by and among Himax Display, Inc., a corporation organized under the laws of the Republic of China (the “Purchaser ”) and Spatial Photonics, a Delaware corporation (the “Company”), and Wen Hsieh, solely in its capacity as the representative of the Stockholders (the “Stockholder Representative”). Except as otherwise set forth herein, capitalized terms used herein have the meanings set forth in Exhibit A. As used in this Agreement, the term “Merger Sub” has the meaning set forth in Section 7.13 and such entity, when formed, shall become a party to this Agreement as provided in Section 7.13.
Plant Facility Service Agreement [Translation]Plant Facility Service Agreement • March 13th, 2006 • Himax Technologies, Inc.
This Agreement is made by and between Chi Mei Optoelectronics Corp. (hereinafter “Party A”) and Himax Display, Inc. (hereinafter “Party B”) on July 20, 2004. The parties agree to the following terms and conditions with respect to the use by Party B of a plant facility located in Tainan Science and Industrial Park and owned by Party A and the services to be provided by Party A to Party B.
On the Letterhead of Company] [To Be Executed At the Same Time as the Deposit Agreement]Deposit Agreement • March 13th, 2006 • Himax Technologies, Inc. • Semiconductors & related devices
LEASE AGREEMENT [Translation]Lease Agreement • March 13th, 2006 • Himax Technologies, Inc.
52,000,000 Ordinary Shares HIMAX TECHNOLOGIES, INC. ORDINARY SHARES, PAR VALUE US$0.0001 PER SHARE in the form of American Depositary Shares UNDERWRITING AGREEMENTUnderwriting Agreement • March 20th, 2006 • Himax Technologies, Inc. • Semiconductors & related devices • New York
Himax Technologies, Inc., an exempted company with limited liability incorporated under the laws of the Cayman Islands (the “Company”), proposes to issue and sell to the several Underwriters named in Schedule I hereto (the “Underwriters”) 12,561,753 Ordinary Shares (as defined below), and the shareholders listed in Schedule II hereto (the “Selling Shareholders”) propose severally to sell to the Underwriters 39,438,247 Ordinary Shares (the aggregate of 52,000,000 Ordinary Shares to be sold by the Company and the Selling Shareholders are hereinafter referred to as the “Firm Shares”).
