EXHIBIT 1.1 SUNTECH POWER HOLDINGS CO., LTD. 26,380,000 AMERICAN DEPOSITARY SHARES EACH REPRESENTING ONE ORDINARY SHARE PAR VALUE $0.01 PER ORDINARY SHARE UNDERWRITING AGREEMENTUnderwriting Agreement • December 8th, 2005 • Suntech Power Holdings Co., Ltd. • Semiconductors & related devices • New York
Contract Type FiledDecember 8th, 2005 Company Industry Jurisdiction
EXHIBIT 4.5 SUNTECH POWER HOLDINGS CO., LTD. REGISTRATION RIGHTS AGREEMENT February 12, 2007 REGISTRATION RIGHTS AGREEMENT THIS REGISTRATION RIGHTS AGREEMENT (the "Agreement") is made and entered into as of February 12, 2007, by and among Suntech...Registration Rights Agreement • August 21st, 2007 • Suntech Power Holdings Co., Ltd. • Semiconductors & related devices • New York
Contract Type FiledAugust 21st, 2007 Company Industry Jurisdiction
EXHIBIT 4.4 SUNTECH POWER HOLDINGS CO., LTD. and WILMINGTON TRUST COMPANY as Trustee and Securities Agent INDENTURE Dated as of March 17, 2008 $575,000,000 Principal Amount 3.00% CONVERTIBLE SENIOR NOTES DUE 2013 TABLE OF CONTENTSIndenture • June 17th, 2008 • Suntech Power Holdings Co., Ltd. • Semiconductors & related devices • New York
Contract Type FiledJune 17th, 2008 Company Industry Jurisdiction
AND OWNERS AND BENEFICIAL OWNERS OF AMERICAN DEPOSITARY RECEIPTS Deposit Agreement Dated as of December 13, 2005Deposit Agreement • February 20th, 2007 • Suntech Power Holdings Co., Ltd. • Semiconductors & related devices • New York
Contract Type FiledFebruary 20th, 2007 Company Industry Jurisdiction
WITNESSETHShare Purchase Agreement • November 1st, 2005 • Suntech Power Holdings Co., Ltd. • New York
Contract Type FiledNovember 1st, 2005 Company Jurisdiction
ANDDeposit Agreement • November 1st, 2005 • Suntech Power Holdings Co., Ltd. • New York
Contract Type FiledNovember 1st, 2005 Company Jurisdiction
December 19, 2005Deposit Agreement • February 20th, 2007 • Suntech Power Holdings Co., Ltd. • Semiconductors & related devices
Contract Type FiledFebruary 20th, 2007 Company Industry
EXHIBIT 4.5 SUNTECH POWER HOLDINGS CO., LTD. REGISTRATION RIGHTS AGREEMENT March 17, 2008 REGISTRATION RIGHTS AGREEMENT THIS REGISTRATION RIGHTS AGREEMENT (the "Agreement") is made and entered into as of March 17, 2008, by and among Suntech Power...Registration Rights Agreement • June 17th, 2008 • Suntech Power Holdings Co., Ltd. • Semiconductors & related devices • New York
Contract Type FiledJune 17th, 2008 Company Industry Jurisdiction
EXHIBIT 10.4 NON-DISCLOSURE, NON-COMPETITION AND PROPRIETARY INFORMATION AGREEMENT In partial consideration and as a condition of my [employment] by WUXI SUNTECH POWER CO., LTD. (the "Company"), and effective as of the date that my employment by...Non-Disclosure Agreement • November 1st, 2005 • Suntech Power Holdings Co., Ltd.
Contract Type FiledNovember 1st, 2005 Company
EXHIBIT 10.3 Suntech Power Co., Ltd. Employment Agreement FORM OF EMPLOYMENT AGREEMENT This Employment Agreement (this "Agreement") is entered into on this 15th June, 2005, by and between SUNTECH POWER CO., LTD. (the "Company"), and [NAME OF...Employment Agreement • November 1st, 2005 • Suntech Power Holdings Co., Ltd.
Contract Type FiledNovember 1st, 2005 Company
ANDDeposit Agreement • November 14th, 2005 • Suntech Power Holdings Co., Ltd. • Semiconductors & related devices • New York
Contract Type FiledNovember 14th, 2005 Company Industry Jurisdiction
CERTAIN INFORMATION (INDICATED BY ASTERISKS) IN THIS EXHIBIT HAS BEEN OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION. CONFIDENTIAL TREATMENT HAS BEEN REQUESTED WITH RESPECT TO THE OMITTED PORTION. SOLAR WAFER SUPPLY AGREEMENTSolar Wafer Supply Agreement • June 18th, 2007 • Suntech Power Holdings Co., Ltd. • Semiconductors & related devices • New York
Contract Type FiledJune 18th, 2007 Company Industry Jurisdiction
English translation For reference only FOREIGN CURRENCY LOAN AGREEMENT (2002.ZH) No.: 2005 Year Development Zone Zi No. 05013 Borrower: Wuxi Suntech Power Co., Ltd. Enterprise Legal Person Business License Number: [illegible] He Su Xi No. 004890 Legal...Foreign Currency Loan Agreement • November 1st, 2005 • Suntech Power Holdings Co., Ltd.
Contract Type FiledNovember 1st, 2005 Company
Suntech Power Holdings Co., Ltd. Page #Deposit Agreement • November 2nd, 2005 • Suntech Power Holdings Co., Ltd. • Semiconductors & related devices
Contract Type FiledNovember 2nd, 2005 Company Industry
JOINT FILING AGREEMENTJoint Filing Agreement • February 14th, 2013 • Suntech Power Holdings Co., Ltd. • Semiconductors & related devices
Contract Type FiledFebruary 14th, 2013 Company IndustryIn accordance with Rule 13d-1(k)(1) promulgated under the Securities Exchange Act of 1934, as amended, the undersigned agree to the joint filing of a Statement on Schedule 13G (including any and all amendments thereto) with respect to the ordinary shares, par value $0.01 per share, of Suntech Power Holdings Limited, a Cayman Islands Company, and further agree to the filing of this agreement as an Exhibit thereto. In addition, each party to this Agreement expressly authorizes each other party to this Agreement to file on its behalf any and all amendments to such Statement on Schedule 13G. This Agreement may be executed in any number of counterparts, all of which taken together shall constitute one and the same instrument.
English translation For reference only RMB LOAN AGREEMENT (SHORT-TERM) No.: 2005 Year Development Zone Zi No. 05074 Borrower: Wuxi Suntech Power Co., Ltd. Enterprise Legal Person Business License Number: [illegible] He Su Xi Zi No. 004890 Legal...RMB Loan Agreement (Short-Term) • November 1st, 2005 • Suntech Power Holdings Co., Ltd.
Contract Type FiledNovember 1st, 2005 Company
EXHIBIT 4.10 English translation: for reference only BRIDGE LOAN AGREEMENT THIS AGREEMENT is entered into among the following Parties on January 6, 2005: Party A: MILLION POWER FINANCE LTD. Party B: POWER SOLAR SYSTEM CO., LTD. A company being jointly...Bridge Loan Agreement • November 14th, 2005 • Suntech Power Holdings Co., Ltd. • Semiconductors & related devices • Hong Kong
Contract Type FiledNovember 14th, 2005 Company Industry Jurisdiction
English translation For reference only LONG-TERM LOAN AGREEMENT Contract No.: 2005 Year Development Zi No. 0048 Borrower (Party A): Wuxi Suntech Power Co., Ltd. Domicile (Address): 17-6 Changjiang South Road, New Zone Legal Representative: Li Yanren...Long-Term Loan Agreement • November 1st, 2005 • Suntech Power Holdings Co., Ltd.
Contract Type FiledNovember 1st, 2005 Company
RECITALSIndemnification Agreement • November 1st, 2005 • Suntech Power Holdings Co., Ltd. • New York
Contract Type FiledNovember 1st, 2005 Company Jurisdiction
ContractWarrant Agreement • March 28th, 2008 • Suntech Power Holdings Co., Ltd. • Semiconductors & related devices
Contract Type FiledMarch 28th, 2008 Company IndustryTHIS WARRANT AND ANY SHARES ACQUIRED UPON THE EXERCISE OF THIS WARRANT HAVE NOT BEEN REGISTERED UNDER THE UNITED STATES SECURITIES ACT OF 1933, AS AMENDED (THE “SECURITIES ACT”), OR APPLICABLE STATE SECURITIES LAWS AND HAVE BEEN ISSUED PURSUANT TO AN EXEMPTION THEREFROM. EXCEPT AS PERMITTED UNDER APPLICABLE FEDERAL AND STATE SECURITIES LAWS, THE WARRANT AND ANY SHARES ACQUIRED UPON THE EXERCISE OF THIS WARRANT MAY NOT BE SOLD OR OTHERWISE DISPOSED OF IN THE ABSENCE OF AN EFFECTIVE REGISTRATION STATEMENT UNDER THE SECURITIES ACT AND APPLICABLE STATE SECURITIES LAWS, OR AN OPINION OF COUNSEL ACCEPTABLE TO THE COMPANY THAT SUCH REGISTRATION IS NOT REQUIRED.
EXHIBIT A Joint Filing AgreementJoint Filing Agreement • February 13th, 2006 • Suntech Power Holdings Co., Ltd. • Semiconductors & related devices
Contract Type FiledFebruary 13th, 2006 Company IndustryIn accordance with Rule 13d-1(k) promulgated under the Securities Exchange Act of 1934, the undersigned hereby agree to the joint filing with all other Reporting Persons (as such term is defined in the Schedule 13G referred to below) on behalf of each of them of a statement on Schedule 13G (including amendments thereto) with respect to the ordinary shares, par value $0.01 per share, of Suntech Power Holdings Co., Ltd., a Cayman Islands company, and that this Agreement may be included as an Exhibit to such joint filing. This Agreement may be executed in any number of counterparts, all of which taken together shall constitute one and the same instrument.