CONVERTIBLE BOND PURCHASE AGREEMENTConvertible Bond Purchase Agreement • November 27th, 2009 • ThaiLin Semiconductor Corp. • Semiconductors & related devices • New York
Contract Type FiledNovember 27th, 2009 Company Industry JurisdictionTHIS CONVERTIBLE BOND PURCHASE AGREEMENT, dated as of September 29, 2009 (this “Agreement”), is entered into by and between ChipMOS TECHNOLOGIES (Bermuda) LTD., a company incorporated in Bermuda (the “Company”) and ThaiLin Semiconductor Corp. (the “Purchaser”, and together with the Company, the “Parties”).
CONVERTIBLE BOND EXCHANGE AGREEMENTConvertible Bond Exchange Agreement • November 27th, 2009 • ThaiLin Semiconductor Corp. • Semiconductors & related devices • New York
Contract Type FiledNovember 27th, 2009 Company Industry JurisdictionTHIS CONVERTIBLE BOND EXCHANGE AGREEMENT, dated as of September 29, 2009 (this “Agreement”), is entered into by and between ChipMOS TECHNOLOGIES (Bermuda) LTD., a company incorporated in Bermuda (the “Company”) and ThaiLin Semiconductor Corp. (the “Holder”, and together with the Company, the “Parties”).