ThaiLin Semiconductor Corp. Sample Contracts

CONVERTIBLE BOND PURCHASE AGREEMENT
Convertible Bond Purchase Agreement • November 27th, 2009 • ThaiLin Semiconductor Corp. • Semiconductors & related devices • New York

THIS CONVERTIBLE BOND PURCHASE AGREEMENT, dated as of September 29, 2009 (this “Agreement”), is entered into by and between ChipMOS TECHNOLOGIES (Bermuda) LTD., a company incorporated in Bermuda (the “Company”) and ThaiLin Semiconductor Corp. (the “Purchaser”, and together with the Company, the “Parties”).

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CONVERTIBLE BOND EXCHANGE AGREEMENT
Convertible Bond Exchange Agreement • November 27th, 2009 • ThaiLin Semiconductor Corp. • Semiconductors & related devices • New York

THIS CONVERTIBLE BOND EXCHANGE AGREEMENT, dated as of September 29, 2009 (this “Agreement”), is entered into by and between ChipMOS TECHNOLOGIES (Bermuda) LTD., a company incorporated in Bermuda (the “Company”) and ThaiLin Semiconductor Corp. (the “Holder”, and together with the Company, the “Parties”).

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