NON-REDEMPTION AGREEMENT AND ASSIGNMENT OF ECONOMIC INTERESTNon-Redemption Agreement and Assignment of Economic Interest • October 11th, 2024 • Blaize, Inc. • Semiconductors & related devices • New York
This Non-Redemption Agreement and Assignment of Economic Interest (this “Agreement”) is entered as of March [ ], 2023 by and among BurTech Acquisition Corp. (the “Company”), BurTech LP LLC (the “Sponsor”) and the undersigned investors (collectively, the “Investor”).
TSMC MASTER TECHNOLOGY USAGE AGREEMENTTSMC Master Technology Usage Agreement • November 14th, 2024 • Blaize, Inc. • Semiconductors & related devices • California
This TSMC MASTER TECHNOLOGY USAGE AGREEMENT (the “Agreement”) is entered into on June 15, 2022 (the “Effective Date”) by and between Taiwan Semiconductor Manufacturing Company Limited, a company duly incorporated under the laws of the Republic of China, having its principal place of business at No. 8, Li-Hsin Rd., 6, Hsinchu Science Park, Hsinchu, Taiwan 300-78, Republic of China (“TSMC”), and Blaize, Inc., a company duly incorporated under the laws of the State of Delaware, having its principal place of business at 4370 Town Center Blvd., Suite 240, El Dorado Hills, CA 95762 (“User”).
MASTER ASIC DESIGN, MANUFACTURING AND PRODUCT SALES AGREEMENT AGREEMENT # US1804081Product Sales Agreement • September 9th, 2024 • Blaize, Inc. • Semiconductors & related devices
Customer: Company: Thinci, Inc. (the “Customer”) Address: 2105 S Bascom Ave, Ste. 318. Campbell, CA, USA Postal: 95008 Facility: SV Customer Contact for Notices Name: Santiago Fernandez-Gomez Position: Vicepresident, Platform Engineering Tel: Email: santiago@thinci.com Mobile: +1 408-421-1036 Fax: Customer Contact for Finance Department Name: Richard Janney Position: CFO Tel: Email: Richard.Janney@thinci.com Mobile: Fax:
INTELLECTUAL PROPERTY SECURITY AGREEMENTIntellectual Property Security Agreement • September 9th, 2024 • Blaize, Inc. • Semiconductors & related devices • Delaware
THIS INTELLECTUAL PROPERTY SECURITY AGREEMENT (“Agreement”) dated as of June 30, 2023, is made by Blaize, Inc., a Delaware corporation (the “Grantor”), in favor of each Lender party to a Note (as defined below) that is a signatory hereto (each a “Secured Party” and collectively the “Secured Parties”).
