NON-REDEMPTION AGREEMENT AND ASSIGNMENT OF ECONOMIC INTERESTNon-Redemption Agreement and Assignment of Economic Interest • October 11th, 2024 • Blaize, Inc. • Semiconductors & related devices • New York
This Non-Redemption Agreement and Assignment of Economic Interest (this “Agreement”) is entered as of March [ ], 2023 by and among BurTech Acquisition Corp. (the “Company”), BurTech LP LLC (the “Sponsor”) and the undersigned investors (collectively, the “Investor”).
MASTER ASIC DESIGN, MANUFACTURING AND PRODUCT SALES AGREEMENT AGREEMENT # US1804081Product Sales Agreement • September 9th, 2024 • Blaize, Inc. • Semiconductors & related devices
Customer: Company: Thinci, Inc. (the “Customer”) Address: 2105 S Bascom Ave, Ste. 318. Campbell, CA, USA Postal: 95008 Facility: SV Customer Contact for Notices Name: Santiago Fernandez-Gomez Position: Vicepresident, Platform Engineering Tel: Email: santiago@thinci.com Mobile: +1 408-421-1036 Fax: Customer Contact for Finance Department Name: Richard Janney Position: CFO Tel: Email: Richard.Janney@thinci.com Mobile: Fax:
INTELLECTUAL PROPERTY SECURITY AGREEMENTIntellectual Property Security Agreement • September 9th, 2024 • Blaize, Inc. • Semiconductors & related devices • Delaware
THIS INTELLECTUAL PROPERTY SECURITY AGREEMENT (“Agreement”) dated as of June 30, 2023, is made by Blaize, Inc., a Delaware corporation (the “Grantor”), in favor of each Lender party to a Note (as defined below) that is a signatory hereto (each a “Secured Party” and collectively the “Secured Parties”).
