EXHIBIT 10.26 AMENDMENT NO. 4 TO LOAN AND SECURITY AGREEMENTLoan and Security Agreement • January 14th, 2002 • Iec Electronics Corp • Printed circuit boards • New York
BACKGROUNDLoan Agreement • January 13th, 2005 • Iec Electronics Corp • Printed circuit boards • New York
Exhibit 10.14 Severance Agreement dated April 29, 2004 between IEC Electronics Corp. and William R. Anderson April 29, 2004 Bill R. Anderson Rd. #3, Box 468 E Altoona, PA 16601 Dear Bill: This Letter will summarize the agreement between you and IEC...Severance Agreement • November 17th, 2004 • Iec Electronics Corp • Printed circuit boards
RECITALSEmployment Agreement • April 30th, 2001 • Iec Electronics Corp • Printed circuit boards • New York
EXHIBIT 10.33Loan and Security Agreement • January 14th, 2003 • Iec Electronics Corp • Printed circuit boards • New York
AMENDMENT NO. 3 TO LOAN AND SECURITY AGREEMENTLoan and Security Agreement • January 14th, 2002 • Iec Electronics Corp • Printed circuit boards • New York
JOINT FILING AGREEMENTJoint Filing Agreement • September 8th, 2004 • Iec Electronics Corp • Printed circuit boards
The undersigned hereby agree that this Amendment No. 1 to Schedule 13D with respect to the Common Stock of IEC Electronics Corp., dated as of September 8, 2004, is, and any amendments thereto (including amendments on Schedule 13G) signed by each of the undersigned shall be, filed on behalf of each of us pursuant to and in accordance with the provisions of Rule 13d-1(k) under the Securities Exchange Act of 1934.
LOAN AGREEMENT between IEC ELECTRONICS CORP. and KELTIC FINANCIAL PARTNERS, LPLoan Agreement • November 21st, 2003 • Iec Electronics Corp • Printed circuit boards • New York
FIRST AMENDMENT TO EMPLOYMENT AGREEMENTEmployment Agreement • January 14th, 2002 • Iec Electronics Corp • Printed circuit boards
Exhibit 10.1 FIRST AMENDMENT TO LOAN AGREEMENTLoan Agreement • April 23rd, 2004 • Iec Electronics Corp • Printed circuit boards • New York
Exhibit 10.1 AMENDMENT NO. 6 TO LOAN AND SECURITY AGREEMENTLoan and Security Agreement • March 6th, 2002 • Iec Electronics Corp • Printed circuit boards • New York
AMENDMENT NO. 5 TO LOAN AND SECURITY AGREEMENTLoan and Security Agreement • February 20th, 2002 • Iec Electronics Corp • Printed circuit boards • New York
INDEMNIFICATION AGREEMENTIndemnification Agreement • December 18th, 2015 • Iec Electronics Corp • Printed circuit boards • Delaware
This Indemnification Agreement (this “Agreement”), dated as of [____________], 20[15], is made by and between IEC Electronics Corp., a Delaware corporation (the “Company”), and [__________] (the “Indemnitee”).
LEASE AGREEMENTLease Agreement • April 30th, 2001 • Iec Electronics Corp • Printed circuit boards
FIRST AMENDMENT TO EMPLOYMENT AGREEMENTEmployment Agreement • January 14th, 2002 • Iec Electronics Corp • Printed circuit boards
M&T Bank FIFTH AMENDED AND RESTATED Credit Facility AgreementCredit Facility Agreement • February 12th, 2016 • Iec Electronics Corp • Printed circuit boards • New York
ASSET PURCHASE AGREEMENTAsset Purchase Agreement • December 23rd, 2010 • Iec Electronics Corp • Printed circuit boards • Delaware
This Asset Purchase Agreement (this “Agreement”), dated as of December 17, 2010, is entered into among SOUTHERN CALIFORNIA BRAIDING CO., INC., a California corporation (“Seller”), LEO P. McINTYRE, TRUSTEE OF THE EXEMPTION TRUST CREATED UNDER THE McINTYRE FAMILY TRUST DATED OCTOBER 4, 1993 AS AMENDED AND RESTATED IN ITS ENTIRETY DATED JULY 12, 2005 (“Exemption Trust”), LEO P. McINTYRE, TRUSTEE OF THE McINTYRE SURVIVOR’S TRUST, RESTATEMENT DATED JUNE 13, 2006, CREATED UNDER THE McINTYRE FAMILY TRUST DATED OCTOBER 4, 1993 (“Survivor Trust”), CRAIG PFEFFERMAN (“Pfefferman”), an individual, and LEO P. McINTYRE (McIntyre”), an individual (with Exemption Trust, Survivor Trust, Pfefferman, and McIntyre individually and collectively called “Shareholders” for identification purposes, it being understood that McIntyre is not actually a stockholder of Seller) and CSCB, Inc., a Delaware corporation (“Buyer”).
AGREEMENT AND PLAN OF MERGER By and Among CREATION TECHNOLOGIES INTERNATIONAL INC. CTI ACQUISITION CORP., CREATION TECHNOLOGIES INC., and IEC ELECTRONICS CORP. dated as of August 12, 2021Merger Agreement • August 12th, 2021 • Iec Electronics Corp • Printed circuit boards • Delaware
This Agreement and Plan of Merger (this “Agreement”), is entered into as of August 12, 2021, by and among IEC Electronics Corp., a Delaware corporation (the “Company”), Creation Technologies International Inc., a Delaware corporation (“Parent”), CTI Acquisition Corp., a Delaware corporation and a wholly-owned Subsidiary of Parent (“Merger Sub”) and, solely for purposes of Sections 5.04, 6.05, 9.13 (to the extent related to specific performance of its obligations under Section 6.05) and 9.17, Creation Technologies Inc., a Delaware corporation (“Guarantor”). Capitalized terms used herein (including in the immediately preceding sentence) and not otherwise defined herein shall have the meanings set forth in Section 9.01 hereof.
Exhibit 10.14Option Award Agreement • November 23rd, 2005 • Iec Electronics Corp • Printed circuit boards
BORROWERLoan and Security Agreement • November 21st, 2003 • Iec Electronics Corp • Printed circuit boards • Georgia
LEASE AGREEMENTLease Agreement • December 16th, 2016 • Iec Electronics Corp • Printed circuit boards
THIS LEASE AGREEMENT (this “Lease”) is made as of November 18, 2016 (the “Effective Date”), by and between STORE CAPITAL ACQUISITIONS, LLC, a Delaware limited liability company (“Lessor”), whose address is 8501 E. Princess Drive, Suite 190, Scottsdale, Arizona 85255, and IEC Electronics Corp -- Albuquerque, a New Mexico corporation (“Lessee”), whose address is 105 Norton Street, Newark, New York 14573. Capitalized terms not defined herein shall have the meanings set forth in Exhibit A hereto.
EMPLOYMENT AGREEMENTEmployment Agreement • November 29th, 2018 • Iec Electronics Corp • Printed circuit boards • New York
This Employment Agreement (“Agreement”) is entered into and effective as of September 4, 2018 (“Effective Date”), between IEC Electronics Corp. (“Company”) and Thomas L. Barbato (“Executive”).
IEC ELECTRONICS CORP. OPTION AWARD AGREEMENT PURSUANT TOOption Award Agreement • November 26th, 2012 • Iec Electronics Corp • Printed circuit boards
OPTION AWARD AGREEMENT, executed in duplicate as of the ____ day of_______, 20___, between IEC Electronics Corp., a Delaware corporation (the "Company"), and_________________, an officer [employee] of the Company (the "Optionee").
IEC ELECTRONICS CORP. RESTRICTED STOCK AWARD AGREEMENT PURSUANT TORestricted Stock Award Agreement • November 13th, 2008 • Iec Electronics Corp • Printed circuit boards
RESTRICTED STOCK AWARD AGREEMENT, executed in duplicate as of the 14th day of May, 2008, between IEC Electronics Corp., a Delaware corporation (the "Company"), and Donald S. Doody, Senior Vice President of Operations (the "Executive").
FIRST AMENDMENT TO FOURTH AMENDED AND RESTATED CREDIT FACILITY AGREEMENTCredit Facility Agreement • July 3rd, 2013 • Iec Electronics Corp • Printed circuit boards
THIS FIRST AMENDMENT TO FOURTH AMENDED AND RESTATED CREDIT FACILITY AGREEMENT (this “Amendment”) is made as of the 15 day of May, 2013, by and between IEC ELECTRONICS CORP., a corporation formed under the laws of the State of Delaware (“Borrower”) and MANUFACTURERS AND TRADERS TRUST COMPANY (“Lender”).
WAIVER OF ANNUAL BONUS FOR 2017 FISCAL YEARWaiver of Annual Bonus • May 10th, 2017 • Iec Electronics Corp • Printed circuit boards
WHEREAS, Michael T. Williams (“Employee”) and IEC Electronics Corp. (“Company”), collectively referred to as “the Parties,” are parties to an Employment Agreement (“Agreement”) dated March 20, 2015, which sets forth the terms and conditions of the Employee’s employment by the Company; and
Exhibit 10.30 SUPPLIER AGREEMENT This Supplier Agreement is entered into as of December 27. 2002, by IEC Electronics' Corp. with its principal place of business at Newark, NY, and the Arrow CMS Distribution Group of Arrow Electronics, Inc. ("Arrow...Supplier Agreement • November 21st, 2003 • Iec Electronics Corp • Printed circuit boards
EXHIBIT 10.25Change-in-Control Agreement • January 14th, 2002 • Iec Electronics Corp • Printed circuit boards • New York
EXHIBIT 10.29 SUPPLEMENTAL SEVERANCE AGREEMENT WITH T. LOVELOCK This document will summarize the supplemental agreement between Tom Lovelock and IEC Electronics Corp. (the "Company") with respect to extending the payment schedule relating to severance...Supplemental Severance Agreement • January 14th, 2003 • Iec Electronics Corp • Printed circuit boards
This document will summarize the supplemental agreement between Tom Lovelock and IEC Electronics Corp. (the "Company") with respect to extending the payment schedule relating to severance obligations.
IEC ELECTRONICS CORP. SIGN-ON OPTION AWARD AGREEMENT PURSUANT TOOption Award Agreement • May 11th, 2015 • Iec Electronics Corp • Printed circuit boards
OPTION AWARD AGREEMENT (this “Agreement”), is executed as of the ____ day of March, 2015, between IEC Electronics Corp., a Delaware corporation (the “Company”), and Jeffrey T. Schlarbaum, the Chief Executive Officer of the Company (the “Optionee”).
SALARY CONTINUATION AND NON-COMPETITION AGREEMENTSalary Continuation and Non-Competition Agreement • November 19th, 2010 • Iec Electronics Corp • Printed circuit boards • New York
THIS SALARY CONTINUATION AND NON-COMPETITION AGREEMENT (the “Agreement”) dated and effective as of October 1, 2010, is made and entered into by and between IEC ELECTRONICS CORP (“IEC”) and JEFFREY T. SCHLARBAUM (“Executive”).
DIRECTOR RESTRICTED STOCK AWARD AGREEMENTDirector Restricted Stock Award Agreement • August 7th, 2019 • Iec Electronics Corp • Printed circuit boards • New York
This Director Restricted Stock Award Agreement (this “Award Agreement”) is made and entered into as of [_______________], 20__ (the “Date of Grant”), by and between IEC Electronics Corp. (the “Company”) and ___________________ (the “Director”). Capitalized terms not defined in this Award Agreement shall have the respective meanings given such terms by the IEC Electronics Corp. 2019 Stock Incentive Plan (the “Plan”).
AMENDED AND RESTATED CREDIT FACILITY AGREEMENT AMENDMENT 1Credit Facility Agreement • April 28th, 2010 • Iec Electronics Corp • Printed circuit boards
This AMENDED AND RESTATED CREDIT FACILITY AGREEMENT AMENDMENT 1 (“Amendment”) is made effective as of February 26, 2010 by and among IEC ELECTRONICS CORP., a corporation formed under the laws of the State of Delaware (“Borrower”) and MANUFACTURERS AND TRADERS TRUST COMPANY (“Lender”), a New York banking corporation, with offices at 255 East Avenue, Rochester, New York 14604. This Amendment amends the Amended and Restated Credit Facility Agreement, dated December 16, 2009, made between the Borrower and Lender (“Agreement”). Capitalized terms not otherwise defined in this Amendment shall have the meanings given to them in the Agreement.
FOURTH AMENDMENT TO FOURTH AMENDED AND RESTATED CREDIT FACILITY AGREEMENTCredit Facility Agreement • December 19th, 2013 • Iec Electronics Corp • Printed circuit boards
THIS FOURTH AMENDMENT TO FOURTH AMENDED AND RESTATED CREDIT FACILITY AGREEMENT (this “Amendment”) is made as of the 13th day of December, 2013, by and between IEC ELECTRONICS CORP., a corporation formed under the laws of the State of Delaware (“Borrower”) and MANUFACTURERS AND TRADERS TRUST COMPANY (“Lender”).
SECOND AMENDMENT TO FOURTH AMENDED AND RESTATED CREDIT FACILITY AGREEMENTCredit Facility Agreement • August 8th, 2013 • Iec Electronics Corp • Printed circuit boards
THIS SECOND AMENDMENT TO FOURTH AMENDED AND RESTATED CREDIT FACILITY AGREEMENT (this “Amendment”) is made as of the 6th day of August, 2013, by and between IEC ELECTRONICS CORP., a corporation formed under the laws of the State of Delaware (“Borrower”) and MANUFACTURERS AND TRADERS TRUST COMPANY (“Lender”).
