Exhibit 10.4 EMPLOYMENT AGREEMENT This Employment Agreement ("Agreement"), made as of the 2nd day of February 2004, is by and between Micropac Industries, Inc., a Delaware corporation (the "Company") and Patrick S. Cefalu, an individual and resident...Employment Agreement • November 22nd, 2005 • Micropac Industries Inc • Semiconductors & related devices • Texas
Exhibit 10.11 EMPLOYMENT AGREEMENT This Employment Agreement ("Agreement"), made as of the 12th day of October 2005, is by and between Micropac Industries, Inc., a Delaware corporation (the "Company") and Mark King, an individual and resident of Texas...Employment Agreement • February 10th, 2006 • Micropac Industries Inc • Semiconductors & related devices • Texas
Exhibit 10.1 Document of Understanding Between Advanced Energy Industries and Affiliates MicroPac Industries Inc. Contract Number: 1009 1. PREAMBLE This agreement is made as of this 01st day of February 2003 by and between Advanced Energy Industries,...Micropac Industries Inc • August 23rd, 2005 • Semiconductors & related devices
Exhibit 10.7 SHAREHOLDER AGREEMENT THIS SHAREHOLDER AGREEMENT (the "Agreement") is entered into effective as of February 5, 2001 between MICROPAC INDUSTRIES, INC., a Delaware corporation (the "Company"), and Nicholas Nadolsky, an individual, (referred...Shareholder Agreement • November 22nd, 2005 • Micropac Industries Inc • Semiconductors & related devices • Texas
Exhibit 10.1 Document of Understanding Between Advanced Energy Industries and Affiliates MicroPac Industries Inc. Contract Number: 1009 1. PREAMBLE This agreement is made as of this 01st day of February 2003 by and between Advanced Energy Industries,...Micropac Industries Inc • November 22nd, 2005 • Semiconductors & related devices
AGREEMENT AND PLAN OF MERGERAgreement and Plan of Merger • November 4th, 2024 • Micropac Industries Inc • Semiconductors & related devices • Delaware
This AGREEMENT AND PLAN OF MERGER, dated as of November 1, 2024 (this “Agreement”), is made by and among Teledyne Technologies Incorporated, a Delaware corporation (“Parent”), Harrier Merger Sub, Inc., a Delaware corporation and a wholly owned Subsidiary of Parent (“Merger Sub”), and Micropac Industries, Inc., a Delaware corporation (the “Company”). All capitalized terms used herein shall have the meanings assigned to such terms in Section 8.4 or as otherwise defined elsewhere in this Agreement.
SEVENTH AMENDMENT TO LOAN AGREEMENTLoan Agreement • July 11th, 2023 • Micropac Industries Inc • Semiconductors & related devices • Texas
THIS SEVENTH AMENDMENT TO LOAN AGREEMENT (this “Amendment”) is entered into May 16, 2023, and effective as of April 23, 2023, by and among MICROPAC INDUSTRIES, INC., a Delaware corporation (“Borrower”), and FROST BANK, a Texas state bank (“Lender”).
FOURTH AMENDMENT TO EMPLOYEMENT AGREEMENTEmployement Agreement • July 11th, 2023 • Micropac Industries Inc • Semiconductors & related devices
This fourth amendment ("Third Amendment") is entered into between Micropac Industries, lnc. ("Company") and Patrick S. Cefalu, ("Employee") for the purpose of amending that certain employment agreement between Employee and Company dated February 2, 2004 (the "Employment Agreement").
SIXTH AMENDMENT TO LOAN AGREEMENTLoan Agreement • March 31st, 2021 • Micropac Industries Inc • Semiconductors & related devices • Texas
THIS SIXTH AMENDMENT TO LOAN AGREEMENT (this “Amendment”) is entered into effective as of March 26, 2021, by and among MICROPAC INDUSTRIES, INC., a Delaware corporation (“Borrower”), and FROST BANK, a Texas state bank (“Lender”).
Exhibit 10.8 ANCILLARY AGREEMENT TO PROXY AGREEMENTS WITH RESPECT TO CAPITAL STOCK OF MICROPAC INDUSTRIES, INC.Micropac Industries Inc • November 22nd, 2005 • Semiconductors & related devices
THIRD AMENDMENT TO EMPLOYEMENT AGREEMENTEmployement Agreement • February 11th, 2021 • Micropac Industries Inc • Semiconductors & related devices
This third amendment (“Third Amendment”) is entered into between between Micropac Industries, Inc.("Company") and Patrick S. Cefalu, (“Employee”) for the purpose of amending that certain employment agreement between Employee and Company dated February 2, 2004 (the “Employment Agreement”).
LOAN AGREEMENTSecurity Agreement • January 29th, 2013 • Micropac Industries Inc • Semiconductors & related devices • Texas
CONSTRUCTION LOAN AGREEMENTConstruction Loan Agreement • March 31st, 2021 • Micropac Industries Inc • Semiconductors & related devices • Texas
Exhibit 10.8 ANCILLARY AGREEMENT TO PROXY AGREEMENTS WITH RESPECT TO CAPITAL STOCK OF MICROPAC INDUSTRIES, INC.Micropac Industries Inc • August 23rd, 2005 • Semiconductors & related devices
RESTATED AND AMENDED EMPLOYMENT AGREEMENTEmployment Agreement • February 11th, 2021 • Micropac Industries Inc • Semiconductors & related devices • Texas
This Employment Agreement ("Agreement"), made as of the 1st day of June 2009, is by and between Micropac Industries, Inc., a Delaware corporation (the “Company”) and Mark W. King, an individual and resident of Texas (the "Employee"). The Company and the Employee are herein referred to collectively as the "Parties".
