1 EXHIBIT 2.2 STOCK PURCHASE AGREEMENT Dated as of November 24, 1996Stock Purchase Agreement • January 24th, 1997 • Applied Materials Inc /De • Special industry machinery, nec
RECITALSVoting Agreement • October 21st, 1998 • Applied Materials Inc /De • Special industry machinery, nec • Delaware
Supplementing the Indenture Dated as of August 24, 1994 Between Applied Materials, Inc. and Harris Trust Company of California as TrusteeFirst Supplemental Indenture • September 30th, 1997 • Applied Materials Inc /De • Special industry machinery, nec
1 APPLIED MATERIALS, INC. MEDIUM-TERM NOTES, SERIES A DUE MORE THAN 9 MONTHS TO 30 YEARS FROM DATE OF ISSUE DISTRIBUTION AGREEMENTDistribution Agreement • January 12th, 1996 • Applied Materials Inc /De • Special industry machinery, nec • New York
1 Exhibit 99.1 AGREEMENT AND PLAN OF MERGER AND REORGANIZATIONMerger Agreement • October 21st, 1998 • Applied Materials Inc /De • Special industry machinery, nec • Delaware
Exhibit 10.39 November 24, 2004 CONFIDENTIAL Joseph R. Bronson [HOME ADDRESS] RE: SEPARATION AGREEMENT Dear Joe: The following are the terms of your Separation Agreement with Applied Materials, Inc., and its affiliates and subsidiaries (collectively...Separation Agreement • December 15th, 2004 • Applied Materials Inc /De • Semiconductors & related devices • California
1 EXHIBIT 4.3 [CONSULTANT NAME] Consultant ID Number Grant Number: APPLIED MATERIALS, INC. NONQUALIFIED STOCK OPTION AGREEMENT Applied Materials, Inc. (the "Company") hereby grants you, [NAME OF CONSULTANT] (the "Consultant"), an option under the...Nonqualified Stock Option Agreement • January 27th, 1999 • Applied Materials Inc /De • Special industry machinery, nec
dated as ofCredit Agreement • June 4th, 1998 • Applied Materials Inc /De • Special industry machinery, nec • New York
3 4 Lease Agreements, (y) rights of the Company as sublessor of any portion of such property and assets and (z) Permitted Lease Collateral, such lien shall not be excluded from this definition.Credit Agreement • June 12th, 1997 • Applied Materials Inc /De • Special industry machinery, nec • New York
STOCKHOLDER AGREEMENT AGREEMENT, dated as of November 24, 1996, among Applied Materials, Inc., a Delaware corporation ("Parent"), Orion Corp. I, a Delaware corporation and a wholly owned subsidiary of Parent (the "Purchaser"), and Rafi Yizhar (the...Stockholder Agreement • November 26th, 1996 • Applied Materials Inc /De • Special industry machinery, nec • Delaware
AMENDMENT TO RECEIVABLES PURCHASE AGREEMENT THIS AMENDMENT TO RECEIVABLES PURCHASE AGREEMENT ("Amendment") is entered into as of the 28th day of April, 1999 by and between DEUTSCHE FINANCIAL SERVICES (UK) LIMITED ("Purchaser") and APPLIED MATERIALS,...Receivables Purchase Agreement • June 15th, 1999 • Applied Materials Inc /De • Special industry machinery, nec
WITNESSETH:364-Day Credit Agreement • December 15th, 2004 • Applied Materials Inc /De • Semiconductors & related devices • New York
Among APPLIED MATERIALS, INC. as Borrower andCredit Agreement • January 13th, 2004 • Applied Materials Inc /De • Special industry machinery, nec • New York
APPLIED MATERIALS, INC. $700,000,000 4.800% Notes due 2029 Underwriting AgreementUnderwriting Agreement • June 11th, 2024 • Applied Materials Inc /De • Semiconductors & related devices • New York
Applied Materials, Inc., a Delaware corporation (the “Company”), proposes to issue and sell to the several Underwriters listed in Schedule 1 hereto (the “Underwriters”), for whom you are acting as representatives (the “Representatives”), $700,000,000 principal amount of its 4.800% Senior Notes due 2029 (the “Securities”) having the terms set forth in Schedule 2 hereto. The Securities will be issued pursuant to an Indenture to be dated as of June 11, 2024 (the “Base Indenture”) between the Company and The Bank of New York Mellon Trust Company, N.A., as trustee (the “Trustee”), as supplemented by a supplemental indenture to be dated as of June 11, 2024 (the “Supplemental Indenture” and, together with the Base Indenture, the “Indenture”), between the Company and the Trustee.
and HARRIS TRUST AND SAVINGS BANK, Rights AgentRights Agreement • July 13th, 1999 • Applied Materials Inc /De • Special industry machinery, nec • Delaware
1 EXHIBIT 10.4 PARTICIPATION AGREEMENT dated as of April 30, 1997Participation Agreement • June 12th, 1997 • Applied Materials Inc /De • Special industry machinery, nec • New York
CONSILIUM, INC. NONSTATUTORY STOCK OPTION AGREEMENTNonstatutory Stock Option Agreement • December 18th, 1998 • Applied Materials Inc /De • Special industry machinery, nec • California
RecitalsVoting Agreement • January 24th, 2000 • Applied Materials Inc /De • Special industry machinery, nec • Delaware
INDEMNIFICATION AGREEMENTIndemnification Agreement • May 23rd, 2024 • Applied Materials Inc /De • Semiconductors & related devices • Delaware
INDEMNIFICATION AGREEMENT (this “Agreement”), made as of this _____________ day of _____________, _____________, by and between Applied Materials, Inc., a Delaware corporation (the “Company”), and _____________ (the “Indemnitee”), [an executive officer of the Company] / [a member of the Company’s Board of Directors (the “Board”)].
MASTER LEASEMaster Lease • June 12th, 1997 • Applied Materials Inc /De • Special industry machinery, nec • New York
EXHIBIT 10.3 APPLIED MATERIALS, INC. RESTRICTED STOCK AGREEMENT Applied Materials, Inc. (the "Company") hereby grants you, Michael R. Splinter (the "Employee"), a grant of restricted stock. The date of this Agreement is May 20, 2003. Subject to the...Restricted Stock Agreement • June 9th, 2003 • Applied Materials Inc /De • Special industry machinery, nec • California
U.S. $1,500,000,000 CREDIT AGREEMENT Dated as of February 21, 2020 Among APPLIED MATERIALS, INC. as Borrower THE INITIAL LENDERS NAMED HEREIN as Initial Lenders and JPMORGAN CHASE BANK, N.A., as Administrative Agent CITIGROUP GLOBAL MARKETS INC. MUFG...Credit Agreement • February 21st, 2020 • Applied Materials Inc /De • Semiconductors & related devices • New York
CREDIT AGREEMENT dated as of February 21, 2020 among APPLIED MATERIALS, INC., a Delaware corporation (the “Borrower”), the banks, financial institutions and other institutional lenders (the “Initial Lenders”) listed on the signature pages hereof, and JPMORGAN CHASE BANK, N.A., as Administrative Agent.
TRUST DEEDTrust Deed • January 27th, 1998 • Applied Materials Inc /De • Special industry machinery, nec
LOAN AGREEMENTLoan Agreement • June 12th, 1997 • Applied Materials Inc /De • Special industry machinery, nec • New York
RecitalsStock Option Agreement • January 24th, 2000 • Applied Materials Inc /De • Special industry machinery, nec • Nevada
APPLIED MATERIALS, INC. as Issuer AND THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A. as Trustee INDENTURE Dated as of June 11, 2024 UNSUBORDINATED DEBT SECURITIESIndenture • June 11th, 2024 • Applied Materials Inc /De • Semiconductors & related devices • New York
THIS INDENTURE is dated as of June 11, 2024 among APPLIED MATERIALS, INC., a Delaware corporation (the “Company”) and THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., not in its individual capacity but solely in its capacity as trustee hereunder (together with its successors and assigns, the “Trustee”).
2 IN WITNESS WHEREOF, the parties hereto have caused this Amendment to be duly executed by their respective authorized officers as of the day and year first above written.Credit Agreement • June 12th, 1997 • Applied Materials Inc /De • Special industry machinery, nec • New York
EXECUTION COPY AMENDMENT TO RECEIVABLES PURCHASE AGREEMENT THIS AMENDMENT TO RECEIVABLES PURCHASE AGREEMENT ("Amendment") is entered into as of the 26th day of January, 1999 by and between DEUTSCHE FINANCIAL SERVICES CORPORATION ("Purchaser")and...Receivables Purchase Agreement • March 9th, 1999 • Applied Materials Inc /De • Special industry machinery, nec
WITNESSETH:Three Year Credit Agreement • December 15th, 2004 • Applied Materials Inc /De • Semiconductors & related devices • New York
APPENDIX 1 to Participation Agreement, Master Lease Agreement and Loan Agreement, each dated as of April 30, 1997 (Applied Materials, Inc.)Participation Agreement • June 12th, 1997 • Applied Materials Inc /De • Special industry machinery, nec
AGREEMENT AND PLAN OF MERGER among: Applied Materials, Inc., a Delaware corporation; Blue Acquisition, Inc., a Colorado corporation; and Applied Films Corporation, a Colorado corporation Dated as of May 4, 2006Merger Agreement • August 31st, 2006 • Applied Materials Inc /De • Semiconductors & related devices • Delaware
This Agreement and Plan of Merger is made and entered into as of May 4, 2006, by and among Applied Materials, Inc., a Delaware corporation (“Parent”), Blue Acquisition, Inc., a Colorado corporation and a wholly-owned subsidiary of Parent (“Merger Sub”), and Applied Films Corporation, a Colorado corporation (the “Company”). Certain capitalized terms used in this Agreement are defined in Exhibit A.
1 EXHIBIT 10.32 October 28, 1998 To: The Bank of Tokyo -- Mitsubishi, Ltd. LETTER OF GUARANTEE Dear Sirs: With reference to the credit facilities extended by you to Applied Komatsu Technology, Inc., ("AKT") a company duly organized and existing under...Letter of Guarantee • January 20th, 1999 • Applied Materials Inc /De • Special industry machinery, nec
SCHEDULED VESTING DATES: NUMBER OF SHARES ------------------------ ---------------- 11/14/99 50 11/14/00 50 11/14/01 50 11/14/02 50Nonqualified Stock Option Agreement • January 27th, 1999 • Applied Materials Inc /De • Special industry machinery, nec
U.S. $1,500,000,000 CREDIT AGREEMENT Dated as of September 3, 2015 Among APPLIED MATERIALS, INC. as Borrower THE INITIAL LENDERS NAMED HEREIN as Initial Lenders and JPMORGAN CHASE BANK, N.A., as Administrative Agent CITIGROUP GLOBAL MARKETS INC. THE...Credit Agreement • September 9th, 2015 • Applied Materials Inc /De • Semiconductors & related devices • New York
CREDIT AGREEMENT dated as of September 3, 2015 among APPLIED MATERIALS, INC., a Delaware corporation (the “Borrower”), the banks, financial institutions and other institutional lenders (the “Initial Lenders”) listed on the signature pages hereof, and JPMORGAN CHASE BANK, N.A., as Administrative Agent.
U.S. $1,000,000,000 CREDIT AGREEMENT Dated as of January 26, 2007 Among APPLIED MATERIALS, INC. as Borrower and THE INITIAL LENDERS NAMED HEREIN as Initial Lenders CITICORP USA, INC. as Administrative Agent THE BANK OF TOKYO-MITSUBISHI UFJ, LTD.,...Credit Agreement • February 28th, 2007 • Applied Materials Inc /De • Semiconductors & related devices • New York
APPLIED MATERIALS, INC., a Delaware corporation (the “Borrower”), the banks, financial institutions and other institutional lenders (the “Initial Lenders”) listed on the signature pages hereof, and CITICORP USA, INC. (“CUSA”), as agent (the “Agent”) for the Lenders (as hereinafter defined), agree as follows:
