1 EXHIBIT 2.1 AGREEMENT AND PLAN OF MERGER DATED AS OF JUNE 21, 2000Agreement and Plan of Merger • June 22nd, 2000 • Burr Brown Corp • Semiconductors & related devices • Delaware
2 3 Shares provided in Section 1(a) hereof, to send a written notice to the Company (the "CASH EXERCISE NOTICE") specifying a date not later than 20 business days and not earlier than 10 business days following the date such notice is given on which...Stock Option Agreement • June 22nd, 2000 • Burr Brown Corp • Semiconductors & related devices • Delaware
BY AND AMONGRegistration Rights Agreement • February 25th, 2000 • Burr Brown Corp • Semiconductors & related devices • New York
andRights Agreement • August 11th, 1999 • Burr Brown Corp • Semiconductors & related devices • Delaware
To UNITED STATES TRUST COMPANY OF NEW YORK, as Trustee INDENTURE Dated as ofBurr Brown Corp • February 25th, 2000 • Semiconductors & related devices • New York
EXHIBIT 10.19 LOAN AGREEMENT by and among BURR-BROWN CORPORATION (the "BORROWER"),Loan Agreement • March 29th, 1996 • Burr Brown Corp • Semiconductors & related devices • Arizona
TEXAS INSTRUMENTS INCORPORATED, as Guarantor TEXAS INSTRUMENTS TUCSON CORPORATION, (formerly known as Burr-Brown Corporation) as Issuer To UNITED STATES TRUST COMPANY OF NEW YORK, as Trustee FIRST SUPPLEMENTAL INDENTURE Dated as ofTexas Instruments Tucson Corp • August 25th, 2000 • Semiconductors & related devices • New York
Exhibit 10.19 - Amendment to Loan Agreement AMENDMENT NO. 1 TO LOAN AGREEMENT THIS AMENDMENT NO. 1 TO LOAN AGREEMENT (this "Amendment"), is made this 15th day of November, 1996, by and between BURR- BROWN CORPORATION, a Delaware corporation...Loan Agreement • March 31st, 1997 • Burr Brown Corp • Semiconductors & related devices • Arizona
2 3 12. Parent, Merger Sub and the Company severally, but not jointly, represent and warrant to each Stockholder that there is no agreement, understanding or commitment, written or oral, to pay any consideration directly or indirectly in connection...Voting Agreement • June 22nd, 2000 • Burr Brown Corp • Semiconductors & related devices • Delaware
1 Exhibit 99.9 BURR-BROWN CORPORATION EMPLOYEE STOCK PURCHASE PLAN ("ESPP") ENROLLMENT/CHANGE FORMEmployee Stock Purchase Plan • July 7th, 1998 • Burr Brown Corp • Semiconductors & related devices
BURR-BROWN CORPORATION FUTURE INVESTMENT PLAN TRUST Dated as of December 1, 1998 TRUST AGREEMENT, dated as of the first day of December, 1998, between BURR-BROWN CORPORATION an Arizona corporation, having an office at 6730 S. Tucson Boulevard, Tucson,...Trust Agreement • March 31st, 1999 • Burr Brown Corp • Semiconductors & related devices • Massachusetts
Exhibit 10.11 - Amendment to Loan Agreement AMENDMENT NO. 2 TO LOAN AGREEMENT THIS AMENDMENT NO. 2 TO LOAN AGREEMENT (this "Amendment"), is made this 21st day of December, 1997, by and between BURR-BROWN CORPORATION, a Delaware corporation...Loan Agreement • March 31st, 1998 • Burr Brown Corp • Semiconductors & related devices • Arizona
1 Exhibit 99.10 BURR-BROWN CORPORATION STOCK PURCHASE AGREEMENT I hereby elect to participate in the Employee Stock Purchase Plan (the "ESPP") for the purchase period specified below, and I hereby subscribe to purchase shares of Common Stock of...Stock Purchase Agreement • July 7th, 1998 • Burr Brown Corp • Semiconductors & related devices
Exhibit 10.8 Amendment No. 3 to Loan Agreement AMENDMENT NO. 3 TO LOAN AGREEMENT THIS AMENDMENT NO. 3 TO LOAN AGREEMENT (this "Amendment"), is made this 2nd day of December, 1998, by and between BURR- BROWN CORPORATION, a Delaware corporation...Loan Agreement • March 31st, 1999 • Burr Brown Corp • Semiconductors & related devices • Arizona
EXHIBIT 10.8 AMENDMENT NO. 4 TO LOAN AGREEMENT THIS AMENDMENT NO. 4 TO LOAN AGREEMENT (this "Amendment"), is made this 28th day of May, 1999, by and between BURR-BROWN CORPORATION, a Delaware corporation ("Borrower"), and WELLS FARGO BANK, NATIONAL...Loan Agreement • February 9th, 2000 • Burr Brown Corp • Semiconductors & related devices • Arizona
