Quicklogic Corporation Sample Contracts

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EXHIBIT 10.18 QUICKLOGIC CORPORATION EXPORT-IMPORT BANK LOAN AND SECURITY AGREEMENT TABLE OF CONTENTS
Loan and Security Agreement • June 9th, 1997 • Quicklogic Corporation • California
RECITALS --------
Shareholders Agreement • June 9th, 1997 • Quicklogic Corporation • California
AGREEMENT ---------
Registration Rights Agreement • June 9th, 1997 • Quicklogic Corporation • California
EXHIBIT 10.9 TERMINATION AGREEMENT
Termination Agreement • June 18th, 1997 • Quicklogic Corporation • Semiconductors & related devices • California
EXHIBIT 10.20 QUICKLOGIC CORPORATION First Amended and Restated Common Stock Purchase Agreement June 13, 1997 TABLE OF CONTENTS -----------------
Common Stock Purchase Agreement • June 18th, 1997 • Quicklogic Corporation • Semiconductors & related devices • California
UNDERWRITING AGREEMENT
Underwriting Agreement • March 20th, 2000 • Quicklogic Corporation • Semiconductors & related devices • New York
WITNESSETH ----------
Supply Agreement • June 18th, 1997 • Quicklogic Corporation • Semiconductors & related devices • California
Business Loan Agreement Continued ---------
Loan Modification Agreement • June 9th, 1997 • Quicklogic Corporation • California

Borrower: QUICKLOGIC CORPORATION Lender: Silicon Valley Bank 2933 Bunker Hill Lane 3000 Lakeside Drive Santa Clara, CA 95054 Santa Clara, CA 95054

AGREEMENT BETWEEN
Agreement • July 30th, 1997 • Quicklogic Corporation • Semiconductors & related devices • California
16,000,000 Shares QUICKLOGIC CORPORATION Common Stock UNDERWRITING AGREEMENT
Underwriting Agreement • June 21st, 2019 • QUICKLOGIC Corp • Semiconductors & related devices • New York

QuickLogic Corporation, a Delaware corporation (the “Company”), proposes, subject to the terms and conditions contained herein, to sell to you and the other underwriters named on Schedule I to this Agreement (the “Underwriters”), for whom you are acting as Representative (the “Representative”), an aggregate of 16,000,000 shares (the “Firm Shares”) of the Company’s common stock, $0.001 par value per share (the “Common Stock”). The respective amounts of the Firm Shares to be purchased by each of the several Underwriters are set forth opposite their names on Schedule I hereto. In addition, the Company proposes to grant to the Underwriters an option to purchase up to an additional 2,400,000 shares (the “Option Shares”) of Common Stock from the Company for the purpose of covering over-allotments in connection with the sale of the Firm Shares. The Firm Shares and the Option Shares are collectively called the “Shares.”

10,000,000 Shares1 QUICKLOGIC CORPORATION Common Stock, par value $0.001 per share UNDERWRITING AGREEMENT
Underwriting Agreement • March 28th, 2017 • Quicklogic Corporation • Semiconductors & related devices • New York

QuickLogic Corporation, a Delaware corporation (the “Company”), proposes, subject to the terms and conditions stated herein, to sell to the several underwriters named in Schedule I hereto (the “Underwriters,” or each an “Underwriter”) an aggregate of 10,000,000 shares (the “Firm Shares”) of common stock, par value $0.001 per share (the “Common Stock”), of the Company. The Firm Shares consist of authorized but unissued shares of Common Stock to be issued and sold by the Company. The Company also proposes to grant to the Underwriters an option to purchase up to 1,500,000 additional shares of Common Stock on the terms and for the purposes set forth in Section 3 hereof (the “Option Shares”). The Firm Shares and any Option Shares purchased pursuant to this Underwriting Agreement are herein collectively called the “Securities.”

BACKGROUND
Cross License Agreement • June 18th, 1997 • Quicklogic Corporation • Semiconductors & related devices • California
LEASE
Acceptance Agreement • June 9th, 1997 • Quicklogic Corporation • California
10,000,000 Shares QuickLogic Corporation Common Stock UNDERWRITING AGREEMENT
Underwriting Agreement • March 22nd, 2016 • Quicklogic Corporation • Semiconductors & related devices • California

QuickLogic Corporation, a Delaware corporation (the “Company”), proposes, subject to the terms and conditions stated herein, to issue and sell to the several underwriters named on Schedule I hereto (the “Underwriters,” or each, an “Underwriter”) an aggregate of 10,000,000 authorized but unissued shares (the “Firm Shares”) of common stock, par value $0.001 per share (the “Common Stock”), of the Company. The Company also proposes, subject to the terms and conditions stated herein, to issue and sell to the Underwriters an aggregate of up to 1,500,000 shares of Common Stock (the “Additional Shares”), if and to the extent that the Underwriters shall have determined to exercise the right to purchase Additional Shares granted to the Underwriters in Section 4(b) hereof. The Firm Shares and Additional Shares are collectively referred to as the “Shares”. The Shares shall be immediately separable and transferable upon issuance. Roth Capital Partners, LLC (“Roth”) is acting as representative of th

WITNESSETH:
Foundry Agreement • March 28th, 2001 • Quicklogic Corporation • Semiconductors & related devices • California
FORM OF SUBSCRIPTION AGREEMENT
Form of Subscription Agreement • December 9th, 2016 • Quicklogic Corporation • Semiconductors & related devices • New York

The undersigned (the “Investor”) hereby confirms its agreement with QuickLogic Corporation, a Delaware corporation (the “Company”), as follows:

QUICKLOGIC CORPORATION CHANGE OF CONTROL SEVERANCE AGREEMENT
Change of Control Severance Agreement • March 11th, 2008 • Quicklogic Corporation • Semiconductors & related devices • California

This Change of Control Severance Agreement (the “Agreement”) is made and entered into effective as of , 200 (the “Effective Date”), by and between [CEO] (the “Employee”) and QuickLogic Corporation, a Delaware corporation (the “Company”). Certain capitalized terms used in this Agreement are defined in Section 1 below.

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QUICKLOGIC CORPORATION INDEMNIFICATION AGREEMENT
Indemnification Agreement • November 13th, 2002 • Quicklogic Corporation • Semiconductors & related devices • Delaware

This Indemnification Agreement (“Agreement”) is made as of this day of , , by and between QuickLogic Corporation, a Delaware corporation (the “Company”), and (“Indemnitee”).

QUICKLOGIC CORPORATION 13,513,510 Shares of Common Stock, par value $0.001 per share, and Warrants to Purchase 5,405,404 Shares of Common Stock UNDERWRITING AGREEMENT
Quicklogic Corporation • May 29th, 2018 • Semiconductors & related devices • New York

QuickLogic Corporation, a Delaware corporation (the “Company”), proposes, subject to the terms and conditions stated herein, to sell to the several underwriters named in Schedule I hereto (the “Underwriters,” or each an “Underwriter”) (i) an aggregate of 13,513,510 shares (the “Shares”) of common stock, par value $0.001 per share (the “Common Stock”), of the Company, and (ii) warrants of the Company, in the form set forth in Exhibit A hereto, to purchase an aggregate of 5,405,404 shares of Common Stock (the “Warrant Shares”) at an exercise price of $1.38 per share (the “Warrants”). Each Share is being sold together with a Warrant to purchase four-tenths of a share of Common Stock. The Shares and the Warrant Shares consist of authorized but unissued shares of Common Stock to be issued and sold by the Company. The Shares, the Warrants and the Warrant Shares purchased pursuant to this Underwriting Agreement (this “Agreement”) are herein collectively called the “Securities.”

SHARE PURCHASE AGREEMENT BETWEEN QUICKLOGIC CORPORATION AND TOWER SEMICONDUCTOR LTD.
Share Purchase Agreement • March 28th, 2001 • Quicklogic Corporation • Semiconductors & related devices • California
AGREEMENT BETWEEN
Agreement • October 12th, 1999 • Quicklogic Corporation • Semiconductors & related devices • California
FORM OF COMMON STOCK PURCHASE AGREEMENT
Common Stock Purchase Agreement • September 20th, 2022 • QUICKLOGIC Corp • Semiconductors & related devices • New York

This Common Stock Purchase Agreement (this “Agreement”) is dated as of ________________, between QuickLogic Corporation, a Delaware corporation (the “Company”), and _______ (including its successors and assigns, the “Purchaser”).

2,500,000 Shares QUICKLOGIC CORPORATION Common Stock UNDERWRITING AGREEMENT
Underwriting Agreement • June 22nd, 2020 • QUICKLOGIC Corp • Semiconductors & related devices • New York
Quicklogic Corporation HERITAGE BANK OF COMMERCE AMENDED AND RESTATED LOAN AND SECURITY AGREEMENT
Loan and Security Agreement • December 28th, 2018 • Quicklogic Corporation • Semiconductors & related devices • California

This Amended And Restated Loan And Security Agreement (this “Agreement”) is entered into as of December 21, 2018, by and between Heritage Bank of Commerce (“Bank”) and Quicklogic Corporation (“Borrower”). This Agreement amends and restates in its entirety that certain Loan and Security Agreement dated as of September 28, 2018, by and between Bank and Borrower, as previously amended, restated, amended and restated, supplemented, or otherwise modified from time to time (the “Original Agreement”).

SECOND AMENDMENT TO SECOND AMENDED AND RESTATED LOAN AND SECURITY AGREEMENT
Loan and Security Agreement • August 7th, 2008 • Quicklogic Corporation • Semiconductors & related devices

THIS SECOND AMENDMENT to Second Amended and Restated Loan and Security Agreement (this “Amendment”) is entered into this 27th day of June, 2008, by and between Silicon Valley Bank (“Bank”) and QUICKLOGIC CORPORATION, a Delaware corporation (“Borrower”) whose address is 1277 Orleans Drive, Sunnyvale, California 94089-1138

SUBSCRIPTION AGREEMENT
Subscription Agreement • November 17th, 2009 • Quicklogic Corporation • Semiconductors & related devices • New York

The undersigned (the “Investor”) hereby confirms its agreement with QuickLogic Corporation, a Delaware corporation (the “Company”), as follows:

QUICKLOGIC CORPORATION INDEMNIFICATION AGREEMENT
Indemnification Agreement • March 17th, 2005 • Quicklogic Corporation • Semiconductors & related devices • Delaware

This Indemnification Agreement (“Agreement”) is made as of this day of , , by and between QuickLogic Corporation, a Delaware corporation (the “Company”), and (“Indemnitee”).

RECITALS
Wafer Fabrication Agreement • June 18th, 1997 • Quicklogic Corporation • Semiconductors & related devices • California
FIFTH AMENDMENT TO SECOND AMENDED AND RESTATED LOAN AND SECURITY AGREEMENT
Loan and Security Agreement • October 1st, 2009 • Quicklogic Corporation • Semiconductors & related devices

THIS FIFTH AMENDMENT to Second Amended and Restated Loan and Security Agreement (this “Amendment”) is entered into this 25th day of September, 2009 (the “Amendment Date”), by and between SILICON VALLEY BANK (“Bank”) and QUICKLOGIC CORPORATION, a Delaware corporation (“Borrower”), whose address is 1277 Orleans Drive, Sunnyvale, California 94089-1138.

LOAN AND SECURITY AGREEMENT between SILICON VALLEY BANK and QUICKLOGIC CORPORATION June 28, 2002
Loan and Security Agreement • August 14th, 2002 • Quicklogic Corporation • Semiconductors & related devices • California

This LOAN AND SECURITY AGREEMENT dated June 28, 2002, between SILICON VALLEY BANK ("Bank"), whose address is 3003 Tasman Drive, Santa Clara, California 95054 and QUICKLOGIC CORPORATION, a California corporation ("Borrower"), whose address is 1277 New Orleans Drive, Sunnyvale, CA 94089-1138, provides the terms on which Bank will lend to Borrower and Borrower will repay Bank. The parties agree as follows:

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