EXHIBIT 4.8
Page 1 of 7
9 September 2003
SPECIFIC SERVICE AGREEMENT
BETWEEN
SONY ERICSSON MOBILE COMMUNICATIONS AB
(HEREINAFTER REFERRED TO AS "SONY ERICSSON")
AND
NAMTAI ELECTRONIC (SHENZHEN) COMPANY LTD.
(HEREINAFTER REFERRED TO AS THE "SUPPLIER")
REGARDING PROJECT "ALEX"
Page 2 of 7
9 September 2003
TABLE OF CONTENTS
1. TERMINOLOGY, INTEGRATED PART............................................... 1
2. SCOPE OF THE SSA........................................................... 2
3. FORECASTS AND ROADMAPS..................................................... 2
4. COMMUNICATION AND CONTACT PERSONS.......................................... 2
5. INDUSTRIALISATION SERVICES................................................. 2
6. INDUSTRIALISATION-TEST APPLICATIONS........................................ 3
7. PROTOTYPES................................................................. 3
8. SPECIFICATION.............................................................. 3
9. DOCUMENTATION.............................................................. 3
10. PRICING AND TERMS OF PAYMENT............................................ 3
11. TERMS OF DELIVERY....................................................... 4
12. PACKING AND LABELLING................................................... 4
13. QUALITY................................................................. 4
14. PURCHASE OF COMPONENTS.................................................. 5
15. TERM OF AGREEMENT AND TERMINATION....................................... 5
ENCLOSURES:
Enclosure 2.3 Project Plan, 1/10053-FCP1012478 Latest Edition
Enclosure 10.1 Prices and Price model
Enclosure 14.1 Purchase of components
Enclosure 14.2 Forecast Flexibility & Liability model
Page 1 of 7
9 September 2003
SPECIFIC SERVICE AGREEMENT
made as of 9th September 2003, by and between
Sony Ericsson Mobile Communications AB, Org no 556615-6658, a limited liability
company duly incorporated and existing under the laws of Sweden, with its
principal office at Nya Vattentornet, X-000 00 Xxxx, Xxxxxx, hereinafter
referred to as "Sony Ericsson",
and
NAMTAI ELECTRONIC (SHENZHEN) COMPANY LTD., a corporation duly incorporated and
existing under the laws of The Peoples' Republic of China ("PRC") and having its
registered officer at Gu Su Industrial Estate, Xinan, Baoan, Shenzhen, PRC
(hereinafter referred to as the "Supplier").
(hereinafter referred to as the "Supplier").
WHEREAS:
1. Ericsson and Namtai Electronic & Electrical Products Ltd have entered
into the General Service and Purchase Agreement, GSPA, dated 15th
February 2001 among other agreements, The GSPA has been duly assigned
to Sony Ericsson Mobile Communications AB during 2002.
2. The GSPA contains the general terms and conditions for the performance
of Product Supply to Sony Ericsson, from Supplier,
3. It is intended that the GSPA will be supplemented by one (1) or more
SSA's setting out the specific provisions relating to the performance
of Product Supply, and
4. The Supplier has explained that it is willing and fully able to perform
the Product Supply on behalf of Sony Ericsson for delivery of high
quality Products, under the terms and conditions set out in this SSA
and the GSPA.
NOW THEREFORE, in consideration of the mutual obligations herein contained, the
Parties agree as follows:
1. TERMINOLOGY, INTEGRATED PART
The GSPA shall be an integrated part of this SSA and, accordingly, all
terms and conditions in the GSPA shall also apply to this SSA.
Capitalised terms contained herein shall have the meanings assigned to
them below or as ascribed to them in the GSPA unless otherwise defined
in the context or document where it is used.
"AGREEMENT", means this Specific Service Agreement.
"GSPA", means the General Service and Purchase Agreement referred to in
the "Whereas"-section above entered into between the Parties.
Page 2 of 7
9 September 2003
"PRODUCT", means the Flash Alex, developed by C Technologies AB on
behalf of Sony Ericsson and as further specified in this Agreement.
"PA", means the Purchase Agreement separately signed covering the
Product. The PA will be the new name of the SPA mentioned in the GSPA.
"SSA", means this Specific Service Agreement.
2. SCOPE OF THE SSA
2.1 Under the terms and conditions set forth in the Agreement Documents
(i) Supplier shall - exclusively for Sony Ericsson ~ perform
Product Supply regarding the Product, and
(ii) Sony Ericsson shall be entitled to purchase the Products from
Supplier under the PA.
2.2 In the event of an inconsistency in the Agreement Document, the
inconsistency shall be resolved by giving documents precedence in the
following order:
(i) The Purchase Order, excluding Sony Ericsson's general
purchasing conditions if such have been enclosed with the Purchase Order,
(ii) The PA,
(iii) The GSPA.
(iv) This Agreement excluding the Enclosures,
(v) Enclosure 2.3 Project Plan
(vi) Enclosure 10.1 Prices and Price model
(vii) Enclosure 14.1 Purchase of components,
(viii) Enclosure 14.2 Forecast, Flexibility & Liability model
2.3 Included in the Product Supply shall be repair and maintenance services
as set out in Enclosure 2.3.
3. FORECASTS AND ROADMAPS
3.1 A forecast of RTL and production volumes may be included in Enclosure
2.3. These volume are only for production and capacity planning
purposes, Sony Ericsson is not committed to buy according to the
forecasted volumes. Sony Ericsson is liability for forecasted volumes
as per Article 14.
4. COMMUNICATION AND CONTACT PERSONS
4.1 In accordance with Subsection 5.5 of the GSPA the Parties hereby
appoint the contact persons set out in Enclosure 2.3 to receive and to
communicate information.
5. INDUSTRIALISATION SERVICES
Page 3 of 7
9 September 2003
5.1 Supplier shall, as part of the Product Supply and in accordance with
Subsection 6.1 of the GSPA, lead and be responsible for the
industrialisation of Product.
5.2 Supplier shall, as part of the Product Supply and in accordance with
Subsection 6.4 of the GSPA, provide information for the design work and
furthermore manufacture the test applications.
5.3 The requirements for traceability as provided in Subsection 6.7 in the
GSPA shall be as set out in Enclosure 2.3.
6. INDUSTRIALISATION-TEST APPLICATIONS,
6.1 Supplier shall develop and deliver Manufacturing Test Applications as
set out in Section 7 of the GSPA and as the case may be in Enclosure
2.3
7. PROTOTYPES
7.1 Supplier shall
(i) provide Sony Ericsson with Prototypes
(ii) review the Prototypes for manufacturability,
(iii) perform the testing of the Prototype, as defined in Enclosure
2.3 and
(iv) provide Sony Ericsson with written reports of the analysis of
the Prototypes.
8. SPECIFICATION
8.1 Supplier shall not deliver any Products unless they meet the
requirements set out in the Specification as set out in Enclosure 2.3
and amended from time to time in and as further described in Section 14
in the GSPA,
9. DOCUMENTATION
9.1 Project Documentation
The Supplier shall submit written reports to Sony Ericsson on the
activities and the progress of the Product Supply. Such reports shall
include the reports and plans specified in Enclosure 2.3.
9.2 Product Documentation
Supplier shall produce and deliver to Sony Ericsson Product
Documentation fulfilling the requirements set out in templates included
in Enclosure 2.3.
10. PRICING AND TERMS OF PAYMENT
10.1 The current price and the price model of the Product shall be as set
out in Enclosure 10.1
All invoices sent by Supplier shall be in USD or Euro as agreed in the
PA
Page 4 of 7
9 September 2003
10.2 Price review
The price of the Products shall be reviewed and agreed quarterly before
the ending of every quarter in order for the prices to be firm for
deliveries during the following quarter.
The basis for the price review shall be:
(i) significant changes in volumes, and/or;
(ii) fluctuations in the exchange rate as defined below, and/or;
(iii) changes to the Specification, and/or;
(iv) increased production efficiency including but not limited to
"The learning curve advantage", and/or;
(v) changes in the price of the components.
(vi) delivery performance in the last quarter before against agreed
and acknowledge order, call of lead time
Changes in the Specification and/or changes of a specific component
price during a quarter, which causes a different price shall
immediately or with a reasonable delay - due to material in stock -
apply to all ordered Products. Such reasonable delays shall however
only relate to reasonable explainable normal stock levels or situations
with higher stock levels attributable to Sony Ericsson. At the
quarterly price review meetings Supplier will describe and specify the
changes made during the quarter. The different price shall be passed on
to Sony Ericsson at the aforementioned fixed exchange rate as defined
in GSPA.
11. TERMS OF DELIVERY
11.1 Delivery time
The Supplier shall perform the Product Supply, in accordance with the
time-schedule set out in Enclosure 2.3 Dates of delivery of volume
produced Products shall be as stated in the relevant P.O.
11.2 Delivery terms
Applicable terms of delivery shall be FCA Hong Kong International
Airport, INCOTERMS 2000, unless otherwise agreed in P.O.
12. PACKING AND LABELLING
12.1 The Products shall be packed and marked separately as set out in the
Specifications and the applicable Purchase Order. The Purchase Order
and product numbers shall be set out in the shipping documents.
13. QUALITY
13.1 All Product Supply shall be handled in accordance with the
standards/requirements set out in the Specification and in Enclosure
2.3
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9 September 2003
14. PURCHASE OF COMPONENTS
14.1 The Supplier shall purchase materials at contracted prices under
existing Sony Ericsson Agreements for supply of materials as set out in
Enclosure 14.1.
14.2 Sony Ericsson liability for components as related to volume forecast as
set out in Enclosure 14.2
14.3 The Supplier is responsible for the purchase and supply of all
components.
15. TERM OF AGREEMENT AND TERMINATION
15.1 This Agreement shall come into force upon its execution by duly
authorised representatives of both Parties and shall remain in effect
until three (3) months have passed following written notice of
termination by either Party, unless terminated on an earlier date as
set out in Section 29 "TERM OF AGREEMENT AND TERMINATION" in the GSPA.
IN WITNESS WHEREOF, each of the parties hereto has caused this Agreement to be
executed, in duplicate, each party taking one copy.
Date:9th September 2003 Date; 9th September 2003
Place: Hong Kong Place: Xxxx
XXX TAI ELECTRONIC SONY ERICSSON MOBILE
(SHENZEN) COMPANY Ltd COMMUNICATIONS AB
/s/ Xxxxxx xxxx /s/ Mats Led
------------------------ -----------------
XXXXXX XXXX MATS LED
Enclosure 10.1
Prices and Price model.
PRICE MODEL.
See enclosed Excel sheet, (Enclosure 10.1 A) to be applied as price
model.
PRICE.
The following price of the Product is agreed.
All prices in USD.
Price of 7,37
Prices shall be updated during the development work.
NRE cost: 20000 USD, travel expenses.
Tooling cost: 35000 USD for a production capacity of 150k units per
month (P0# 70148596 received)
Test equipment: 30000 USD.
Test equipment cost and NRE shall be amortized over a fixed amount of
units of 20k, to be defined and added onto the product price.
Enclosure 10.1A
Price model
1 MATERIAL COST
Xxxx of material
---------------
Material scrap 1 %
---------------
Material burden 1 .5 %
---------------
TOTAL MATERIAL COST
===============
2 LABOUR COST
PROCESS RATE (USD) LABOUR TIME
SMT 0.003/chip
---------------
Final assy. 4.24/hour
---------------
Testing 4.24/hour
---------------
Packaging 4.24/hour
---------------
TOTAL LABOUR COST
===============
3 FREIGHT COST
According to enclosure
4 FINANCIAL COST
1.5% of xxxx of material for 60 days credit
===============
0.75% of xxxx of material for 30 days
sea shipment. IF APPLICABLE
===============
0.375% of xxxx of material for 15 days
sea shipment. IF APPLICABLE
===============
5 PROFIT
4.3% of xxxx of material
===============
TOTAL UNIT PRICE
===============
TOOLING COST (FOR INFORMATION ONLY)
===============
Enclosure 14.1
Purchase of components.
COMPONENTS BOUGHT UNDER SONY ERICSSON AGREEMENTS.
Supplier may call off volumes of below listed components from
applicable Sony Ericsson agreements. Any such components shall only be
used for manufacturing of the Product. Supplier may issue a forecast of
the estimated volume to the selected component supplier to secure
delivery.
Supplier is solely responsible for the supply chain
1. Icon,
2. System connector,
Sony Ericsson will advise about agreements with component supplier and
valid prices during the project.
Enclosure 14.2,
Forecast, Flexibility & Liability model
Sony Ericsson's forecast and production planning process, named Seihan
Process is based upon constraint planning, i.e. the planning process
takes all constraints regarding the product, components, manufacturing
capacity, and other thereto related matters of Sony Ericsson entire
supply chain. The Seihan Process operates with a six months planning
period.
This Forecast, Flexibility & Liability model, the Model, defines the
responsibilities and undertaking of both Parties with regard to
forecasts, flexibility and lead-times.
The components covered by this Model shall solely be used for the
manufacturing of the Product. See enclosed Excel sheet, Enclosure
14.2a, defining the Model. Components included in the Model shall have
a significant impact upon the Product price and the applicable delivery
lead-time. All such components shall be listed in the Model. Volume
figures, component lead-times and prices snail be updated on a monthly
base by Sony Ericsson, (Seller to provide input for Prices and
lead-times)
Sony Ericsson shall issue a new Model the last business day of each
month, with updated forecast volumes, prices and lead-times. Prices and
lead times shall be agreed with Supplier prior to such update.
If the forecast proposal during the ramp-up period, (normally three
months from the RTL-date) is higher than the latest agreed flexibility
limits or production capacity Sony Ericsson may issue a forecast
proposal to Supplier in order for Supplier to confirm if the
availability of the necessary production capacity. This forecast
proposal shall be communicated in due time before the Model shall be
issued at the end of each month.
Supplier undertakes that for all components listed in the Model
actively work for to reduce the lead-time for each component in order
to increase the flexibility of production process and to reduce its own
financial exposure. The agreed objective, which is a non binding
commitment of the Supplier, shall be to reduce lead-time by 20%
annually. Purchase orders for component shall be placed at component
suppliers on weekly bases to enable high flexibility.
If Supplier does not receive the purchase orders in the quantity amount
as stated in the forecast or any part thereof for any week before the
agreed lead-time of that week, the Supplier shall withhold purchase of
components for that week and for subsequent weeks in excess of the
purchase orders received.
Supplier shall always have an obligation to reallocate any components
in stock and on order which becomes in excess due to changes in
forecasted volumes.
The Supplier shall within three days from receipt of a new Model review
and confirm the acceptance of the same. If the new Model is not
acceptable to the Supplier, the Supplier may reject the new Model and
the following shall apply;
Enclosure 14.2,
Forecast, Flexibility & Liability model
- Supplier shall use its best commercial effort to reallocate,
divest and cancel any excess component in order to follow the
new forecast provided by Sony Ericsson. Sony Ericsson shall
assume liability for any components covered by the latest
agreed Model and the component price is calculated on the
agreed unit price for the components, as listed in the Model.
Enclosure 14.2b is an illustration of the application of the
model.
- In the event the new forecast issued by Sony Ericsson may not
use up the components on hand and on order, Supplier
undertakes to use his best commercial effort to reallocate,
divest and cancel any excess component. Any remaining
components which are covered by the last agreed Model shall be
kept in stock free of charge for the first three months
following the rejection of the new Model. After this three
months period Supplier may agree to the liability undertaking
by Sony Ericsson as set out in the last agreed Model and
invoice and deliver any such remaining excess components as
agreed with Sony Ericsson.
- Sony Ericsson shall assume liability for the scrapping of
excess components covered by the Model provided that Sony
Ericsson has given the Supplier a written approval to scrap.
Sony Ericsson maximum liability shall always be limited to the
direct cost for the components; taking into consideration the
applicable lead-times and the fore cast volume below the
flexibility limit all as defined in the Model.
- Sony Ericsson shall always have the option to have any excess
components assembled into finished Products at agreed price
instead of scrapping the components.
Any significant delay in delivery of the Products, caused by Supplier
shall fully relieve Sony Ericsson from its liability under this
Enclosure 14.2.
Any undertaking by Sony Ericsson and/or Supplier as defined herein
shall be valid until for 30th June 2004. Supplier may invoice Sony
Ericsson for any components left.and covered by the last agreed Model
at 30th June 2004 within 30 days thereafter and Sony Ericsson shall
settle any such invoice within 30days from the date of invoice. The
Supplier shall deliver the concerned components as advised by Sony
Ericsson, FCA "HK/SZ" acc. to INCO-terms 2000.
Enclosure 14.2A
Forecast, Flexibility and Liability Model
DEFINITION OF FORECAST FLEXIBILITY & LIABILITY, THE MODEL.
FORE CAST & LIABILITY Fill out yellow and Blue fields
Part no: DPY 901 410 Yellow fields to be updated monthly
Description Xxxxx Xxxxx fields calculated by formula
Project Alex
Date of "The Model" 19th August 2003 Week Six month rolling F/C for information only
Forecast dated 19th August 2003 34 Month Sept Oct Nov Dec Jan Feb
Leadtime, Call off. Weeks 6 Week 00-00 00-00 00-00 00-00 1-4 5-8
Leadtime, w/o f.c. Weeks 10 Volume 128500 147500 104000 62000 62000 77000
Product Price 7,37
Week 1 2 3 4 5 6 7 8 9 10 11 12 13
Accumulated BOM cost
per week, (USD) 0 0 0 0 0 0 1,583 1,473 1,322 1,322 0 0 0
% liability per Week 0% 0% 0% 0% 0% 0% 100% 90% 40% 0% 0% 0% 0%
Week 35 36 37 38 39 40 41 42 43 44 45 46 47
Average forecast per week 37 500 32 125 32 125 32 125 32 125 29 500 29 500 (?) (?) 29 500 26 000 26 000 26 000
Maximum liability per
week, (USD) 0 0 0 0 0 0 (?) 39 108 15 600 0 0 0 0
Total liability, (USD) 101 406
Week 14 15 16
Accumulated BOM cost
per week, (USD) 0 0 0
% liability per Week 0% 0% 0%
Week 48 1 2
Average forecast per week 26 000 26 000 26 000
Maximum liability per
week, (USD) 0 0 0
Total liability, (USD)
FLEXIBILITY
Presently agreed/Installed max. production capacity 37 500 per week
Leadtime to Increase capacity with 50% 12 Weeks
Leadtime to Increase capacity with 100% 12 Weeks
Maximum flexibility within Installed capacity to
increase production per month, upward flexibility. 25 (?) volume
month 1
PRICES AND LEADTIME OF SELECTED COMPONENTS.
Delta price.
Leadtime Weeks 8, 6-
Component Part no Weeks Price. USD 8, 5-8
--------- ------- ----- ---------- ------
Motorola 8 Bit CPU
MC68HC908QT4CDW 0107-
SOIC8 T4CDWNVO 8 0.8
WHITE LED DRIVER
MAX1561ETA-T QFN-8 0107-
MAXIM 61ETAOV1 8 0.47
SCHOTTKY DIODE 0108-
CUSO2 TOSHIBA CUS02041 8 0.052 1,322
INDUCTOR 0401-
LOH32CN220K23 22325191 6 0.044
PCB FR4 DOUBLE-SIDES 0610-
28.4X13.7X1MMX20 gold RA2GF201
plating Halogen free XO 6 0.069
PCB FR4 single-SIDES 0601-
20X11X0.5MM Gold RA1DF202
Plating Halogen free XO 6 0.038 1,473
TACH SW SOH-113HST 1804- 5 0.11 1,583
Model based upon two
weeks production
leaqdtime in addition to
each component leadtime
Scenario description Enclosure 1 4.2B
Forecast, Flexibility and Liability Model
DEFINITION OF FORECAST FLEXIBILITY & LIABILITY, THE MODEL.
FORE CAST & LIABILITY Fill out yellow and Blue fields
Part no: DPY 901 410 Yellow fields to be updated monthly
Description Xxxxx Xxxxx fields calculated by formula
Project Alex
Date of "The Model" 19th Sep 2003 Week Six month rolling F/C for information only
Forecast dated 19th Sep 2003 38 Month Sept Oct Nov Dec Jan Feb
Leadtime, Call off. Weeks 6 Week 00-00 00-00 00-00 00-00 1-4 5-8
Leadtime, w/o f.c. Weeks 10 Volume 128500 147500 104000 62000 62000 62000
Product Price 7,37
Week 1 2 3 4 5 6 7 8 9 10 11 12 13
Accumulated BOM cost
per week, (USD) 0 0 0 0 0 0 1,583 1,473 1,322 1,322 0 0 0
% liability per Week 0% 0% 0% 0% 0% 0% 100% 90% 40% 0% 0% 0% 0%
Week 39 40 41 42 43 44 45 46 47 48 49 50 51
Average forecast per week 32 125 29 500 29 500 29 500 29 500 29 500 26 000 26 000 26 000 26 000 15 500 15 500 15 500
Maximum liability per
week, (USD) 0 0 0 0 0 0 41 158 34 468 13 749 0 0 0 0
Total liability, (USD) 69 375
Week 14 15 16
Accumulated BOM cost
per week, (USD) 0 0 0
% liability per Week 0% 0% 0%
Week 52 1 2
Average forecast per week 15 500 15 500 15 500
Maximum liability per
week, (USD) 0 0 0
Total liability, (USD)
FLEXIBILITY
Presently agreed/Installed max. production capacity 37 500 per week
Leadtime to Increase capacity with 50% 12 Weeks
Leadtime to Increase capacity with 100% 12 Weeks
Maximum flexibility within Installed capacity to
increase production per month, upward flexibility. 25 % of volume
month 1
PRICES AND LEADTIME OF SELECTED COMPONENTS.
Delta price.
Leadtime Weeks 8, 6-
Component Part no Weeks Price, USD 8, 5-8
--------- ------- ----- ---------- ------
Motorola 8 Bit CPU
MC68HC908QT4CDW 0107-
SOIC8 T4CDWNVO 8 0.8
WHITE LED DRIVER
MAX1561ETA-T QFN-8 0107-
MAXIM 61ETAOV1 8 0.47
SCHOTTKY DIODE 0108-
CUSO2 TOSHIBA CUS02041 8 0.052 1,322
INDUCTOR 0401-
LOH32CN220K23 22325191 6 0.044
PCB FR4 DOUBLE-SIDES 0610-
28.4X13.7X1MMX20 gold RA2GF201
plating Halogen free XO 6 0.069
PCB FR4 single-SIDES 0601-
20X11X0.5MM Gold RA1DF202
Plating Halogen free XO 6 0.038 1,473
TACH SW SOH-113HST 1804- 5 0.11 1,583
Model based upon two
weeks production
leaqdtime in addition to
each component leadtime
REMARKS :
THIS NEW MODEL IS ACCEPTABLE TO NAMTAI SINCE THIS LATEST FORECAST GO IN-LINE
WITH THE PREVIOUS AGREED MODEL.
Scenario description Enclosure 14.2 B
Forecast, Flexibility and Liability Model
DEFINITION OF FORECAST FLEXIBILITY & LIABILITY, THE MODEL.
FORE CAST & LIABILITY Fill out yellow and Blue fields
Part no: DPY 901 410 Yellow fields to be updated monthly
Description Xxxxx Xxxxx fields calculated by formula
Project Alex
Date of "The Model" 19th Sep 2003 Week Six month rolling F/CV for information only
Forecast dated 19th Sep 2003 38 Month Sept Oct Nov Dec Jan Feb
Leadtime, Call off. Weeks 6 Week 00-00 00-00 00-00 00-00 1-4 5-8
Leadtime, w/o f.c. Weeks 10 Volume 128500 147500 62000 62000 62000 62000
Product Price 7,37
Week 1 2 3 4 5 6 7 8 9 10 11
Accumulated BOM cost
per week, (USD) 0 0 0 0 0 0 1,583 1,583 1,473 1,473 1,473 1,322 1,322
% liability per Week 0% 0% 0% 0% 0% 0% 100% 100% 90% 90% 90% 40% 40 %
Week 39 40 41 42 43 44 45 46 47 48 49
Average forecast per week 32 125 29 500 29 500 29 500 29 500 29 500 15 500 10 500 5 500 15 500 5 500 10 500 15 500
Maximum liability per
week, (USD) 0 0 0 0 0 0 24 537 16 622 6 629 20 548 7 291 5 552 8 196
Total liability, (USD) 89 375
Week 12 13 14 15 16
Accumulated BOM cost
per week, (USD) 0 0 0 0 0
% liability per Week 0% 0% 0% 0% 0%
Week 50 51 52 1 2
Average forecast per week 15 500 15 500 15 500 15 500 15 500
Maximum liability per
week, (USD) 0 0 0 0 0
Total liability, (USD)
FLEXIBILITY
Presently agreed/Installed max. production capacity 37 500 per week
Leadtime to Increase capacity with 50% 12 Weeks
Leadtime to Increase capacity with 100% 12 Weeks
Maximum flexibility within Installed capacity to
increase production per month, upward flexibility. 25 % of volume
month 1
PRICES AND LEADTIME OF SELECTED COMPONENTS.
Delta price.
Leadtime Week 8, 6-
Component Part no Weeks Price. USD 8, 5-8
--------- ------- ----- ---------- ------
Motorola 8 Bit CPU
MC68HC908OT4CDW 0107-
SOIC8 T4CDWNVO 8 0.8
WHITE LED DRIVER
MAX1561ETA-T OFN-8 0107-
MAXIM 61ETAOV1 8 0.47
SCHOTTKY DIODE 0108-
CUSO2 TOSHIBA CUS02041 8 0.052 1,322
INDUCTOR 0401-
LOH32CN220K23 22325191 6 0.044
PCB FR4 DOUBLE-SIDES 0610-
28.4X13.7X1MMX20 gold RA2GF201
plating Halogen free xo 6 0.069
PCB FR4 single-SIDES 0601-
20X11X0.5MM Gold RA1DF202
Plating Halogen free xo 6 0.038 1,473
TACH SW SOH-113HST 1804- 5 0.11 1,583
Model based upon two
weeks production
leaqdtime in addition to
each component leadtime
REMARKS :
1. THE NEW MODEL IS NOT ACCEPTABLE TO NAMTAI WITH THE ASSUMPTION THAT THE
WEEKLY OUTPUT IS DROPPED FROM 26K TO 15.5K.
2. NAMTAI SHALL USE ITS BEST COMMERCIAL EFFORT TO REALLOCATE, DIVEST AND
CANCEL ANY EXCESS COMPONENTS IN ORDER TO FOLLOW THE NEW FORECAST PROVIDED
BY SONY ERICSSON.
3. SONY ERICSSON SHALL ASSUME LIABILITY FOR ANY COMPONENTS COVERED BY THE
LATEST AGREED MODEL AND THE COMPONENT PRICE IS CALCULATED ON THE AGREED
UNIT PRICE AS LISTED IN THE LAST AGREED MODEL.
