Electronic components, nec Sample Contracts

AGREEMENT AMENDMENT
Nam Tai Electronics Inc • March 10th, 2004 • Electronic components, nec
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EXHIBIT 10.1 CREDIT AGREEMENT Dated as of January 23, 2001
Credit Agreement • January 30th, 2001 • Artesyn Technologies Inc • Electronic components, nec • New York
AMONG
Stock Purchase Agreement • April 29th, 2004 • Duraswitch Industries Inc • Electronic components, nec • Arizona
LEASE
Lease Agreement • December 11th, 2006 • Elecsys Corp • Electronic components, nec
WITNESSETH:
Employment Agreement • August 16th, 2004 • M Wave Inc • Electronic components, nec • Illinois
WARRANT TO PURCHASE SHARES OF COMMON STOCK OF CONDUCTUS, INC. A DELAWARE CORPORATION
Conductus Inc • November 14th, 2000 • Electronic components, nec • California
and
Agreement • March 15th, 2005 • Nam Tai Electronics Inc • Electronic components, nec • Hong Kong
ARTICLE I INTERPRETATION
Escrow Agreement • January 11th, 2002 • Tech Laboratories Inc • Electronic components, nec • New York
COMMON STOCK PURCHASE WARRANT Crown Electrokinetics Corp.
Crown Electrokinetics Corp. • January 4th, 2023 • Electronic components, nec

THIS COMMON STOCK PURCHASE WARRANT (the “Warrant”) certifies that, for value received, ________________ or its assigns (the “Holder”) is entitled, upon the terms and subject to the limitations on exercise and the conditions hereinafter set forth, at any time on or after the date (the “Initial Exercise Date”) and on or prior to 5:00 p.m. (New York City time) on January 3, 2028 (the “Termination Date”) but not thereafter, to subscribe for and purchase from Crown Electrokinetics Corp., a Delaware corporation (the “Company”), up to ______ shares (as subject to adjustment hereunder, the “Warrant Shares”) of Common Stock. The purchase price of one share of Common Stock under this Warrant shall be equal to the Exercise Price, as defined in Section 2(b).

ARTICLE 1 GRANT OF PROXY; VOTING AGREEMENT
Voting Agreement • February 3rd, 2006 • Artesyn Technologies Inc • Electronic components, nec • New York
FIFTH AMENDMENT
Loan and Security Agreement • January 23rd, 2007 • Del Global Technologies Corp • Electronic components, nec • New York
FIRST AMENDMENT TO FIRST AMENDED AND RESTATED CREDIT AGREEMENT
Credit Agreement • December 5th, 2000 • Manufacturers Services LTD • Electronic components, nec • New York
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SECURITIES PURCHASE AGREEMENT
Securities Purchase Agreement • January 4th, 2023 • Crown Electrokinetics Corp. • Electronic components, nec • New York

This Securities Purchase Agreement (this “Agreement”) is dated as of January 3, 2023, between Crown Electrokinetics Corp., a Delaware corporation (the “Company”), and each purchaser identified on the signature pages hereto (each, including its successors and assigns, a “Purchaser” and collectively, the “Purchasers”).

EXHIBIT 2.1
Agreement and Plan of Merger • September 12th, 2002 • Telaxis Communications Corp • Electronic components, nec • Massachusetts
SUPPLEMENTAL INDENTURE
Supplemental Indenture • January 20th, 1998 • Dardel Technologies E U R L • Electronic components, nec • New York
INNOVEX, INC.
Stock Option Agreement • December 1st, 2008 • Innovex Inc • Electronic components, nec • Minnesota
AGREEMENT
Loan Agreement • January 24th, 2001 • JPM Co • Electronic components, nec • Pennsylvania
AGREEMENT --------- Agreement dated as of July 1, 2002, by and among Tech Laboratories, Inc., a New Jersey corporation (the "Company") and Celeste Trust Reg., Esquire Trade & Finance, Inc., and The Endeavour Capital Investment Fund, S.A. (the...
Agreement • July 23rd, 2002 • Tech Laboratories Inc • Electronic components, nec

Agreement dated as of July 1, 2002, by and among Tech Laboratories, Inc., a New Jersey corporation (the "Company") and Celeste Trust Reg., Esquire Trade & Finance, Inc., and The Endeavour Capital Investment Fund, S.A. (the "Holders").

Exhibit 1.1 Telaxis Communications Corporation Common Stock UNDERWRITING AGREEMENT ----------------------
Underwriting Agreement • January 11th, 2000 • Telaxis Communications Corp • Electronic components, nec • New York
AMENDMENT NO. 1 TO CREDIT AGREEMENT
Credit Agreement • March 31st, 2003 • Manufacturers Services LTD • Electronic components, nec • New York
Between
Rights Agreement • September 14th, 2001 • Del Global Technologies Corp • Electronic components, nec • New York
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