EXHIBIT 10.85
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Novation Agreement
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Date:
Parties: Microelectronic Packaging Inc.
0000 Xxxxx Xxxxx
Xxx Xxxxx, XX 00000
(hereinafter "MPI")
Innoventure (S) Pte Ltd
000 Xxx Xxxxxx Xxxx #00-00
Xxxxxxxxx Xxxxx
Xxxxxxxxx
(hereinafter "Innoventure")
This agreement is supplemental an agreement between the same parties hereto
dated 29 July 1993 (hereinafter "the Principal Agreement").
The parties hereto desire the Principal Agreement varied in the manner
following:
Operative provisions
1. The Subcontracting Manufacturing Agreement provided for in clause 5 of the
Principal Agreement to be entered into between themselves now be entered into
between Microelectronic Packaging (S) Pte Ltd of 0000 Xxxxx Xxxxx Xxxxxxx
#00-00 Xxxxxxxxx 0315 (hereinafter "MPS") in place of MPI and PT Ironhill of
Komplex Kebon Jeruk Baru, Blok A Xx. 00-00, Xxxxxxx Xxxxx, Xxxxxxxxx
(hereinafter "PTI") in place of Innoventure.
2. Each of the parties hereto releases the other from all obligations in regard
to the supply and purchase of the goods referred to in the Principal
Agreement and all other obligations thereunder insofar as these obligations
are or will now be assumed by MPS and PTI under the Subcontracting
Manufacturing
Agreement.
3. The Equipment Lease provided for in clause 4 of the Principal Agreement be
dispensed with.
In Witness Whereof the duly authorized officers of the parties have set their
hands the day of 1995.
Signatures:
/s/ ^^ /s/ ^^
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Microelectronic Packaging Inc. Innoventure (S) Pte Ltd
