EXHIBIT 10.93 AMENDED AND RESTATED -------------------- CONSULTING SERVICES AGREEMENT -----------------------------Consulting Services Agreement • April 15th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
EXHIBIT 10.89 AMENDED LOAN AND SECURITY AGREEMENT ----------------------------------- This Agreement ("Amended Agreement"), effective January 2, 1997, ("Effective Date") is by and between NS Electronics Bangkok (1993) Ltd. ("NSEB") and Microelectronic...Loan and Security Agreement • April 15th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
EXHIBIT 10.90 SECOND SECURED PROMISSORY NOTE ------------------------------Secured Promissory Note • April 15th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
WHEREAS, NSEB and MPI have mutually agreed to re-negotiate the terms and conditions of the aforementioned Agreement and Note;
EXHIBIT 10.85 ================== Novation Agreement Date: Parties: Microelectronic Packaging Inc. 9350 Trade Place San Diego, CA 92128 (hereinafter "MPI") Innoventure (S) Pte Ltd 133 New Bridge Road #17-08 Chinatown Point Singapore (hereinafter...Novation Agreement • April 15th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
EXHIBIT 10.91 ADDENDUM TWO ------------ AMENDED LOAN AND SECURITY AGREEMENT ----------------------------------- WHEREAS, TEXAS INSTRUMENTS SINGAPORE (PTE) LIMITED ("IT") and MICROELECTRONIC PACKAGING (S) PTE LTD ("MPS") have executed a Loan and...Loan and Security Agreement • April 15th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
This agreement is pursuant to an agreement between Microelectronic Packaging Inc and Innoventure (S) Pte Ltd dated 29 July 1993 (hereinafter "the Principal ------------ Agreement") and a Novation Agreement between the same parties dated and sets out...Subcontract Manufacturing Agreement • April 15th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
EXHIBIT 10.87 SUBCONTRACT MANUFACTURING AGREEMENT ----------------------------------- This is an agreement made on the 29th day of July in the year 1993 between Microelectronic Packaging Inc. (herein referred to as MPI) with its corporate office at...Subcontract Manufacturing Agreement • April 15th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
EXHIBIT 10.88 SUBCONTRACT MANUFACTURING AGREEMENT ----------------------------------- This is an agreement made on the 29th day of July in the year 1993 between Microelectronic Packaging Inc. (herein referred to as MPI) with its corporate office at...Subcontract Manufacturing Agreement • April 15th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
