JOINT FILING AGREEMENT
THIS JOINT FILING AGREEMENT is entered into as of May 8, 2017, by and between the parties hereto. The undersigned hereby agree that the Statement on Schedule 13D with respect to the common stock, par value US$0.004 per share, of Semiconductor Manufacturing International Corporation and any amendment thereto signed by each of the undersigned shall be filed on behalf of each undersigned pursuant to and in accordance with the provisions of Rule 13d-1(k)(1) under the Securities Exchange Act of 1934, as amended.
|
Date: May 8, 0000
|
Xxxxx Integrated Circuit Industry Investment Fund Co., Ltd. | ||||
|
|
By:
|
/s/ Wang Zhanfu | |||
| Name: | Wang Zhanfu | ||||
| Title: | Authorized Representative | ||||
|
Xinxin (Hongkong) Capital Co., Limited
|
|||||
| By: | /s/ Wu Fengshuo | ||||
| Name: | Wu Fengshuo | ||||
| Title: | Authorized Representative | ||||
