0000947871-17-000354 Sample Contracts

JOINT FILING AGREEMENT
Joint Filing Agreement • May 9th, 2017 • Xinxin (Hong Kong) Capital Co., LTD • Semiconductors & related devices

THIS JOINT FILING AGREEMENT is entered into as of May 8, 2017, by and between the parties hereto. The undersigned hereby agree that the Statement on Schedule 13D with respect to the common stock, par value US$0.004 per share, of Semiconductor Manufacturing International Corporation and any amendment thereto signed by each of the undersigned shall be filed on behalf of each undersigned pursuant to and in accordance with the provisions of Rule 13d-1(k)(1) under the Securities Exchange Act of 1934, as amended.

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