Common Contracts
2 similar Research and Development Engineering Services Agreement contracts by Micron Technology Inc
EX-10.140 5 a13-17587_1ex10d140.htm EX-10.140 [Translation] [*] Certain information in this document has been omitted and filed separately with the Securities and Exchange Commission. Confidential treatment has been requested with respect to the...Research and Development Engineering Services Agreement • May 5th, 2020
This Research and Development Engineering Services Agreement (this “Agreement”) is entered into as of July 31, 2013 by and between Micron Technology, Inc., a Delaware corporation, with its principal place of business at 8000 S. Federal Way, Boise, Idaho 83707 (“Recipient”) and Elpida Memory, Inc., a corporation organized and operating under the laws of Japan with its principal place of business at 2-1, Yaesu 2-chome, Chuo-ku, Tokyo, 104-0028, Japan (“Provider”). Each of Recipient and Provider may be referred to individually as a “Party” and collectively as the “Parties”.
RESEARCH AND DEVELOPMENT ENGINEERING SERVICES AGREEMENTResearch and Development Engineering Services Agreement • August 6th, 2013 • Micron Technology Inc • Semiconductors & related devices
This Research and Development Engineering Services Agreement (this “Agreement”) is entered into as of July 31, 2013 by and between Micron Technology, Inc., a Delaware corporation, with its principal place of business at 8000 S. Federal Way, Boise, Idaho 83707 (“Recipient”) and Elpida Memory, Inc., a corporation organized and operating under the laws of Japan with its principal place of business at 2-1, Yaesu 2-chome, Chuo-ku, Tokyo, 104-0028, Japan (“Provider”). Each of Recipient and Provider may be referred to individually as a “Party” and collectively as the “Parties”.
