RECITALSVoting Agreement • April 4th, 2001 • Micron Technology Inc • Semiconductors & related devices • Delaware
TABLE OF CONTENTS Page ---- ARTICLE I - THE OFFER..........................................................1 1.1 The Offer...........................................................1 1.2 Company...Agreement and Plan of Merger • June 20th, 1997 • Micron Technology Inc • Semiconductors & related devices • Delaware
EXHIBIT 2 AGREEMENT AND PLAN OF MERGERAgreement and Plan of Merger • April 4th, 2001 • Micron Technology Inc • Semiconductors & related devices • Delaware
AGREEMENT ---------Stock Option Agreement • June 20th, 1997 • Micron Technology Inc • Semiconductors & related devices • Delaware
EXHIBIT 10.122 SECOND AMENDMENT TO -------------------- FIRST AMENDED AND RESTATED REVOLVING CREDIT AGREEMENT -----------------------------------------------------Revolving Credit Agreement • April 3rd, 1998 • Micron Technology Inc • Semiconductors & related devices • California
EXHIBIT 10.135 SECOND AMENDED AND RESTATED REVOLVING CREDIT AGREEMENT Dated as of September 1, 1998Security Agreement • November 2nd, 1998 • Micron Technology Inc • Semiconductors & related devices • California
Date:______________________ __________________________________________ Officer ATTACHMENT 1 TO "AGREEMENT AND AMENDMENT TO SEVERANCE AGREEMENT" BY AND BETWEEN MICRON TECHNOLOGY, INC. AND /NAME/Severance Agreement • March 25th, 1997 • Micron Technology Inc • Semiconductors & related devices • Idaho
and Norwest Bank Minnesota, National Association TrusteeMicron Technology Inc • October 16th, 1998 • Semiconductors & related devices
ARTICLE 1. GRANT OF WARRANT AND EXERCISE PRICEMicron Technology Inc • May 28th, 1999 • Semiconductors & related devices • Delaware
EXHIBIT 10.116 MICRON TECHNOLOGY, INC. REGISTRATION RIGHTS AGREEMENT Dated as of June 28, 1996 TABLE OF CONTENTS -----------------Registration Rights Agreement • October 4th, 1996 • Micron Technology Inc • Semiconductors & related devices • Idaho
EXHIBIT 10.126 THIS NOTE HAS NOT BEEN REGISTERED UNDER THE SECURITIES ACT OF 1933, AS AMENDED (THE "SECURITIES ACT"), OR THE SECURITIES LAWS OF ANY STATE OR OTHER JURISDICTION. NEITHER THIS NOTE NOR ANY INTEREST OR PARTICIPATION HEREIN MAY BE OFFERED,...Micron Technology Inc • October 14th, 1998 • Semiconductors & related devices • New York
VOTING AGREEMENTVoting Agreement • July 29th, 1998 • Micron Technology Inc • Semiconductors & related devices • California
TOMicron Technology Inc • June 3rd, 1997 • Semiconductors & related devices • New York
EXHIBIT 1 ACQUISITION AGREEMENT*Acquisition Agreement • May 28th, 1999 • Micron Technology Inc • Semiconductors & related devices • Delaware
and Norwest Bank Minnesota, National Association TrusteeMicron Technology Inc • July 3rd, 1997 • Semiconductors & related devices
CREDIT AGREEMENT among MICRON TECHNOLOGY, INC., as Borrower and THE LENDERS PARTY HERETO, and JPMORGAN CHASE BANK, N.A., as Administrative Agent and as Collateral Agent Dated as of July 3, 2018 JPMORGAN CHASE BANK, N.A. and HSBC SECURITIES (USA) INC....Credit Agreement • October 15th, 2018 • Micron Technology Inc • Semiconductors & related devices • New York
THIS CREDIT AGREEMENT, dated as of July 3, 2018, among MICRON TECHNOLOGY, INC., a Delaware corporation (the “Borrower”), JPMORGAN CHASE BANK, N.A. (“JPMorgan”), as administrative agent (in such capacity and including any successors in such capacity, the “Administrative Agent” or the “Agent”) and as collateral agent (in such capacity and including any successors in such capacity, the “Collateral Agent”), the other agents party hereto and each of the financial institutions from time to time party hereto (collectively, the “Lenders”).
TOMicron Technology Inc • June 3rd, 1997 • Semiconductors & related devices • New York
EXHIBIT 1.2 PRICING AGREEMENTPricing Agreement • July 3rd, 1997 • Micron Technology Inc • Semiconductors & related devices
Exhibit 10.140 PURCHASE AGREEMENT ------------------ This Purchase Agreement (the "Agreement") is made, as of October 1, 1998, by and among Micron Technology, Inc., a Delaware, U.S.A. corporation, with its principal place of business at 8000 South...Purchase Agreement • January 13th, 1999 • Micron Technology Inc • Semiconductors & related devices • Idaho
ContractCredit Agreement • December 8th, 2014 • Micron Technology Inc • Semiconductors & related devices • New York
EXHIBIT 10.125 MICRON TECHNOLOGY, INC. REGISTRATION RIGHTS AGREEMENT Dated as of July 20, 1998 REGISTRATION RIGHTS AGREEMENT REGISTRATION RIGHTS AGREEMENT, dated as of July 20, 1998 among Micron Technology, Inc., a Delaware corporation ("Micron" or...Registration Rights Agreement • July 20th, 1998 • Micron Technology Inc • Semiconductors & related devices • Idaho
MICRON TECHNOLOGY, INC. 1.625% CONVERTIBLE SENIOR NOTES DUE 2033 2.125% CONVERTIBLE SENIOR NOTES DUE 2033 PURCHASE AGREEMENTPurchase Agreement • February 12th, 2013 • Micron Technology Inc • Semiconductors & related devices • New York
The undersigned understands that Morgan Stanley & Co. LLC (“Morgan Stanley”) proposes to enter into a Purchase Agreement (the “Purchase Agreement”) with Micron Technology, Inc., a Delaware corporation (the “Company”), providing for the offering (the “Offering”) by the several initial purchasers, including Morgan Stanley (the “Initial Purchasers”), of up to approximately $600,000,000 aggregate principal amount of Convertible Senior Notes (the “Securities”). The Securities will be convertible into shares of common stock, par value $0.10 per share, of the Company (the “Common Stock”).
INDENTURE Dated as of April 30, 2015 Between MICRON TECHNOLOGY, INC. and U.S. BANK NATIONAL ASSOCIATION, as Trustee 5.250% SENIOR NOTES DUE 2024Indenture • April 30th, 2015 • Micron Technology Inc • Semiconductors & related devices • New York
INDENTURE, dated as of April 30, 2015 between Micron Technology, Inc., a Delaware corporation, and U.S. Bank National Association, a national banking association, as Trustee.
EXHIBIT 10.123 THIRD AMENDMENT TO FIRST AMENDED AND RESTATED --------------------------------------------- REVOLVING CREDIT AGREEMENT --------------------------Credit Agreement • July 13th, 1998 • Micron Technology Inc • Semiconductors & related devices • California
TOMicron Technology Inc • July 3rd, 1997 • Semiconductors & related devices • New York
AMENDMENT NO. 2 TO TERM LOAN CREDIT AGREEMENTTerm Loan Credit Agreement • June 29th, 2023 • Micron Technology Inc • Semiconductors & related devices • New York
AMENDMENT NO. 2 TO TERM LOAN CREDIT AGREEMENT, dated as of June 7, 2023 (this “Amendment”) by Wells Fargo Bank, National Association, as administrative agent under the Existing Term Loan Credit Agreement (as defined below) (in such capacity and including any successors in such capacity, the “Administrative Agent”).
AGREEMENT AND PLAN OF MERGER BY AND AMONG MICRON TECHNOLOGY, INC. MARCH 2006 MERGER CORP. AND LEXAR MEDIA, INC.Agreement and Plan of Merger • March 10th, 2006 • Micron Technology Inc • Semiconductors & related devices • Delaware
This AGREEMENT AND PLAN OF MERGER (this “Agreement”) is made and entered into as of March 8, 2006, by and among Micron Technology, Inc., a Delaware corporation (“Parent”), March 2006 Merger Corp., a Delaware corporation and direct wholly owned subsidiary of Parent (“Merger Sub”), and Lexar Media, Inc., a Delaware corporation (the “Company”).
MICRON TECHNOLOGY, INC. as Issuer and U.S. BANK NATIONAL ASSOCIATION as TrusteeIndenture • November 18th, 2013 • Micron Technology Inc • Semiconductors & related devices • New York
INDENTURE dated as of November 12, 2013 between Micron Technology, Inc., a Delaware corporation (the “Company”), and U.S. Bank National Association, a national banking association, as Trustee.
EXHIBIT 2 INVESTOR RIGHTS AGREEMENTInvestor Rights Agreement • May 28th, 1999 • Micron Technology Inc • Semiconductors & related devices • California
toMicron Technology Inc • April 11th, 2000 • Semiconductors & related devices • New York
RECITALSRegistration Rights Agreement • April 4th, 2001 • Micron Technology Inc • Semiconductors & related devices • Delaware
AMENDMENT NO. 2 TO CREDIT AGREEMENTCredit Agreement • June 29th, 2023 • Micron Technology Inc • Semiconductors & related devices • New York
AMENDMENT NO. 2 TO CREDIT AGREEMENT, dated as of June 7, 2023 (this “Amendment”) by HSBC Bank USA, National Association, as administrative agent under the Existing Credit Agreement (as defined below) (in such capacity and including any successors in such capacity, the “Administrative Agent”).
TECHNOLOGY TRANSFER AND LICENSE OPTION AGREEMENTTechnology Transfer and License Option Agreement • September 8th, 2016 • Micron Technology Inc • Semiconductors & related devices • Delaware
This TECHNOLOGY TRANSFER AND LICENSE OPTION AGREEMENT FOR 1Y PROCESS NODE (this “Agreement”), is made and entered into as of February 3, 2016, by and between Micron Technology, Inc., a Delaware corporation (“Micron”), and Nanya Technology Corporation (Nanya Technology Corporation [Translation from Chinese]), a company incorporated under the laws of the Republic of China (“NTC”). (Micron and NTC are referred to in this Agreement individually as a “Party” and collectively as the “Parties”).
EXHIBIT 10.113 REVOLVING CREDIT AGREEMENT This REVOLVING CREDIT AGREEMENT (the "Agreement") is entered into as of February 12, 1996, among Micron Technology, Inc. a Delaware corporation (the "Company"), the several financial institutions party to this...Revolving Credit Agreement • March 26th, 1996 • Micron Technology Inc • Semiconductors & related devices • California
REGISTRATION RIGHTS AGREEMENT Dated February 3, 2015 among MICRON TECHNOLOGY, INC. GOLDMAN, SACHS & CO. MORGAN STANLEY & CO. LLC and CREDIT SUISSE SECURITIES (USA) LLCRegistration Rights Agreement • February 3rd, 2015 • Micron Technology Inc • Semiconductors & related devices • New York
THIS REGISTRATION RIGHTS AGREEMENT (this “Agreement”) is made and entered into this 3rd day of February, 2015 among Micron Technology, Inc., a Delaware corporation, (the “Company”), the Guarantors from time to time party hereto (the “Guarantors”), Goldman, Sachs & Co., Morgan Stanley & Co. LLC and Credit Suisse Securities (USA) LLC as representatives (collectively, the “Representatives”) of the initial purchasers (collectively, the “Initial Purchasers”) named in Schedule I to the Purchase Agreement, dated January 29, 2015, among the Company and the Representatives (the “Purchase Agreement”).
