Common Contracts
2 similar Loan Agreement contracts by Micron Technology Inc
LOAN AGREEMENTLoan Agreement • November 27th, 2009 • Micron Technology Inc • Semiconductors & related devices
This Loan Agreement (as amended, restated, modified or otherwise supplemented from time to time, this “Agreement”) is entered into as of November 25th, 2009 (the “Agreement Date”), by and among Micron Semiconductor B.V., a private limited company organized under the laws of The Netherlands (the “Borrower”), Micron Technology, Inc., a corporation organized under the laws of the State of Delaware, U.S.A. (the “Guarantor”), and Mai Liao Power Corporation, a company incorporated under the laws of the Republic of China (the “Lender”).
LOAN AGREEMENTLoan Agreement • January 13th, 2009 • Micron Technology Inc • Semiconductors & related devices
This Loan Agreement (as amended, restated, modified or otherwise supplemented from time to time, this “Agreement”) is entered into as of November 26, 2008 (the “Agreement Date”), by and among Micron Semiconductor B.V., a private limited company organized under the laws of The Netherlands (the “Borrower”), Micron Technology, Inc., a corporation organized under the laws of the State of Delaware, U.S.A. (the “Guarantor”), and Nan Ya Plastics Corporation, a company incorporated under the laws of the Republic of China (the “Lender”).
