ContractFront-End Manufacturing Supply Agreement • May 5th, 2020
Contract Type FiledMay 5th, 2020[*] Certain information in this document has been omitted and filed separately with the Securities and Exchange Commission. Confidential treatment has been requested with respect to the omitted portions.
FRONT-END MANUFACTURING SUPPLY AGREEMENTFront-End Manufacturing Supply Agreement • October 2nd, 2013 • Micron Technology Inc • Semiconductors & related devices
Contract Type FiledOctober 2nd, 2013 Company IndustryThis Front-End Manufacturing Supply Agreement (the “Agreement”) is entered into as of July 31, 2013 by and between Micron Semiconductor Asia Pte. Ltd., a company with limited liability organized under the laws of Singapore, having an address of 990 Bendemeer Road, Singapore, 339942 (“Recipient”) and Elpida Memory, Inc., a corporation organized under the laws of Japan with its principal place of business at 2-1, Yaesu 2-chome, Chuo-ku, Tokyo, 104-0028, Japan (“Provider”). Each of Recipient and Provider may be referred to individually as a “Party” and collectively as the “Parties”.
FRONT-END MANUFACTURING SUPPLY AGREEMENTFront-End Manufacturing Supply Agreement • August 6th, 2013 • Micron Technology Inc • Semiconductors & related devices
Contract Type FiledAugust 6th, 2013 Company IndustryThis Front-End Manufacturing Supply Agreement (the “Agreement”) is entered into as of July 31, 2013 by and between Micron Semiconductor Asia Pte. Ltd., a company with limited liability organized under the laws of Singapore, having an address of 990 Bendemeer Road, Singapore, 339942 (“Recipient”) and Elpida Memory, Inc., a corporation organized under the laws of Japan with its principal place of business at 2-1, Yaesu 2-chome, Chuo-ku, Tokyo, 104-0028, Japan (“Provider”). Each of Recipient and Provider may be referred to individually as a “Party” and collectively as the “Parties”.