LOAN AGREEMENTLoan Agreement • October 23rd, 2019 • SITIME Corp • Semiconductors & related devices
Contract Type FiledOctober 23rd, 2019 Company IndustryMegaChips Corporation, a company incorporated under the laws of Japan and having its principal place of business at Shin-Osaka Hankyu Building, 1-1-1 Miyahara, Yodogawa-ku, Osaka, 532-0003 Japan (hereinafter referred to as Lender); and
LOAN AGREEMENTLoan Agreement • May 31st, 2019 • SITIME Corp • Semiconductors & related devices
Contract Type FiledMay 31st, 2019 Company IndustryMegaChips Corporation, a company incorporated under the laws of Japan and having its principal place of business at Shin-Osaka Hankyu Building, 1-1-1 Miyahara, Yodogawa-ku, Osaka, 532-0003 Japan (hereinafter referred to as Lender); and