SiTime Corporation Shares of Common Stock (par value $0.0001 per share) Sales AgreementSales Agreement • February 27th, 2024 • SITIME Corp • Semiconductors & related devices • New York
Contract Type FiledFebruary 27th, 2024 Company Industry JurisdictionSiTime Corporation, a Delaware corporation (the “Company”), confirms its agreement (this “Agreement”) with Stifel, Nicolaus & Company, Incorporated (the “Agent”), as follows:
SITIME CORPORATION AND _____________, AS WARRANT AGENT FORM OF PREFERRED STOCK WARRANT AGREEMENT DATED AS OF __________Preferred Stock Warrant Agreement • February 26th, 2024 • SITIME Corp • Semiconductors & related devices • New York
Contract Type FiledFebruary 26th, 2024 Company Industry JurisdictionTHIS PREFERRED STOCK WARRANT AGREEMENT (this “Agreement”), dated as of [●], between SITIME CORPORATION, a Delaware corporation (the “Company”) and [●], a [corporation] [national banking association] organized and existing under the laws of [●] and having a corporate trust office in [●], as warrant agent (the “Warrant Agent”).
AS WARRANT AGENT FORM OF COMMON STOCK WARRANT AGREEMENT DATED AS OFCommon Stock Warrant Agreement • February 16th, 2021 • SITIME Corp • Semiconductors & related devices • New York
Contract Type FiledFebruary 16th, 2021 Company Industry JurisdictionTHIS COMMON STOCK WARRANT AGREEMENT (this “Agreement”), dated as of [●], between SiTime Corporation, a Delaware corporation (the “Company”), and [●], a [corporation] [national banking association] organized and existing under the laws of [●] and having a corporate trust office in [●], as warrant agent (the “Warrant Agent”).
SITIME CORPORATION AND _____________, AS WARRANT AGENT FORM OF DEBT SECURITIES WARRANT AGREEMENT DATED AS OF _____________Warrant Agreement • February 26th, 2024 • SITIME Corp • Semiconductors & related devices • New York
Contract Type FiledFebruary 26th, 2024 Company Industry JurisdictionTHIS DEBT SECURITIES WARRANT AGREEMENT (this “Agreement”), dated as of [●], between SITIME CORPORATION, a Delaware corporation (the “Company”), and [●], a [corporation] [national banking association] organized and existing under the laws of [●] and having a corporate trust office in [●], as warrant agent (the “Warrant Agent”).
SITIME CORPORATION AND _____________, AS WARRANT AGENT FORM OF COMMON STOCK WARRANT AGREEMENT DATED AS OF __________Warrant Agreement • February 26th, 2024 • SITIME Corp • Semiconductors & related devices • New York
Contract Type FiledFebruary 26th, 2024 Company Industry JurisdictionTHIS COMMON STOCK WARRANT AGREEMENT (this “Agreement”), dated as of [●], between, SITIME CORPORATION, a Delaware corporation (the “Company”) and [●], a [corporation] [national banking association] organized and existing under the laws of [●] and having a corporate trust office in [●], as warrant agent (the “Warrant Agent”).
2,000,000 Shares SITIME CORPORATION Common Stock ($0.0001 Par Value Per Share) UNDERWRITING AGREEMENTUnderwriting Agreement • November 10th, 2021 • SITIME Corp • Semiconductors & related devices • New York
Contract Type FiledNovember 10th, 2021 Company Industry Jurisdiction
INDEMNIFICATION AGREEMENTIndemnification Agreement • October 23rd, 2019 • SITIME Corp • Semiconductors & related devices • Delaware
Contract Type FiledOctober 23rd, 2019 Company Industry JurisdictionThis Indemnification Agreement (the “Agreement”), dated as of , 20 , between SiTime Corporation, a Delaware corporation (the “Company”), and (“Indemnitee”).
SITIME CORPORATION FORM OF CHANGE OF CONTROL AND SEVERANCE AGREEMENTChange of Control and Severance Agreement • November 7th, 2019 • SITIME Corp • Semiconductors & related devices • California
Contract Type FiledNovember 7th, 2019 Company Industry JurisdictionThis Change of Control Severance Agreement (this “Agreement”) is made and entered into effective as of (the “Effective Date”), by and between [name] (“Executive”) and SiTime Corporation, a Delaware corporation (the “Company”). Certain capitalized terms used in this Agreement are defined in Section 1 below.
SiTime DISTRIBUTION AGREEMENTDistribution Agreement • October 23rd, 2019 • SITIME Corp • Semiconductors & related devices
Contract Type FiledOctober 23rd, 2019 Company IndustryTHIS DISTRIBUTION AGREEMENT (the “Agreement”), effective as of the Effective Date as defined below, and is made and entered into by and between SiTime Corporation (hereinafter referred to as “Manufacturer” or “SiTime”), a Delaware corporation, organized and existing under the laws of Delaware, USA, with offices located at 990 Almanor Ave, Sunnyvale, CA 94085, and MegaChips Corporation (hereinafter referred to as “Distributor”), a Japanese corporation, organized and existing under the laws of Japan, with offices located at 1-1-1 Miyahara, Yodogawa–ku, Osaka, 532-0003 Japan.
SITIME CORPORATION 2019 STOCK INCENTIVE PLAN (Adopted by the Board of Directors on __________, 2019) (Approved by the Stockholders on __________, 2019) (Effective on __________, 2019)2019 Stock Incentive Plan • October 23rd, 2019 • SITIME Corp • Semiconductors & related devices • Delaware
Contract Type FiledOctober 23rd, 2019 Company Industry Jurisdiction
THE BANK OF TOKYO-MITSUBISHI UFJ, LTD. LOS ANGELES BRANCH CALIFORNIA BANK TRANSACTION AGREEMENT OF SiTime CorporationBank Transaction Agreement • October 23rd, 2019 • SITIME Corp • Semiconductors & related devices • California
Contract Type FiledOctober 23rd, 2019 Company Industry JurisdictionThis BANK TRANSACTION AGREEMENT (“Agreement”) is made and dated as of August 31st, 2015, by and between Si Time Corporation (“Borrower”), and THE BANK OF TOKYO-MITSUBISHI UFJ, LTD. (“Bank”).
LOAN AGREEMENTLoan Agreement • October 23rd, 2019 • SITIME Corp • Semiconductors & related devices
Contract Type FiledOctober 23rd, 2019 Company IndustryMegaChips Corporation, a company incorporated under the laws of Japan and having its principal place of business at Shin-Osaka Hankyu Building, 1-1-1 Miyahara, Yodogawa-ku, Osaka, 532-0003 Japan (hereinafter referred to as Lender); and
SITIME - BOSCH AMENDED AND RESTATED MANUFACTURING AGREEMENTManufacturing Agreement • October 23rd, 2019 • SITIME Corp • Semiconductors & related devices • California
Contract Type FiledOctober 23rd, 2019 Company Industry JurisdictionThis Amended and Restated Manufacturing Agreement (hereinafter the “Agreement”) is entered into as of 23 - Feb, 2017 (the “Effective Date”), by and between SiTime Corporation, a Delaware corporation, having its principal place of business at 5451 Patrick Henry Drive Santa Clara, CA 95054, (“SiTime” or “Buyer”) and Robert Bosch LLC, a Delaware limited liability company having its principal place of business at 38000 Hills Tech Drive, Farmington Hills, Michigan 48331 (“Bosch” or “Seller”). Buyer and Seller each may be referred to individually as a “Party” or collectively as the “Parties.”
MEGACHIPS CORPORATION SITIME CORPORATION RESTRICTED STOCK UNIT AGREEMENTRestricted Stock Unit Agreement • October 23rd, 2019 • SITIME Corp • Semiconductors & related devices • California
Contract Type FiledOctober 23rd, 2019 Company Industry JurisdictionTHIS RESTRICTED STOCK UNIT AGREEMENT (hereinafter, this “Agreement”) made as of the day of , 20 (the “Agreement Date”), between MegaChips Corporation, a Japanese corporation (“MCC”), and SiTime Corporation, a Delaware corporation (“SiTime”, together with MCC, the “Company”) on one hand, and (the “Participant”) on other hand.
SITIME - BOSCH AMENDMENT NO.1 TO AMENDED AND RESTATED MANUFACTURING AGREEMENTManufacturing Agreement • October 23rd, 2019 • SITIME Corp • Semiconductors & related devices
Contract Type FiledOctober 23rd, 2019 Company IndustryThis Amendment No. 1 to Amended and Restated Manufacturing Agreement (this “Amendment”) is entered into as of August 1, 2018 (the “Effective Date”), by and between SiTime Corporation, a Delaware corporation, having its principal place of business at 5451 Patrick Henry Drive Santa Clara, CA 95054, (“SiTime” or “Buyer”) and Robert Bosch LLC, a Delaware limited liability company having its principal place of business at 38000 Hills Tech Drive, Farmington Hills, Michigan 48331 (“Bosch” or “Seller”). Buyer and Seller each may be referred to individually as a “Party” or collectively as the “Parties.”
LICENSE AGREEMENTLicense Agreement • October 23rd, 2019 • SITIME Corp • Semiconductors & related devices • Michigan
Contract Type FiledOctober 23rd, 2019 Company Industry JurisdictionThis License Agreement (the “Agreement”), effective on August 1, 2018 (the “Effective Date”), is entered into by and among Robert Bosch LLC (“Bosch”), a Delaware limited liability company with its principal place of business located at 38000 Hills Tech Drive, Farmington Hills, MI 48331, U.S.A and SiTime Corporation (“SiTime”), a Delaware corporation with a principal place of business located at 5451 Patrick Henry Drive, Santa Clara, CA 95054. Bosch and SiTime may be referred to collectively herein as the “Parties,” and each individually as a “Party.”
LEASE BETWEEN BATTON ASSOCIATES, LLC (“LESSOR”) AND SITIME CORPORATION (“LESSEE”) 5451 Patrick Henry Drive Santa Clara, CaliforniaLease • October 23rd, 2019 • SITIME Corp • Semiconductors & related devices • California
Contract Type FiledOctober 23rd, 2019 Company Industry Jurisdiction
Integration and Purchase AgreementIntegration and Purchase Agreement • October 23rd, 2019 • SITIME Corp • Semiconductors & related devices • California
Contract Type FiledOctober 23rd, 2019 Company Industry JurisdictionThis Integration and Purchase Agreement (hereinafter the “Agreement”) is entered into as of March 15, 2019 (the “Effective Date”), by and between SiTime Corporation, a Delaware corporation, having its principal place of business at 5451 Patrick Henry Drive, Santa Clara, California 95054, (“SiTime” or “Seller”) and MegaChips Corporation, a Japanese corporation, having its registered address at: 1-1-1, Miyahara, Yodogawa, Osaka 532-0003, Japan, (“MCC” or “Buyer”). Buyer and Seller each may be referred to individually as a “Party” or collectively as the “Parties.”
UNCOMMITTED AND REVOLVING CREDIT LINE AGREEMENTUncommitted and Revolving Credit Line Agreement • October 23rd, 2019 • SITIME Corp • Semiconductors & related devices • New York
Contract Type FiledOctober 23rd, 2019 Company Industry JurisdictionUNCOMMITTED AND REVOLVING CREDIT LINE AGREEMENT dated as of September 21, 2018 between SUMITOMO MITSUI BANKING CORPORATION, a Japanese banking corporation, having its offices at 555 California Street, Suite 3350, San Francisco, CA 94104 (the “BANK”), and SITIME CORPORATION, a corporation organized under the laws of California, having its offices at 5451 Patrick Henry Drive, Santa Clara, CA 95054 (the “BORROWER”). The parties hereto hereby agree as follows:
INDEMNIFICATION AGREEMENTIndemnification Agreement • February 16th, 2021 • SITIME Corp • Semiconductors & related devices • Delaware
Contract Type FiledFebruary 16th, 2021 Company Industry JurisdictionThis Indemnification Agreement (the “Agreement”), dated as of __________ __, 20___, between SiTime Corporation, a Delaware corporation (the “Company”), and ____________________ (“Indemnitee”).
GUARANTYGuaranty • October 23rd, 2019 • SITIME Corp • Semiconductors & related devices • New York
Contract Type FiledOctober 23rd, 2019 Company Industry JurisdictionWHEREAS, SiTime Corporation (hereinafter referred to as the “Borrower”), a corporation, partnership, limited liability company or other organization duly organized and validly existing under the laws of the jurisdiction of its creation has obtained or desires or may desire at some time and/or from time to time to obtain financial accommodations (as defined below) from MUFG Bank, Ltd. (hereinafter, with its successors and assigns, as the context may require, referred to as the “Bank”), and the aggregate principal dollar value of the credit extended in respect of such financial accommodations shall not exceed Fifty Million United States Dollars ($50,000,000.00) at any time; and
ASSET PURCHASE AGREEMENTAsset Purchase Agreement • August 6th, 2020 • SITIME Corp • Semiconductors & related devices
Contract Type FiledAugust 6th, 2020 Company IndustryThis ASSET PURCHASE AGREEMENT, dated August 4, 2020 (this “Agreement”), is by and between MegaChips Corporation, a company incorporated under the laws of Japan and having its principal place of business at Shin-Osaka Hankyu Building, 1-1-1 Miyahara, Yodogawa-ku, Osaka, 532-0003 Japan (“Seller”) and SiTime Corporation, a company incorporated under the laws of the State of Delaware, with its registered office at 5451 Patrick Henry Drive, Santa Clara, CA 95054, U.S.A (“Buyer”) (each a “Party” and collectively the “Parties”).
AMENDMENT NO.2 TO DISTRIBUTION AGREEMENTDistribution Agreement • August 5th, 2021 • SITIME Corp • Semiconductors & related devices
Contract Type FiledAugust 5th, 2021 Company IndustryTHIS AMENDMENT NO.2 TO DISTRIBUTION AGREEMENT (the "Amendment No.2"), effective as of the Effective Date as defined below, is made and entered into by and between SiTime Corporation (hereinafter referred to as "Manufacturer"), a Delaware corporation, organized and existing under the laws of Delaware, USA, with its principal office at 5451 Patrick Henry Drive Santa Clara, CA 95054 U.S.A. and MegaChips Corporation (hereinafter referred to as "Distributor"), a Japanese corporation, organized and existing under the laws of Japan, with its principal office at 1-1-1 Miyahara, Yodogawa-ku, Osaka, 532-0003 Japan. (hereinafter referred to individually as "Party" and collectively "Parties")
October 30, 2023 Dear Art: This letter sets forth the substance of the agreement regarding the terms of your retirement (thisRetirement Agreement • February 26th, 2024 • SITIME Corp • Semiconductors & related devices
Contract Type FiledFebruary 26th, 2024 Company Industry
MASTER FRAMEWORK AGREEMENT BY AND AMONG SITIME CORPORATION, NINGBO AURA SEMICONDUCTOR CO., LTD., AURA SEMICONDUCTOR PVT. LTD., AURA SEMICONDUCTOR LIMITED, SHAOXING YUANFANG SEMICONDUCTOR CO LTD., AND AIM CORE HOLDINGS LIMITED October 30, 2023Master Framework Agreement • November 1st, 2023 • SITIME Corp • Semiconductors & related devices • California
Contract Type FiledNovember 1st, 2023 Company Industry JurisdictionExhibit A Form of Support Services Agreement Exhibit B Form of Bill of Sale Exhibit C Form of Guarantee by Apollo Guarantors
TERMINATION AGREEMENTTermination Agreement • November 4th, 2021 • SITIME Corp • Semiconductors & related devices
Contract Type FiledNovember 4th, 2021 Company IndustrySiTime Corporation, a US Delaware corporation, having its principal business place at 5451 Patrick Henry Drive, Santa Clara, California 95054 ("SiTime"); and
SERVICES AND SECONDMENT AGREEMENTServices and Secondment Agreement • May 7th, 2020 • SITIME Corp • Semiconductors & related devices • California
Contract Type FiledMay 7th, 2020 Company Industry JurisdictionTHIS SERVICES AND SECONDMENT AGREEMENT (this “Agreement”) is dated this first day of January, 2020 (the “Effective Date”), by and between MegaChips Technology America Corporation, a California corporation (“MCA”), and SiTime Corporation, a Delaware corporation (“SiTime”).
●] Shares SITIME CORPORATION Common Stock ($0.0001 Par Value Per Share) UNDERWRITING AGREEMENTUnderwriting Agreement • October 23rd, 2019 • SITIME Corp • Semiconductors & related devices • New York
Contract Type FiledOctober 23rd, 2019 Company Industry JurisdictionSiTime Corporation, a Delaware corporation (the “Company”), proposes to sell to the several underwriters (the “Underwriters”) named on Schedule I hereto for whom you are acting as representatives (the “Representatives”), an aggregate of [●] shares (the “Firm Shares”) of the Company’s common stock, $0.0001 par value per share (the “Common Stock”). The respective amounts of the Firm Shares to be so purchased by the several Underwriters are set forth opposite their names on Schedule I hereto. The Company is a subsidiary of MegaChips Corporation (“MegaChips”), a corporation organized under the laws of Japan. The Company also proposes to sell at the Underwriters’ option an aggregate of up to [●] additional shares of the Company’s Common Stock (the “Option Shares”) as set forth below.
Consulting AgreementConsulting Agreement • August 5th, 2021 • SITIME Corp • Semiconductors & related devices • California
Contract Type FiledAugust 5th, 2021 Company Industry JurisdictionThis Consulting Agreement (the “Agreement”) is made as of the Effective Date set forth above by and between SiTime Corporation, a Delaware corporation (“Client”) and the consultant named on the signature page hereto (“Consultant”).
FIRST AMENDMENT TO LEASELease • November 4th, 2021 • SITIME Corp • Semiconductors & related devices • California
Contract Type FiledNovember 4th, 2021 Company Industry JurisdictionThis First Amendment to Lease (“First Amendment”), dated as of January , 2021, is entered into by and between Batton Associates, LLC, a California limited liability company (“Lessor’), and SiTime Corporation, a Delaware corporation (“Lessee”).
SITIME CORPORATION AMENDED AND RESTATED 2022 INDUCEMENT AWARD PLAN (Adopted by the Compensation Committee on February 23, 2022) (Effective as of February 23, 2022) (Amended and Restated on February 21, 2023)Inducement Award Plan • February 27th, 2023 • SITIME Corp • Semiconductors & related devices • Delaware
Contract Type FiledFebruary 27th, 2023 Company Industry Jurisdiction
ASSET PURCHASE AGREEMENTAsset Purchase Agreement • May 7th, 2020 • SITIME Corp • Semiconductors & related devices
Contract Type FiledMay 7th, 2020 Company IndustryThis ASSET PURCHASE AGREEMENT, dated February 20, 2020 (this "Agreement"), is by and between MegaChips Taiwan Corporation, a Taiwan corporation, with its registered office at RM. B 2F, Worldwide House, No.129, Min Sheng E. Rd., Sec.3, Taipei 105 Taiwan ("Seller") and SiTime Corporation, a Delaware Corporation, with its registered office at 5451 Patrick Henry Drive, Santa Clara, CA 95054, U.S.A ("Buyer") (each a "Party" and collectively the "Parties").