Dated 7 June 2016 SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION and SUBSCRIPTION AGREEMENT relating to US$450,000,000 Zero Coupon Convertible Bonds due 2022 convertible into ordinary shares of Semiconductor Manufacturing International CorporationSubscription Agreement • April 27th, 2017 • Semiconductor Manufacturing International Corp • Semiconductors & related devices
Contract Type FiledApril 27th, 2017 Company Industry
Dated 22 August 2014 SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION and DATANG HOLDINGS (HONGKONG) INVESTMENT COMPANY LIMITED SUBSCRIPTION AGREEMENT relating to the exercise of pre-emptive right to subscribe for US$22,200,000 Zero Coupon...Subscription Agreement • August 27th, 2014 • Datang Telecom Technology & Industry Holdings LTD • Semiconductors & related devices
Contract Type FiledAugust 27th, 2014 Company Industry
Dated 24 October 2013 SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION and DEUTSCHE BANK AG, HONG KONG BRANCH and J.P. MORGAN SECURITIES PLC SUBSCRIPTION AGREEMENT relating to US$200,000,000 Zero Coupon Convertible Bonds due 2018 convertible into...Subscription Agreement • April 14th, 2014 • Semiconductor Manufacturing International Corp • Semiconductors & related devices
Contract Type FiledApril 14th, 2014 Company Industry
SUBSCRIPTION AGREEMENTSubscription Agreement • June 30th, 2009 • London
Contract Type FiledJune 30th, 2009 Jurisdiction