Exhibit 10.3 ================================================================== ============== ASSET PURCHASE AGREEMENT by and between MOTOROLA (CHINA) ELECTRONICS LIMITEDAsset Purchase Agreement • February 11th, 2004 • Semiconductor Manufacturing International Corp
Exhibit 1.1 [Form of Underwriting Agreement] 97,878,780 American Depositary Shares each representing 50 ordinary shares (par value US$0.0004 per ordinary share) and 4,893,939,000 ordinary shares of Semiconductor Manufacturing International Corporation...Underwriting Agreement • March 10th, 2004 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • New York
ANDDeposit Agreement • March 10th, 2004 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • New York
SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION INDEMNIFICATION AGREEMENTIndemnification Agreement • June 28th, 2005 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • New York
This Indemnification Agreement (“Agreement”) is entered into on the day of , 2005 by and between Semiconductor Manufacturing International Corporation, a Cayman Islands company (the “Company”), and (“Indemnitee”) and is deemed to be effective as of the 6th day of May, 2005.
EX 10.6 SIXTH AMENDED AND RESTATED REGISTRATION RIGHTS AGREEMENTRegistration Rights Agreement • February 25th, 2004 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • New York
License Agreement FUJITSU & SMICLicense Agreement • March 10th, 2004 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • California
SHARE PURCHASE AGREEMENTShare Purchase Agreement • April 25th, 2016 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • Hong Kong
SHARE PURCHASE AGREEMENT (the “Agreement”), dated as of 11 June 2015, by and among Semiconductor Manufacturing International Corporation, a company established under the laws of Cayman Islands (the “Company”), and Country Hill Limited, a company established under the laws of Cayman Islands (the “Buyer”).
Dated 2018 SUBSCRIPTION AGREEMENT relating to the exercise of pre-emptive right in connection with the issue of 57,054,901 Shares in the share capital of Semiconductor Manufacturing International CorporationSubscription Agreement • April 30th, 2019 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • Hong Kong
Dated 7 June 2016 SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION and SUBSCRIPTION AGREEMENT relating to US$450,000,000 Zero Coupon Convertible Bonds due 2022 convertible into ordinary shares of Semiconductor Manufacturing International CorporationSubscription Agreement • April 27th, 2017 • Semiconductor Manufacturing International Corp • Semiconductors & related devices
Dated 2018 SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION and DATANG telecom technology & industry holdings co., ltd. and DATANG HOLDINGS (HONGKONG) INVESTMENT COMPANY LIMITED SUBSCRIPTION AGREEMENT relating to the Subscription for...Subscription Agreement • April 30th, 2019 • Semiconductor Manufacturing International Corp • Semiconductors & related devices
RECITALSConsent and Agreement • February 25th, 2004 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • New York
Letter to Participants Dear Colleague,Grant Agreement • February 12th, 2010 • Semiconductor Manufacturing International Corp • Semiconductors & related devices
On February 17, 2009 we attempted to grant you a stock option that we later discovered was improperly awarded and processed. Accordingly we wish to grant you new awards in place of the prior attempted option grant. The details of your new awards are in the attached Agreement to Grant Restricted Share Units and Stock Option (the “Grant Agreement”). Please review and sign/electronically accept the attached Grant Agreement as soon as possible, but in no event later than March 31, 2010. You can agree to the terms on the following link:
SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION AGREEMENT TO GRANT RESTRICTED SHARE UNIT AND STOCK OPTION AWARDSAgreement to Grant Restricted Share Unit and Stock Option Awards • February 12th, 2010 • Semiconductor Manufacturing International Corp • Semiconductors & related devices
This Agreement to Grant Restricted Share Unit and Stock Option Awards (“Agreement”) is made ______________, 2010 (the “Effective Date”), by and between Semiconductor Manufacturing International Corporation (the “Company”) and [________] (“Participant”).
Dated 4 June 2014 (1) SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION and (2) DATANG HOLDINGS (HONGKONG) INVESTMENT COMPANY LIMITED and (3) DEUTSCHE BANK AG, HONG KONG BRANCH and (4) J.P. MORGAN SECURITIES (ASIA PACIFIC) LIMITED PLACING AND...Placing and Subscription Agreement • April 28th, 2015 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • Hong Kong
PLACING AGREEMENTPlacing Agreement • April 27th, 2018 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • Hong Kong
Q&A about Replacement GrantsReplacement Grant Agreement • February 12th, 2010 • Semiconductor Manufacturing International Corp • Semiconductors & related devices
SHARE SUBSCRIPTION AGREEMENTShare Subscription Agreement • June 28th, 2011 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • Hong Kong
SHARE SUBSCRIPTION AGREEMENT (the “Agreement”), dated as of 18 April, 2011, by and among Semiconductor Manufacturing International Corporation (the “Company”), and Country Hill Limited (the “Investor”).
CEVA, SMIC and Brite Semiconductor Partner to Provide Hard Macro Versions of CEVA DSP Cores and PlatformsCollaboration Agreement • March 27th, 2014 • Semiconductor Manufacturing International Corp • Semiconductors & related devices
Agreement aimed at expediting customer designs utilizing CEVA DSP cores for a range of applications, including communications, connectivity, imaging, vision, audio and voice
RECITALSIndemnification Agreement • February 11th, 2004 • Semiconductor Manufacturing International Corp • New York
ContractTechnology Licensing Agreement • December 31st, 2007 • Semiconductor Manufacturing International Corp • Semiconductors & related devices
The Stock Exchange of Hong Kong Limited takes no responsibility for the contents of this announcement, makes no representation as to its accuracy or completeness and expressly disclaims any liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the contents of this announcement.
SETTLEMENT AGREEMENTSettlement Agreement • June 28th, 2005 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • California
This Agreement (the “Agreement”) is entered into this 30th day of January 2005 by and among TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., a Taiwanese corporation, having a place of business located at No. 8 Li-Hsin Road 6, Hsin-Chu Science Park, Hsinchu, Taiwan, Republic of China and WaferTech, LLC, a limited liability company organized and existing under the laws of Delaware, having a principal place of business at 5509 N.W. Parker Street, Camas, Washington 98608, (collectively, “TSMC”) on behalf of themselves and all of their SUBSIDIARIES on the one hand; and SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION, a Cayman Island Corporation, having a place of business located at No. 18, Zhang Jiang Road, Pudong New Area, Shanghai 201203, People’s Republic of China on behalf of itself and all of its SUBSIDIARIES (collectively, “SMIC”).
ContractCollaboration Agreement • March 29th, 2012 • Semiconductor Manufacturing International Corp • Semiconductors & related devices
Hong Kong Exchanges and Clearing Limited and The Stock Exchange of Hong Kong Limited take no responsibility for the contents of this announcement, make no representation as to its accuracy or completeness and expressly disclaim any liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the contents of this announcement.
Hubei Science & Technology Investment Group Co., Ltd. And Semiconductor Manufacturing International Corporation The Joint Venture Agreement regarding establishing Semiconductor Manufacturing International (Wuhan) Corporation May 2011 (English Translation)Joint Venture Agreement • June 28th, 2011 • Semiconductor Manufacturing International Corp • Semiconductors & related devices
SMIC and ASML sign a Volume Purchase Agreement worth 450 million EurosVolume Purchase Agreement • November 6th, 2014 • Semiconductor Manufacturing International Corp • Semiconductors & related devices
SHANGHAI, Oct. 27, 2014 — Semiconductor Manufacturing International Corporation (“SMIC”; NYSE: SMI; SEHK: 981) the largest and most advanced pure-play foundry provider in China, and ASML Holding N.V. (“ASML”), the world’s leading provider of lithography systems, announce the signing of a volume purchase agreement (VPA) that will provide SMIC with lithography systems from ASML. The VPA which is worth approximately 450 million Euros and is part of a strategic partnership between the companies that will help facilitate the timely expansion of SMIC’s advanced technology capacities.
Dated 4 June 2014 SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION and DEUTSCHE BANK AG, HONG KONG BRANCH and J.P. MORGAN SECURITIES PLC SUBSCRIPTION AGREEMENT relating to US$95,000,000 Zero Coupon Convertible Bonds due 2018 convertible into...Subscription Agreement • April 28th, 2015 • Semiconductor Manufacturing International Corp • Semiconductors & related devices
Spansion and SMIC Expand Foundry AgreementFoundry Agreement • May 19th, 2011 • Semiconductor Manufacturing International Corp • Semiconductors & related devices
Spansion Inc. (NYSE: CODE), a leading provider of NOR Flash memory, and Semiconductor Manufacturing International Corporation (“SMIC”; NYSE: SMI; SEHK: 0981.HK), China’s largest and most advanced semiconductor foundry, today announced they will extend their current foundry arrangement to expand 65nm capacity and include the manufacture of Spansion’s 45nm Flash memory.
Exhibit 10.1 [Translation from Original Document in Chinese] Land Use Rights Transfer Contract Party A: Zhangjiang Technology Park Development Co. Party B: Semiconductor Manufacturing International (Shanghai) Corporation ____ 2002, Shanghai Land Use...Land Use Rights Transfer Contract • February 11th, 2004 • Semiconductor Manufacturing International Corp
Dated 16 August 2010 SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION and DATANG TELECOM TECHNOLOGY & INDUSTRY HOLDINGS CO., LTD. Subscription Agreement relating to 1,528,038,461 shares of Semiconductor Manufacturing International Corporation...Subscription Agreement • June 28th, 2011 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • Hong Kong
Dated 8 July 2010 (1) SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION and (2) J.P. MORGAN SECURITIES (ASIA PACIFIC) LIMITED and (3) THE ROYAL BANK OF SCOTLAND N.V., HONG KONG BRANCH PLACING AGREEMENT relating to Shares in the share capital of...Placing Agreement • June 28th, 2011 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • Hong Kong
FOIA confidential treatment requested: [***] indicates that certain information contained herein has been omitted and filed separately with the Securities and Exchange Commission. Confidential treatment has been requested with respect to such omitted...Strategic Cooperation Agreement • January 5th, 2009 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • Hong Kong
This English version is a translation of the original Chinese version of the agreement. The English translation shall have no legal effect.
Dated 25 September 2014 SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION and DEUTSCHE BANK AG, SINGAPORE BRANCH and J.P. MORGAN SECURITIES PLC SUBSCRIPTION AGREEMENT relating to US$500,000,000 4.125 per cent. Bonds due 2019Subscription Agreement • April 28th, 2015 • Semiconductor Manufacturing International Corp • Semiconductors & related devices
The Issuer and the Managers wish to record the arrangements agreed between them in relation to an issue of US$500,000,000 4.125 per cent. Bonds due 2019 (the “Bonds”). The Bonds will be in registered form in denominations of U.S.$200,000 and integral multiples of U.S.$1,000 in excess thereof. The Bonds will only be offered and sold outside the United States (as defined below) in reliance on Regulation S (“Regulation S”) under the United States Securities Act of 1933 (the “Securities Act”) and in the United States to qualified institutional buyers (as defined in the Securities Act) in reliance on Rule 144A (“Rule 144A”) under the Securities Act. The Bonds will be represented by separate global certificates (the “Rule 144A Global Bond Certificate” and the “Regulation S Global Bond Certificate” and, together, the “Global Bond Certificates”). The Rule 144A Global Bond Certificate will represent Bonds which are offered and sold in the United States in reliance on Rule 144A and are “restrict
ContractSettlement Agreement • November 10th, 2009 • Semiconductor Manufacturing International Corp • Semiconductors & related devices
Hong Kong Exchanges and Clearing Limited and The Stock Exchange of Hong Kong Limited take no responsibility for the contents of this announcement, make no representation as to its accuracy or completeness and expressly disclaim any liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the contents of this announcement. This announcement appears for information purpose only and does not constitute an invitation or offer to acquire, purchase or subscribe for securities of Semiconductor Manufacturing International Corporation.
5 March 2004Underwriting Agreement • March 10th, 2004 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • Hong Kong
Exhibit 10.2 [Translation from Original Document in Chinese] No.: Jingjifangdichurang [He] Zi (2003) No. 044 File No.: Beijing Economic and Technological Development Zone State Land Use Right Grant Contract Grantor: Buildings and Land Administration...State Land Use Right Grant Contract • February 11th, 2004 • Semiconductor Manufacturing International Corp
SETTLEMENT AGREEMENTSettlement Agreement • June 29th, 2010 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • Hong Kong
This SETTLEMENT AGREEMENT (together with all Exhibits hereto, the “Settlement Agreement”) is made and entered into as of November 9, 2009 (the “Effective Date”) by and between Taiwan Semiconductor Manufacturing Company, Ltd., a Taiwanese corporation, having a place of business located at No.8 Li-Hsin Road 6, Hsin-Chu Science Park, Hsin-Chu, Taiwan, Republic of China, on behalf of itself and all of its Related Companies (Taiwan Semiconductor Manufacturing Company, Ltd. and its Related Companies, collectively “TSMC”), and Semiconductor Manufacturing International Corporation, an exempted company incorporated under the laws of the Cayman Islands, having a place of business located at No. 18 Zhang Jiang Road, Pudong New Area, Shanghai 201203, People’s Republic of China, on behalf of itself and all of its Related Companies, including Semiconductor Manufacturing International (Beijing) Corporation, Semiconductor Manufacturing International (Shanghai) Corporation, and SMIC Americas (Semicondu
