Common Contracts
2 similar Facility Agreement contracts by Chartered Semiconductor Manufacturing LTD
Engrossed on the letterhead of Export-Import Bank Of The United States]Facility Agreement • May 7th, 2009 • Chartered Semiconductor Manufacturing LTD • Semiconductors & related devices • New York
Ex-Im Bank Facility Agreement dated as of December 23, 2004, among Chartered Semiconductor Manufacturing Ltd. (“Borrower”), JP Morgan Chase Bank, National Association (“Lender” and “Facility Agent”) and the Export-Import Bank of the United States (“Ex-Im Bank”), in the principal amount of $653,130,629 (“Credit Agreement”)
Engrossed on the letterhead of Export-Import Bank Of The United States]Facility Agreement • May 7th, 2009 • Chartered Semiconductor Manufacturing LTD • Semiconductors & related devices • New York
Ex-Im Bank Facility Agreement dated as of May 16, 2007, among Chartered Semiconductor Manufacturing Ltd. (“Borrower”), JP Morgan Chase Bank, National Association (“Lender” and “Facility Agent”) and the Export-Import Bank of the United States (“Ex-Im Bank”), in the principal amount of $609,733,033 (“Credit Agreement”)
