Engrossed on the letterhead of Export-Import Bank Of The United States]Ex-Im Bank Facility Agreement • May 7th, 2009 • Chartered Semiconductor Manufacturing LTD • Semiconductors & related devices • New York
Ex-Im Bank Facility Agreement dated as of December 23, 2004, among Chartered Semiconductor Manufacturing Ltd. (“Borrower”), JP Morgan Chase Bank, National Association (“Lender” and “Facility Agent”) and the Export-Import Bank of the United States (“Ex-Im Bank”), in the principal amount of $653,130,629 (“Credit Agreement”)
RE: Ex-Im Bank Transaction No. AP080562XX — Singapore (“Transaction”) Ex-Im Bank Facility Agreement dated as of December 23, 2004, among Chartered Semiconductor Manufacturing Ltd. (“Borrower”), JP Morgan Chase Bank, National Association (“Lender” and...Ex-Im Bank Facility Agreement • August 11th, 2009 • Chartered Semiconductor Manufacturing LTD • Semiconductors & related devices • New York
With reference to the request by the Borrower dated as of June 24, 2009 (“Request”), we hereby confirm our agreement, subject to the terms and conditions set forth in this waiver (“Waiver”), to amend the Ex-Im Bank Facility Agreement, as hereinafter provided. The provisions of this Waiver have been agreed to by the parties in consideration of the premises and mutual covenants herein contained. Unless otherwise provided herein, all capitalized terms not defined herein shall have the meanings set forth in the Ex-Im Bank Facility Agreement.
AMENDMENT NO. 1 TO EX-IM BANK FACILITY AGREEMENTEx-Im Bank Facility Agreement • August 7th, 2007 • Chartered Semiconductor Manufacturing LTD • Semiconductors & related devices • New York
This AMENDMENT NO. 1 TO EX-IM BANK FACILITY AGREEMENT (this “Amendment”) dated as of May 16, 2007, is by and among CHARTERED SEMICONDUCTOR MANUFACTURING LTD., a public company limited by shares duly organized and existing under the laws of the Republic of Singapore (the “Borrower”); JPMORGAN CHASE BANK, NATIONAL ASSOCIATION, a national banking association duly organized and existing under the laws of the United States of America, as Lender (the “Lender”); EXPORT-IMPORT BANK OF THE UNITED STATES, an independent agency of the government of the United States of America (“Ex-Im Bank”); and JPMORGAN CHASE BANK, NATIONAL ASSOCIATION, a national banking association duly organized and existing under the laws of the United States of America, as Facility Agent (the “Facility Agent”).
May 16, 2007 CHARTERED SEMICONDUCTOR MANUFACTURING LTD, as Borrower, JPMORGAN CHASE BANK, NATIONAL ASSOCIATION, as Lender, EXPORT-IMPORT BANK OF THE UNITED STATES and JPMORGAN CHASE BANK, NATIONAL ASSOCIATION, as Facility Agent, EX-IM BANK FACILITY...Ex-Im Bank Facility Agreement • August 7th, 2007 • Chartered Semiconductor Manufacturing LTD • Semiconductors & related devices • New York
THIS EX-IM BANK FACILITY AGREEMENT dated as of May 16, 2007 (this “Agreement”), is made by and among CHARTERED SEMICONDUCTOR MANUFACTURING LTD, a public company limited by shares duly organized and existing under the laws of the Republic of Singapore (the “Borrower”); JPMORGAN CHASE BANK, NATIONAL ASSOCIATION, a national banking association duly organized and existing under the laws of the United States of America, as Lender (the “Lender”); EXPORT-IMPORT BANK OF THE UNITED STATES, an independent agency of the government of the United States of America (“Ex-Im Bank”); and JPMORGAN CHASE BANK, NATIONAL ASSOCIATION, a national banking association duly organized and existing under the laws of the United States of America, as Facility Agent (the “Facility Agent”).
RELATING TO THE CHARTERED SEMICONDUCTOR FAB 7 PROJECT EX-IM BANK GUARANTEE NO. AP080562XX - SINGAPOREEx-Im Bank Facility Agreement • March 7th, 2005 • Chartered Semiconductor Manufacturing LTD • Semiconductors & related devices
