Common Contracts
2 similar R&d and Consignment Agreement contracts by Via Optronics AG
R&D AND CONSIGNMENT AGREEMENTR&d and Consignment Agreement • July 31st, 2019 • Via Optronics AG • Semiconductors & related devices
This R&D and Consignment Agreement (the “Agreement”) is entered into on March 29, between Toppan Printing Co., Ltd., a company organized under the laws of Japan (“Toppan”), and VTS-Touchsensor Co., Ltd. (formerly known as Toppan Touch Panel Products, Co., Ltd.), a company organized under the laws of Japan (the “Company”). This Agreement is effective from and after March 29, 2018 (the “Effective Date”). Each of Toppan and the Company is referred to as a “Party”, and together, as the “Parties”.
R&D AND CONSIGNMENT AGREEMENTR&d and Consignment Agreement • June 21st, 2019 • Via Optronics AG • Semiconductors & related devices
This R&D and Consignment Agreement (the “Agreement”) is entered into on March 29, between Toppan Printing Co., Ltd., a company organized under the laws of Japan (“Toppan”), and VTS-Touchsensor Co., Ltd. (formerly known as Toppan Touch Panel Products, Co., Ltd.), a company organized under the laws of Japan (the “Company”). This Agreement is effective from and after March 29, 2018 (the “Effective Date”). Each of Toppan and the Company is referred to as a “Party”, and together, as the “Parties”.
