R&D AND CONSIGNMENT AGREEMENTR&d and Consignment Agreement • July 31st, 2019 • Via Optronics AG • Semiconductors & related devices
This R&D and Consignment Agreement (the “Agreement”) is entered into on March 29, between Toppan Printing Co., Ltd., a company organized under the laws of Japan (“Toppan”), and VTS-Touchsensor Co., Ltd. (formerly known as Toppan Touch Panel Products, Co., Ltd.), a company organized under the laws of Japan (the “Company”). This Agreement is effective from and after March 29, 2018 (the “Effective Date”). Each of Toppan and the Company is referred to as a “Party”, and together, as the “Parties”.
CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY [***], HAS BEEN OMITTED BECAUSE IT IS NOT MATERIAL AND WOULD LIKELY CAUSE COMPETITIVE HARM TO THE COMPANY IF PUBLICLY DISCLOSED.R&d and Consignment Agreement • May 16th, 2022 • Via Optronics AG • Semiconductors & related devices
This is to confirm the amendment to R&D AND CONSIGNMENT AGREEMENT (“the Agreement”) executed on March 29, 2018 between Toppan Inc. (“Toppan”) and VTS-Touchsensor Products Co., Ltd. (“Company”). Toppan and Company is referred to as a “Party”, and together, as the “Parties”.
R&D AND CONSIGNMENT AGREEMENTR&d and Consignment Agreement • September 4th, 2020 • Via Optronics AG • Semiconductors & related devices
This R&D and Consignment Agreement (the “Agreement”) is entered into on March 29, 2018 between Toppan Printing Co., Ltd., a company organized under the laws of Japan (“Toppan”), and VTS-Touchsensor Co., Ltd. (formerly known as Toppan Touch Panel Products, Co., Ltd.), a company organized under the laws of Japan (the “Company”). This Agreement is effective from and after March 29, 2018 (the “Effective Date”). Each of Toppan and the Company is referred to as a “Party”, and together, as the “Parties”.
CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY [***], HAS BEEN OMITTED BECAUSE IT IS NOT MATERIAL AND WOULD LIKELY CAUSE COMPETITIVE HARM TO THE COMPANY IF PUBLICLY DISCLOSED.R&d and Consignment Agreement • May 16th, 2022 • Via Optronics AG • Semiconductors & related devices
This is to confirm the amendment to R&D AND CONSIGNMENT AGREEMENT (“the Agreement”) executed on March 29, 2018 between Toppan Inc. (“Toppan”; formerly known as Toppan Printing Co., Ltd.) and VTS-Touchsensor Products Co., Ltd. (“Company”).
CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY [***], HAS BEEN OMITTED BECAUSE IT IS NOT MATERIAL AND WOULD LIKELY CAUSE COMPETITIVE HARM TO THE COMPANY IF PUBLICLY DISCLOSED.R&d and Consignment Agreement • May 16th, 2022 • Via Optronics AG • Semiconductors & related devices
This is to confirm the amendment to R&D AND CONSIGNMENT AGREEMENT (“the Agreemenf”) executed on March 29, 2018 between Toppan Inc. (formerly known as Toppan Printing Co., Ltd.) and VTS-Touchsensor Co., Ltd.
