RE: Ex-Im Bank Transaction No. AP080562XX — Singapore (“Transaction”) Ex-Im Bank Facility Agreement dated as of December 23, 2004, among Chartered Semiconductor Manufacturing Ltd. (“Borrower”), JP Morgan Chase Bank, National Association (“Lender” and...Ex-Im Bank Facility Agreement • August 11th, 2009 • Chartered Semiconductor Manufacturing LTD • Semiconductors & related devices • New York
Contract Type FiledAugust 11th, 2009 Company Industry JurisdictionWith reference to the request by the Borrower dated as of June 24, 2009 (“Request”), we hereby confirm our agreement, subject to the terms and conditions set forth in this waiver (“Waiver”), to amend the Ex-Im Bank Facility Agreement, as hereinafter provided. The provisions of this Waiver have been agreed to by the parties in consideration of the premises and mutual covenants herein contained. Unless otherwise provided herein, all capitalized terms not defined herein shall have the meanings set forth in the Ex-Im Bank Facility Agreement.
RE: Ex-Im Bank Transaction No. AP082872XX — Singapore (“Transaction”) Ex-Im Bank Facility Agreement dated as of May 16, 2007, among Chartered Semiconductor Manufacturing Ltd. (“Borrower”), JP Morgan Chase Bank, National Association (“Lender” and...Ex-Im Bank Facility Agreement • August 11th, 2009 • Chartered Semiconductor Manufacturing LTD • Semiconductors & related devices • New York
Contract Type FiledAugust 11th, 2009 Company Industry JurisdictionWith reference to the request by the Borrower dated as of June 24, 2009 (“Request”), we hereby confirm our agreement, subject to the terms and conditions set forth in this waiver (“Waiver”), to amend the Ex-Im Bank Facility Agreement, as hereinafter provided. The provisions of this Waiver have been agreed to by the parties in consideration of the premises and mutual covenants herein contained. Unless otherwise provided herein, all capitalized terms not defined herein shall have the meanings set forth in the Ex-Im Bank Facility Agreement.