Common Contracts
9 similar Change in Terms Agreement contracts by Integrated Packaging Assembly Corp, Visionics Corp, Digital Biometrics Inc, Eacceleration Corp
CHANGE IN TERMS AGREEMENT Principal Loan Date Maturity Loan No Call/Coll Account Officer Initials $275,000.00 12-13-2001 4-15-2003 1760600195 9093 120112 RR References in the shaded area are for Lender's use only and do not limit the applicability of...Change in Terms Agreement • April 15th, 2003 • Eacceleration Corp • Services-business services, nec
References in the shaded area are for Lender's use only and do not limit the applicability of this document to any particular loan or item. Any item above containing "***" has been omitted due to text length limitations.
EXHIBIT 10.20 CHANGE IN TERMS AGREEMENTChange in Terms Agreement • February 14th, 2002 • Visionics Corp • Computer peripheral equipment, nec • Minnesota
EXHIBIT 10.19 CHANGE IN TERMS AGREEMENTChange in Terms Agreement • August 14th, 2001 • Visionics Corp • Computer peripheral equipment, nec • Minnesota
Exhibit 10.39 CHANGE IN TERMS AGREEMENTChange in Terms Agreement • March 30th, 2001 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
-------------------------------------------------------------------------------- References in the shaded area are for Lender's use only and do not limit the applicability of this document to any particular loan or item. Any item above containing "*****" has been omitted due to text length limitations. --------------------------------------------------------------------------------
Exhibit 10.40 CHANGE IN TERMS AGREEMENTChange in Terms Agreement • March 30th, 2001 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
Exhibit 10.36 CHANGE IN TERMS AGREEMENTChange in Terms Agreement • March 30th, 2001 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
-------------------------------------------------------------------------------- References in the shaded area are for Lender's use only and do not limit the applicability of this document to any particular loan or item. Any item above containing "*****" has been omitted due to text length limitations. --------------------------------------------------------------------------------
Exhibit 10.37 CHANGE IN TERMS AGREEMENTChange in Terms Agreement • March 30th, 2001 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
-------------------------------------------------------------------------------- References in the shaded area are for Lender's use only and do not limit the applicability of this document to any particular loan or item. Any item above containing "***" has been omitted due to text length limitations. --------------------------------------------------------------------------------
Exhibit 10.38 CHANGE IN TERMS AGREEMENTChange in Terms Agreement • March 30th, 2001 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
-------------------------------------------------------------------------------- References in the shaded area are for Lender's use only and do not limit the applicability of this document to any particular loan or item. Any item above containing "***" has been omitted due to text length limitations. --------------------------------------------------------------------------------
EXHIBIT 10.17 CHANGE IN TERMS AGREEMENTChange in Terms Agreement • February 14th, 2001 • Digital Biometrics Inc • Computer peripheral equipment, nec • Minnesota
