Ose Usa Inc Sample Contracts

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AMENDMENT TO LOAN AND SECURITY AGREEMENT
Loan and Security Agreement • May 16th, 2001 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
EXHIBIT 4.1 STOCK PURCHASE AGREEMENT
Stock Purchase Agreement • May 7th, 1999 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
INTEGRATED PACKAGING ASSEMBLY CORPORATION AND OSE, INC.
Loan and Security Agreement • March 30th, 2001 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
Exhibit 10.39 CHANGE IN TERMS AGREEMENT
Change in Terms Agreement • March 30th, 2001 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California

-------------------------------------------------------------------------------- References in the shaded area are for Lender's use only and do not limit the applicability of this document to any particular loan or item. Any item above containing "*****" has been omitted due to text length limitations. --------------------------------------------------------------------------------

AGREEMENT ---------
Agreement of Guaranty • March 31st, 1997 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
RECITALS
First Refusal Agreement • May 7th, 1999 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
RECITALS
Purchase and Sale Agreement • January 30th, 1998 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
Exhibit 10.42 CHANGE IN TERMS AGREEMENT
Business Loan Agreement • March 30th, 2001 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California

THIS BUSINESS LOAN AGREEMENT dated November 29, 2000, is made and executed between Integrated Packaging Assembly Corporation; and OSE, Inc. ("Borrower") and Bank SinoPac, Los Angeles Branch ("Lender") on the following terms and conditions. Borrower has received prior commercial loans from Lender or has applied to Lender for a commercial loan or loans or other financial accommodations, including those which may be described on any exhibit or schedule attached to this Agreement ("Loan"). Borrower understands and agrees that: (A) in granting, renewing, or extending any Loan, Lender is relying upon Borrower's representations, warranties, and agreements as set forth in this Agreement, and (B) all such Loans shall be and remain subject to the terms and conditions of this Agreement.

RECITALS --------
Integrated Packaging Assembly Corp • November 3rd, 1997 • Semiconductors & related devices
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EXCHANGE AGREEMENT
Exchange Agreement • August 14th, 2002 • Ose Usa Inc • Semiconductors & related devices • Delaware

THIS EXCHANGE AGREEMENT (this “Agreement”) dated as of August 9, 2002, is entered into by and between OSE USA, Inc., a Delaware corporation (the “Corporation”), and Orient Semiconductor Electronics, Limited (Taiwan)(“OSEL”).

LEASE AMENDMENT
Lease Amendment • March 26th, 2004 • Ose Usa Inc • Semiconductors & related devices

This lease amendment agreement (“Agreement”) is made as of the 4th day of September 2003, by and between OSE USA, Inc., a Delaware corporation (“lessee”), and Joseph A. Sully (“owner”) as assigned by Lincoln-Recp Old Oakland OPCO. LLC.

AMENDMENT TO OSE INC. EXCLUSIVE SALES DISTRIBUTOR AGREEMENT
Exclusive Sales Distributor Agreement • March 26th, 2004 • Ose Usa Inc • Semiconductors & related devices

This Amendment (the “Amendment”) to OSE Inc. Exclusive Sales Distributor Agreement dated October 29, 1999 (the “Agreement”) is made and entered into this day of March, 2003 (the “Effective Date”), between Orient Semiconductor Electronics Ltd., a Taiwanese corporation (“Manufacturer”) and OSE Inc. (U.S.), a California corporation (“Distributor”).

AMENDMENT TO BUSINESS LOAN AGREEMENT AND PROMISSORY NOTE
Business Loan Agreement and Promissory Note • November 17th, 1999 • Integrated Packaging Assembly Corp • Semiconductors & related devices
AMENDMENT TO LOAN AND SECURITY AGREEMENT
Loan and Security Agreement • November 17th, 1999 • Integrated Packaging Assembly Corp • Semiconductors & related devices
AMENDMENT TO LOAN AND SECURITY AGREEMENT
Loan and Security Agreement • March 31st, 2003 • Ose Usa Inc • Semiconductors & related devices

This Amendment to Loan and Security Agreement is entered into as of February 15, 2001 (the “Amendment”), by and between BANK SINOPAC, LOS ANGELES BRANCH and FAR EAST NATIONAL BANK (individually, a “Lender” and collectively, the “Lenders”) and INTEGRATED PACKAGING ASSEMBLY CORPORATION, a Delaware corporation, and OSE, INC., a California corporation (individually a “Borrower” and collectively, the “Borrowers”).

AMENDMENT TO WARRANT TO PURCHASE 100,000 SHARES OF SERIES A PREFERRED STOCK ------------------------
Integrated Packaging Assembly Corp • November 3rd, 1997 • Semiconductors & related devices
ASSET PURCHASE AGREEMENT
Asset Purchase Agreement • September 16th, 2003 • Ose Usa Inc • Semiconductors & related devices • California

This asset purchase agreement (“Agreement”) is made as of the 3rd day of September, 2003, by and between OSE USA, Inc., a Delaware corporation (“Seller”), and Integrated Packaging Assembly Corporation, a California corporation (“Purchaser”).

AMENDMENT TO BUSINESS LOAN AGREEMENT AND PROMISORY NOTE
Business Loan Agreement and Promisory Note • May 17th, 2000 • Integrated Packaging Assembly Corp • Semiconductors & related devices
Article 2 DURATION OF THE AGREEMENT -------------------------
Exclusive Sales Distributor Agreement • November 15th, 1999 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
AMENDMENT TO LOAN AND SECURITY AGREEMENT
Loan and Security Agreement • March 31st, 2003 • Ose Usa Inc • Semiconductors & related devices • California

This Amendment to Loan and Security Agreement is entered into as of August 15, 2001 (the “Amendment”), by and between BANK SINOPAC, LOS ANGELES BRANCH and FAR EAST NATIONAL BANK (individually, a “Lender” and collectively, the “Lenders”) and OSE USA, INC. (fka “INTEGRATED PACKAGING ASSEMBLY CORPORATION”), a Delaware corporation, and OSE, INC., a California corporation (individually a “Borrower” and collectively, the “Borrowers”).

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