FIRST SUPPLEMENTAL INDENTURE Dated as of January 19, 2017 Among MICRON TECHNOLOGY, INC. as Issuer and as TrusteeFirst Supplemental Indenture • March 28th, 2017 • Micron Technology Inc • Semiconductors & related devices • New York
Contract Type FiledMarch 28th, 2017 Company Industry JurisdictionTHIS FIRST SUPPLEMENTAL INDENTURE (this “Supplemental Indenture”), is entered into as of January 19, 2017, between Micron technology, Inc., a Delaware corporation (the “Company”) and U.S. BANK NATIONAL ASSOCIATION, as Trustee (the “Trustee”).
FIRST SUPPLEMENTAL INDENTURE Dated as of January 19, 2017 Among MICRON TECHNOLOGY, INC. as Issuer and as TrusteeFirst Supplemental Indenture • March 28th, 2017 • Micron Technology Inc • Semiconductors & related devices • New York
Contract Type FiledMarch 28th, 2017 Company Industry JurisdictionTHIS FIRST SUPPLEMENTAL INDENTURE (this “Supplemental Indenture”), is entered into as of January 19, 2017, between Micron technology, Inc., a Delaware corporation (the “Company”) and U.S. BANK NATIONAL ASSOCIATION, as Trustee (the “Trustee”).