NONCOMPETITION AGREEMENTNoncompetition Agreement • November 19th, 2009 • Applied Materials Inc /De • Semiconductors & related devices • Delaware
Contract Type FiledNovember 19th, 2009 Company Industry JurisdictionTHIS NONCOMPETITION AGREEMENT is being executed and delivered as of November 16, 2009, by LARRY MURPHY (“Shareholder”), in favor of, and for the benefit of: APPLIED MATERIALS, INC., a Delaware corporation (“Parent”), and the other Beneficiaries. Certain capitalized terms used in this Noncompetition Agreement are defined in Section 14.
NONCOMPETITION AGREEMENTNoncompetition Agreement • November 19th, 2009 • Applied Materials Inc /De • Semiconductors & related devices • Delaware
Contract Type FiledNovember 19th, 2009 Company Industry JurisdictionTHIS NONCOMPETITION AGREEMENT is being executed and delivered as of November 16, 2009, by RAYMON F. THOMPSON (“Shareholder”), in favor of, and for the benefit of: APPLIED MATERIALS, INC., a Delaware corporation (“Parent”), and the other Beneficiaries. Certain capitalized terms used in this Noncompetition Agreement are defined in Section 14.