Common Contracts
2 similar Settlement Agreement contracts by Rambus Inc
SETTLEMENT AGREEMENTSettlement Agreement • March 29th, 2021 • Rambus Inc • Semiconductors & related devices • Delaware
THIS SETTLEMENT AGREEMENT (the “Agreement”) is made and entered into as of the 9th day of December, 2013 (the “Effective Date”) by and among Rambus Inc., a Delaware corporation (“Rambus”), on the one hand, and Micron Technology, Inc., a Delaware corporation, together with its Subsidiaries (as defined in Article 1), Micron Semiconductors Products, Inc., an Idaho corporation, Micron Semiconductor (Deutschland) GmbH, a corporation organized under the laws of Germany, and Micron Technology Italia Srl, a corporation organized under the laws of Italy (collectively, “Micron”), on the other hand. Rambus and Micron may hereinafter be referred to collectively as the “Parties” and individually as a “Party.”
SETTLEMENT AGREEMENTSettlement Agreement • February 26th, 2021 • Rambus Inc • Semiconductors & related devices • Delaware
THIS SETTLEMENT AGREEMENT (the “Agreement”) is made and entered into as of the 9th day of December, 2013 (the “Effective Date”) by and among Rambus Inc., a Delaware corporation (“Rambus”), on the one hand, and Micron Technology, Inc., a Delaware corporation, together with its Subsidiaries (as defined in Article 1), Micron Semiconductors Products, Inc., an Idaho corporation, Micron Semiconductor (Deutschland) GmbH, a corporation organized under the laws of Germany, and Micron Technology Italia Srl, a corporation organized under the laws of Italy (collectively, “Micron”), on the other hand. Rambus and Micron may hereinafter be referred to collectively as the “Parties” and individually as a “Party.”
