RAMBUS INC.Underwriting Agreement • April 30th, 1997 • Rambus Inc • Semiconductors & related devices • New York
RAMBUS INC. INDEMNIFICATION AGREEMENTIndemnification Agreement • May 7th, 2021 • Rambus Inc • Semiconductors & related devices • Delaware
This Indemnification Agreement (this “Agreement”) is dated as of [insert date], and is between Rambus Inc., a Delaware corporation (the “Company”), and [insert name of indemnitee] (“Indemnitee”).
CONFIDENTIAL REDWOOD AND YELLOWSTONE SEMICONDUCTOR TECHNOLOGY LICENSE AGREEMENT BETWEEN SONY CORPORATION AND RAMBUS INC.License Agreement • April 30th, 2003 • Rambus Inc • Semiconductors & related devices • California
CONFIDENTIAL DEVELOPMENT AGREEMENT BY AND AMONGDevelopment Agreement • April 30th, 2003 • Rambus Inc • Semiconductors & related devices • California
THIS WARRANT AND THE SECURITIES ISSUABLE UPON EXERCISE OR CONVERSION HEREOF HAVE NOT BEEN REGISTERED UNDER THE SECURITIES ACT OF 1933, AS AMENDED, OR ANY APPLICABLE STATE LAWS, AND NO INTEREST THEREIN MAY BE SOLD, DISTRIBUTED, ASSIGNED, OFFERED,...Warrant Agreement • July 7th, 2000 • Rambus Inc • Semiconductors & related devices • California
Dealer’s name and address]Call Option Transaction • November 17th, 2017 • Rambus Inc • Semiconductors & related devices
PAGE ------ Section 1. Certain Definitions 1 Section 2. Appointment of Rights Agent 7 Section 3. Issuance of Rights Certificates 7 Section 4. Form of Rights Certificates 9 Section 5. Countersignature and Registration 10 Section 6. Transfer, Split Up,...Preferred Shares Rights Agreement • March 6th, 1997 • Rambus Inc • Delaware
RAMBUS INC. andPreferred Stock Rights Agreement • August 3rd, 2000 • Rambus Inc • Semiconductors & related devices • Delaware
EXHIBIT 10.8 STANDARD OFFICE LEASE - GROSS AMERICAN INDUSTRIAL REAL ESTATE ASSOCIATION 1. Basic Lease Provisions ("Basic Lease Provisions"). ------------------------------------------------- 1.1 Parties: This Lease, dated, for reference purposes only,...Standard Office Lease • April 24th, 1997 • Rambus Inc • Semiconductors & related devices
1.125% CONVERTIBLE SENIOR NOTES DUE 2018Indenture • August 16th, 2013 • Rambus Inc • Semiconductors & related devices • New York
THIS INDENTURE, dated as of August 16, 2013, is between Rambus Inc., a Delaware corporation (the “Company”), and U.S. Bank National Association, a national banking association, as trustee (the “Trustee”).
EXHIBIT 10.4.1 AMENDMENT NO. 1 TO SEMICONDUCTOR TECHNOLOGY LICENSE AGREEMENT This Amendment No. 1 (the "Amendment") to the parties' Semiconductor Technology License Agreement is entered into as of the date last entered below by and between Rambus...Semiconductor Technology License Agreement • December 9th, 1998 • Rambus Inc • Semiconductors & related devices
TENANTLease • December 23rd, 1999 • Rambus Inc • Semiconductors & related devices • California
RAMBUS INC.Purchase Agreement • August 16th, 2013 • Rambus Inc • Semiconductors & related devices • New York
Rambus Inc., a Delaware corporation (the “Company”), proposes to issue and sell to the several initial purchasers listed in Schedule 1 hereto (the “Initial Purchasers”), for whom you are acting as representatives (the “Representatives”), $120,000,000 aggregate principal amount of its 1.125% Convertible Senior Notes due 2018 (the “Underwritten Securities”) and, at the option of the Initial Purchasers, up to an additional $18,000,000 aggregate principal amount of its 1.125% Convertible Senior Notes due 2018 (the “Option Securities”), solely to cover overallotments, if and to the extent that the Initial Purchasers shall have determined to exercise the option to purchase such Option Securities granted to the Initial Purchasers in Section 2 hereof. The Underwritten Securities and the Option Securities are herein referred to as the “Securities”. The Securities will be convertible into cash, and if designated by the Company, shares (the “Underlying Securities”) of common stock of the Company,
EXHIBIT 10.3.7 AMENDMENT NO. 7 TO SEMICONDUCTOR TECHNOLOGY AGREEMENT This Amendment No. 7 (the "Amendment") to the parties' Semiconductor technology Agreement is entered into as of the date last entered below by and between Rambus Inc., a Delaware...Semiconductor Technology Agreement • July 31st, 1998 • Rambus Inc • Semiconductors & related devices
RAMBUS INC.Information and Registration Rights Agreement • March 6th, 1997 • Rambus Inc • California
Exhibit 10.15 ------------- Confidential treatment has been requested for portions of this exhibit. The copy filed herewith omits the information subject to the confidentiality request. Omissions are designated as [*]. A complete version of this...Patent License Agreement • December 4th, 2001 • Rambus Inc • Semiconductors & related devices • Delaware
Facsimile: [_______________] Telephone: [_______________] c/o [_______________] as Agent for [_______________] Telephone: [_______________]Master Confirmation • March 1st, 2024 • Rambus Inc • Semiconductors & related devices
RAMBUS INC., as Issuer U.S. BANK NATIONAL ASSOCIATION, as Trustee 1.375% CONVERTIBLE SENIOR NOTES DUE 2023 INDENTURE DATED AS OF NOVEMBER 17, 2017Indenture • November 17th, 2017 • Rambus Inc • Semiconductors & related devices • New York
THIS INDENTURE, dated as of November 17, 2017, is between Rambus Inc., a Delaware corporation (the “Company”), and U.S. Bank National Association, a national banking association, as trustee (the “Trustee”).
RAMBUS INC.Restricted Stock Unit Agreement • August 28th, 2019 • Rambus Inc • Semiconductors & related devices • Delaware
Unless otherwise defined herein, the terms defined in the 2019 Inducement Equity Incentive Plan (the “Plan”) will have the same defined meanings in this Restricted Stock Unit Agreement including Exhibit A, which includes the special provisions for Participant’s country of residence, if any (collectively, the “Agreement”).
SETTLEMENT AGREEMENTSettlement Agreement • January 13th, 2014 • Rambus Inc • Semiconductors & related devices • California
THIS SETTLEMENT AGREEMENT (the “Agreement”) is made and entered into as of the July 1, 2013 by and among Rambus Inc., a Delaware corporation (“Rambus”), on the one hand, and SK hynix Inc., a corporation organized under the laws of Korea (“SK hynix”), SK hynix America Inc., a California corporation (“SK hynix U.S.”), Hynix Semiconductor Manufacturing America Inc., a California corporation, SK hynix U.K. Ltd., a corporation organized under the laws of the United Kingdom, and SK hynix Deutschland, GmbH, a corporation organized under the laws of Germany (collectively, “SK hynix,” with Rambus and SK hynix each being a “Party” and together the “Parties”), on the other hand.
ASSET PURCHASE AGREEMENTAsset Purchase Agreement • July 22nd, 2016 • Rambus Inc • Semiconductors & related devices • California
THIS ASSET PURCHASE AGREEMENT (the “Agreement”) is made and entered into as of June 29, 2016 by and among, on the one hand, Rambus, Inc., a Delaware corporation (“Buyer Parent”), and Bell ID Singapore Ptd Ltd (“Buyer,” and, together with Buyer Parent, the “Buyer Parties,” and each a “Buyer Party”), and, on the other hand, Inphi Corporation, a Delaware corporation (“Seller”) and Inphi International Pte. Ltd., a Singapore entity (“Seller Sub” and, together with Seller, the “Seller Parties”).
RAMBUS INC. AMENDED AND RESTATED CHANGE OF CONTROL SEVERANCE AGREEMENTChange of Control Severance Agreement • October 29th, 2018 • Rambus Inc • Semiconductors & related devices • California
This Amended and Restated Change of Control Severance Agreement (the “Agreement”) is made and entered into by and between Luc Seraphin (“Executive”) and Rambus Inc., a Delaware corporation (the “Company”), effective as of October 25, 2018 (the “Effective Date”).
Semiconductor Patent License Agreement Between Rambus Inc. and Samsung Electronics Co., Ltd.Semiconductor Patent License Agreement • March 29th, 2021 • Rambus Inc • Semiconductors & related devices • California
This SEMICONDUCTOR PATENT LICENSE AGREEMENT (“Agreement”) is made and entered into on this 19th day of January, 2010 (“Effective Date”) by and between Rambus Inc., a corporation duly organized and existing under the laws of Delaware, U.S.A., having its principal place of business at 4440 El Camino Real, Los Altos, California 94022, U.S.A., (hereinafter “Rambus”) and Samsung Electronics Co., Ltd., a Korean corporation having its principal place of business at San # 16, Banwol-Dong, Hwasung-City, Gyeonggi-Do, Korea, 445-701 (hereinafter “Samsung”).
ZERO COUPON CONVERTIBLE SENIOR NOTES DUE FEBRUARY 1, 2010Indenture • April 29th, 2005 • Rambus Inc • Semiconductors & related devices • New York
THIS INDENTURE, dated as of February 1, 2005, is between Rambus Inc., a Delaware corporation (the “Company”), and U.S. Bank National Association, a national banking association, as trustee (the “Trustee”).
RAMBUS INC.Common Stock Equivalent Agreement • December 23rd, 1999 • Rambus Inc • Semiconductors & related devices • California
SETTLEMENT AGREEMENTSettlement Agreement • March 29th, 2021 • Rambus Inc • Semiconductors & related devices • California
THIS SETTLEMENT AGREEMENT (the “Agreement”) is made by and among Rambus Inc., a Delaware corporation (“Rambus”), on the one hand, and Samsung Electronics Co., Ltd., a corporation organized under the laws of Korea (“Samsung Electronics”), Samsung Electronics America, Inc., a Delaware corporation, Samsung Semiconductor, Inc., a California corporation and Samsung Austin Semiconductor, L.P., a Texas limited partnership (collectively, “Samsung,” with Rambus and Samsung each being a “Party” and together the “Parties”), on the other hand, effective as of January 19, 2010 (the “Effective Date”).
AMENDMENT NUMBER 2 TO SEMICONDUCTOR PATENT LICENSE AGREEMENTSemiconductor Patent License Agreement • March 29th, 2021 • Rambus Inc • Semiconductors & related devices
This Amendment Number 2 (“Amendment 2”) amends that certain Semiconductor Patent License Agreement between Rambus Inc., and Micron Technology, Inc. effective December 1, 2013, as amended on September 2, 2020 (collectively, the “Patent License Agreement”), and is effective as of December 1, 2020 (the “Amendment 2 Effective Date”). Rambus, on behalf of itself and all of its subsidiaries (collectively, “Rambus”) and Micron Technology, Inc., on behalf of itself and all of its subsidiaries (collectively, “Micron”) (Rambus and Micron together, the “Parties”), and in consideration of the covenants set forth below, and for other good and valuable consideration, the receipt and sufficiency of which is hereby acknowledged, hereby agree as follows:
SETTLEMENT AGREEMENTSettlement Agreement • March 29th, 2021 • Rambus Inc • Semiconductors & related devices • California
THIS SETTLEMENT AGREEMENT (the “Agreement”) is made and entered into as of the July 1, 2013 by and among Rambus Inc., a Delaware corporation (“Rambus”), on the one hand, and SK hynix Inc., a corporation organized under the laws of Korea (“SK hynix”), SK hynix America Inc., a California corporation (“SK hynix U.S.”), Hynix Semiconductor Manufacturing America Inc., a California corporation, SK hynix U.K. Ltd., a corporation organized under the laws of the United Kingdom, and SK hynix Deutschland, GmbH, a corporation organized under the laws of Germany (collectively, “SK hynix,” with Rambus and SK hynix each being a “Party” and together the “Parties”), on the other hand.
RAMBUS INC. % Convertible Senior Notes Due 2014 UNDERWRITING AGREEMENTUnderwriting Agreement • June 22nd, 2009 • Rambus Inc • Semiconductors & related devices • New York
Credit Suisse Securities (USA) LLC J.P. Morgan Securities Inc. As Representatives of the Several Underwriters, c/o Credit Suisse Securities (USA) LLC, Eleven Madison Avenue, New York, N.Y. 10010-3629
SEMICONDUCTOR PATENT LICENSE AGREEMENTSemiconductor Patent License Agreement • March 29th, 2021 • Rambus Inc • Semiconductors & related devices • California
This SEMICONDUCTOR PATENT LICENSE AGREEMENT (“Agreement”) is effective as of July 1, 2013 (the “Effective Date”) by and between Rambus Inc., a corporation duly organized and existing under the laws of Delaware, U.S.A., having its principal place of business at 1050 Enterprise Way, Suite #700, Sunnyvale, California 94089, U.S.A., (hereinafter “Rambus”) and SK hynix Inc., a corporation duly organized and existing under the laws of Korea., having its principal place of business at 2091, Gyeongchung-daero, Bubal-eub, Icheon-si, Gyeonggi-do, Korea (hereinafter “SK hynix ”).
RAMBUS INC.Indemnification Agreement • March 6th, 1997 • Rambus Inc • Delaware
RAMBUS INC. EMPLOYMENT AGREEMENTEmployment Agreement • October 13th, 2021 • Rambus Inc • Semiconductors & related devices • California
This Employment Agreement (the “Agreement”) is made and entered into by and between Keith Jones (“Executive”) and Rambus Inc., a Delaware corporation (the “Company”), effective as of November 15, 2021 (the “Effective Date”).
SEMICONDUCTOR PATENT LICENSE AGREEMENTSemiconductor Patent License Agreement • March 29th, 2021 • Rambus Inc • Semiconductors & related devices • Delaware
This SEMICONDUCTOR PATENT LICENSE AGREEMENT (“Agreement”) is effective as of December 1, 2013 (“Effective Date”) by and between Rambus Inc., a corporation duly organized and existing under the laws of Delaware, U.S.A., having its principal place of business at 1050 Enterprise Way, Suite #700, Sunnyvale, California 94089, U.S.A., (hereinafter “Rambus”) and Micron Technology, Inc., a corporation duly organized and existing under the laws of Delaware, U.S.A., having its principal place of business at 8000 S. Federal Way, Boise, Idaho 83716, U.S.A., (hereinafter “Micron”). Micron and Rambus shall be referred to herein individually as a Party, and collectively as the Parties.
SETTLEMENT AGREEMENTSettlement Agreement • March 29th, 2021 • Rambus Inc • Semiconductors & related devices • Delaware
THIS SETTLEMENT AGREEMENT (the “Agreement”) is made and entered into as of the 9th day of December, 2013 (the “Effective Date”) by and among Rambus Inc., a Delaware corporation (“Rambus”), on the one hand, and Micron Technology, Inc., a Delaware corporation, together with its Subsidiaries (as defined in Article 1), Micron Semiconductors Products, Inc., an Idaho corporation, Micron Semiconductor (Deutschland) GmbH, a corporation organized under the laws of Germany, and Micron Technology Italia Srl, a corporation organized under the laws of Italy (collectively, “Micron”), on the other hand. Rambus and Micron may hereinafter be referred to collectively as the “Parties” and individually as a “Party.”
CERTAIN IDENTIFIED INFORMATION HAS BEEN EXCLUDED FROM THE EXHIBIT BECAUSE IT IS BOTH NOT MATERIAL AND WOULD LIKELY CAUSE COMPETITIVE HARM TO THE REGISTRANT IF PUBLICLY DISCLOSED. [***] INDICATES THAT INFORMATION HAS BEEN REDACTED. AMENDMENT 2 TO...Semiconductor Patent License Agreement • May 5th, 2023 • Rambus Inc • Semiconductors & related devices
This AMENDMENT 2 TO SEMICONDUCTOR PATENT LICENSE AGREEMENT (the “Second Amendment”), effective as of July 1, 2024 (the “Second Amendment Effective Date”), is made by and between Rambus Inc., a corporation duly organized and existing under the laws of Delaware, U.S.A., having its principal place of business at 4453 N. 1st Street, Suite 100, San Jose, California 95134, U.S.A., (hereinafter “Rambus”) and SK hynix Inc., a corporation duly organized and existing under the laws of Korea., having its principal place of business at 2091, Gyeongchung-daero, Bubal-eub, Icheon-si, Gyeonggi-do, Korea (hereinafter “SK hynix”) and amends that certain Semiconductor Patent License Agreement between the parties with an effective date of July 1, 2013, as subsequently amended on June 17, 2015 (such agreement, as so amended, the “Agreement”).
