EXTENSION AGREEMENTExtension Agreement • February 23rd, 2023 • Applied Materials Inc /De • Semiconductors & related devices • New York
EXTENSION AGREEMENT (this “Agreement”), dated as February 21, 2023, for the Credit Agreement, dated as of February 21, 2020 (as amended by that certain Amendment No. 1 to Credit Agreement, dated as of July 27, 2022 and as further amended, restated, amended and restated, supplemented or otherwise modified from time to time, the “Credit Agreement”), among Applied Materials, Inc. (the “Borrower”), the lenders from time to time party thereto (the “Lenders”), and JPMorgan Chase Bank, N.A., as administrative agent (in such capacity, the “Administrative Agent”).
