CREDIT AGREEMENT among MICRON TECHNOLOGY, INC., as Borrower and THE LENDERS PARTY HERETO, and JPMORGAN CHASE BANK, N.A., as Administrative Agent and as Collateral Agent Dated as of July 3, 2018 JPMORGAN CHASE BANK, N.A. and HSBC SECURITIES (USA) INC....Credit Agreement • October 15th, 2018 • Micron Technology Inc • Semiconductors & related devices • New York
THIS CREDIT AGREEMENT, dated as of July 3, 2018, among MICRON TECHNOLOGY, INC., a Delaware corporation (the “Borrower”), JPMORGAN CHASE BANK, N.A. (“JPMorgan”), as administrative agent (in such capacity and including any successors in such capacity, the “Administrative Agent” or the “Agent”) and as collateral agent (in such capacity and including any successors in such capacity, the “Collateral Agent”), the other agents party hereto and each of the financial institutions from time to time party hereto (collectively, the “Lenders”).
GUARANTEE AND COLLATERAL AGREEMENT made by MICRON TECHNOLOGY, INC. and certain of its Restricted Subsidiaries in favor of JPMORGAN CHASE BANK, N.A., as Collateral Agent Dated as of July 3, 2018Guarantee and Collateral Agreement • October 15th, 2018 • Micron Technology Inc • Semiconductors & related devices • New York
GUARANTEE AND COLLATERAL AGREEMENT, dated as of July 3, 2018, made by MICRON TECHNOLOGY, INC. (the “Borrower”) and each of the signatories from time to time hereto (the “Guarantors”), in favor of JPMORGAN CHASE BANK, N.A., as Collateral Agent (in such capacity, the “Collateral Agent”) for the banks and other financial institutions or entities (the “Lenders”) from time to time party to the Credit Agreement, dated as of July 3, 2018 (as amended, supplemented or otherwise modified from time to time, the “Credit Agreement”), among the Borrower, the Lenders, and JPMorgan Chase Bank, N.A., as the administrative agent (in such capacity, the “Administrative Agent”) and Collateral Agent.
