LOAN AND SECURITY AGREEMENT DATED AS OF SEPTEMBER 29, 2008Loan and Security Agreement • December 30th, 2008 • Emcore Corp • Semiconductors & related devices • Illinois
THIS LOAN AND SECURITY AGREEMENT (as amended, modified or supplemented from time to time, this “Agreement”) made this 29th day of September, 2008 (the “Closing Date”) by and between BANK OF AMERICA, N.A., a national banking association (together with its successors and assigns, “Lender”), 135 South LaSalle Street, Chicago, Illinois 60603-4105, and EMCORE CORPORATION, a New Jersey corporation, having its principal place of business at 10420 Research Road, SE, Albuquerque, New Mexico 87123 (“Borrower”) and each other Obligor (as defined herein) listed on the signature pages hereto.
