0000808326-10-000005 Sample Contracts

TANGSHAN CAOFEIDIAN INVESTMENT CO., LTD EMCORE CORPORATION SHAREHOLDERS AGREEMENT
Shareholders Agreement • February 9th, 2010 • Emcore Corp • Semiconductors & related devices • Hong Kong
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SHARE PURCHASE AGREEMENT BY AND BETWEEN EMCORE CORPORATION and TANGSHAN CAOFEIDIAN INVESTMENT CO., LTD. 3rd February, 2010
Share Purchase Agreement • February 9th, 2010 • Emcore Corp • Semiconductors & related devices • Hong Kong

This Share Purchase Agreement (“Agreement”) is made as of the 3rd day of February, 2010, by and between EMCORE Corporation, a New Jersey corporation with its principal executive office at 10420 Research Road, SE Albuquerque, NM 87123 U.S.A. (“Seller”), and Tangshan Caofeidian Investment Co., Ltd., a limited liability company incorporated under the laws of the PRC, with its legal address at: Kilometer Zero, Caofeidian Industrial Zone, Tanghai County, Tangshan City, Hebei Province 063200, PRC (“Buyer”). For purposes of this Agreement, the terms set forth in Exhibit 1 shall have the meanings specified or referred to therein.

SIXTH AMENDMENT TO LOAN AND SECURITY AGREEMENT
Loan and Security Agreement • February 9th, 2010 • Emcore Corp • Semiconductors & related devices

This Sixth Amendment to Loan and Security Agreement (this “Amendment”) is dated as of the 8th day of February, 2010, and is made by and among EMCORE Corporation, a New Jersey corporation (“Borrower”), Bank of America, N.A. (“Lender”), and the other Obligors party to that certain Loan and Security Agreement dated September 26, 2008 (as amended, modified, supplemented or restated from time to time, the “Agreement”). Borrower, Lender and such other Obligors now desire to amend the Agreement as provided herein, subject to the conditions set forth herein. Capitalized terms used in this Amendment and not otherwise defined herein have the meanings given to such terms in the Agreement.

Supplemental Agreement
Supplemental Agreement • February 9th, 2010 • Emcore Corp • Semiconductors & related devices
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