0000891618-06-000507 Sample Contracts

U.S. $100,000,000 364-DAY CREDIT AGREEMENT Dated as of September 14, 2006 Between APPLIED MATERIALS, INC. as Borrower and CITICORP USA, INC. as Lender

Day Credit Agreement • December 14th, 2006 • Applied Materials Inc /De • Semiconductors & related devices • New York

• Contract Type
  Day Credit Agreement
• Filed
  December 14th, 2006
• Company
  Applied Materials Inc /De
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York