ContractSecurity Agreement • January 14th, 2002 • Memc Electronic Materials Inc • Semiconductors & related devices • New York
Contract Type FiledJanuary 14th, 2002 Company Industry JurisdictionSECURITY AGREEMENT dated as of December 21, 2001, among MEMC ELECTRONIC MATERIALS, INC., a Delaware corporation (the "Borrower"), each subsidiary of Borrower listed on Schedule I hereto (each such subsidiary individually a "Subsidiary" or a "Guarantor" and, collectively, the "Subsidiaries" or "Guarantors"; and the Guarantors and Borrower are referred to collectively herein as the "Grantors") and CITICORP USA, INC. as collateral agent (in such capacity, the "Collateral Agent") for the Secured Parties (as defined herein).
ContractRevolving Credit Agreement • January 14th, 2002 • Memc Electronic Materials Inc • Semiconductors & related devices • New York
Contract Type FiledJanuary 14th, 2002 Company Industry JurisdictionREVOLVING CREDIT AGREEMENT dated as of December 21, 2001 (this "Agreement"), among MEMC ELECTRONIC MATERIALS, INC., the LENDERS party hereto, and CITICORP USA, INC., as administrative agent and collateral agent hereunder.
ContractGuarantee Agreement • January 14th, 2002 • Memc Electronic Materials Inc • Semiconductors & related devices • New York
Contract Type FiledJanuary 14th, 2002 Company Industry JurisdictionGUARANTEE AGREEMENT dated as of December 21, 2001, among MEMC ELECTRONIC MATERIALS, INC., a Delaware corporation ("Borrower"), each of the subsidiaries listed on Schedule I hereto (each such subsidiary, individually, a "Subsidiary" or a "Guarantor" and, collectively, the "Subsidiaries" or the "Guarantors") and CITICORP USA, INC. as collateral agent (the "Collateral Agent") for the Secured Parties (as defined in the Security Agreement).
ContractIndemnification & Liability • January 14th, 2002 • Memc Electronic Materials Inc • Semiconductors & related devices • New York
Contract Type FiledJanuary 14th, 2002 Company Industry JurisdictionINDEMNITY, SUBROGATION and CONTRIBUTION AGREEMENT dated as of December 21, 2001, among MEMC ELECTRONIC MATERIALS, INC., a Delaware corporation (the "Borrower"), each subsidiary of Borrower listed on Schedule I hereto (each such subsidiary individually, a "Subsidiary" and or a "Guarantor" and, collectively, the "Guarantors") and CITICORP USA, INC., as collateral agent (in such capacity, the "Collateral Agent") for the Secured Parties (as defined in the Security Agreement).
ContractIndenture • January 14th, 2002 • Memc Electronic Materials Inc • Semiconductors & related devices • New York
Contract Type FiledJanuary 14th, 2002 Company Industry JurisdictionAMENDED AND RESTATED INDENTURE dated as of December 21, 2001 among MEMC ELECTRONIC MATERIALS, INC., a Delaware corporation (the "Issuer"), Citibank, N.A., a national banking association, as trustee (the "Trustee") and (the "Issuer"), Citicorp USA, Inc., a Delaware corporation, as collateral agent (the "Collateral Agent").
AMENDED AND RESTATED INDEMNITY, SUBROGATION AND CONTRIBUTION AGREEMENTIndemnification & Liability • January 14th, 2002 • Memc Electronic Materials Inc • Semiconductors & related devices • New York
Contract Type FiledJanuary 14th, 2002 Company Industry JurisdictionTHIS AMENDED AND RESTATED INDEMNITY, SUBROGATION and CONTRIBUTION AGREEMENT (this "Agreement"), dated as of December 21, 2001, is made among MEMC ELECTRONIC MATERIALS, INC., a Delaware corporation (the "Borrower"), each subsidiary of Borrower listed on Schedule I hereto (each such subsidiary individually, a "Subsidiary" and or a "Guarantor" and, collectively, the "Guarantors") and CITICORP USA, INC. as collateral agent (in such capacity, the "Collateral Agent") for the Secured Parties (as defined in the Amended and Restated Security Agreement). Unless the context otherwise requires, all capitalized terms used but not defined herein shall have the meanings set forth in the Reimbursement Agreement.
AMENDED AND RESTATED GUARANTEE AGREEMENTGuarantee Agreement • January 14th, 2002 • Memc Electronic Materials Inc • Semiconductors & related devices • New York
Contract Type FiledJanuary 14th, 2002 Company Industry JurisdictionTHIS AMENDED AND RESTATED GUARANTEE AGREEMENT (this "Agreement"), dated as of December 21, 2001, is made among MEMC ELECTRONIC MATERIALS, INC., a Delaware corporation ("Borrower"), each of the subsidiaries listed on Schedule I hereto (each such subsidiary, individually, a "Subsidiary" or a "Guarantor" and, collectively, the "Subsidiaries" or the "Guarantors") and CITICORP USA, INC. as collateral agent (the "Collateral Agent") for the Secured Parties (as defined in the Amended and Restated Security Agreement). Unless the context otherwise requires, all capitalized terms used but not defined herein shall have the meanings set forth in the Reimbursement Agreement.
REIMBURSEMENT AGREEMENTReimbursement Agreement • January 14th, 2002 • Memc Electronic Materials Inc • Semiconductors & related devices • New York
Contract Type FiledJanuary 14th, 2002 Company Industry JurisdictionThe representations made by the Borrower pursuant to the Security Documents are hereby incorporated by reference herein, and the Borrower shall be deemed to have made such representations hereby to the Fund Guarantors as of the date of such agreements. The Borrower hereby represents and warrants to the Fund Guarantors on the date hereof as follows:
TERMINATION AND FUNDING AGREEMENTTermination and Funding Agreement • January 14th, 2002 • Memc Electronic Materials Inc • Semiconductors & related devices • New York
Contract Type FiledJanuary 14th, 2002 Company Industry JurisdictionTERMINATION AND FUNDING AGREEMENT (this "Agreement") dated as of December 21, 2001, by and among MEMC ELECTRONIC MATERIALS, INC. (the "Borrower"), TPG WAFER CREDIT PARTNERS LLC, T3 PARTNERS II, L.P., T3 PARALLEL II, L.P., TCW/CRESCENT MEZZANINE PARTNERS III, L.P ("TCW") AND TCW/CRESCENT MEZZANINE TRUST III ("TCW Trust"), GREEN EQUITY INVESTORS III, L.P. ("GEI"), GREEN EQUITY INVESTORS SIDE III, L.P. ("GEI Side" and collectively, the "Lenders"), and CITICORP USA, INC.
AMENDED AND RESTATED PLEDGE AGREEMENTPledge Agreement • January 14th, 2002 • Memc Electronic Materials Inc • Semiconductors & related devices • New York
Contract Type FiledJanuary 14th, 2002 Company Industry JurisdictionTHIS AMENDED AND RESTATED PLEDGE AGREEMENT, dated as of December 21, 2001, is made among MEMC ELECTRONIC MATERIALS, INC., a Delaware corporation ("Borrower"), each subsidiary of the Borrower listed on Schedule I hereto (each such subsidiary individually a "Subsidiary Pledgor" and collectively, the "Subsidiary Pledgors"; the Borrower and the Subsidiary Pledgors are referred to herein individually as a "Pledgor" and collectively as the "Pledgors") and CITICORP USA, INC., as collateral agent (in such capacity, the "Collateral Agent") for the Secured Parties (as defined in the Amended and Restated Security Agreement). Unless the context otherwise requires, all capitalized terms used but not defined herein shall have the meanings set forth in the Reimbursement Agreement.