TERMINATION AND FUNDING AGREEMENTTermination and Funding Agreement • January 14th, 2002 • Memc Electronic Materials Inc • Semiconductors & related devices • New York
TERMINATION AND FUNDING AGREEMENT (this "Agreement") dated as of December 21, 2001, by and among MEMC ELECTRONIC MATERIALS, INC. (the "Borrower"), TPG WAFER CREDIT PARTNERS LLC, T3 PARTNERS II, L.P., T3 PARALLEL II, L.P., TCW/CRESCENT MEZZANINE PARTNERS III, L.P ("TCW") AND TCW/CRESCENT MEZZANINE TRUST III ("TCW Trust"), GREEN EQUITY INVESTORS III, L.P. ("GEI"), GREEN EQUITY INVESTORS SIDE III, L.P. ("GEI Side" and collectively, the "Lenders"), and CITICORP USA, INC.
Exhibit 15 TERMINATION AND FUNDING AGREEMENT TERMINATION AND FUNDING AGREEMENT (this "Agreement") dated as of December 21, 2001, by and among MEMC ELECTRONIC MATERIALS, INC. (the "Borrower"), TPG WAFER CREDIT PARTNERS LLC, T3 PARTNERS II, L.P., T3...Termination and Funding Agreement • January 31st, 2002 • Memc Electronic Materials Inc • Semiconductors & related devices • New York
