Dated March 26, 2010 between Kalex Multi-Layer Circuit Board (Zhongshan) Co., Ltd as Borrower and China Construction Bank Zhongshan Branch as Lender CREDIT FACILITY CONTRACTCredit Facility Contract • March 30th, 2010 • Viasystems Group Inc • Printed circuit boards
Kalex Multi-Layer Circuit Board (Zhongshan) Co., Ltd, located at Guang Fu Road, Luosha Yongning, Zhongshan P.R.C. 528415 with Mr. Daniel J. Weber as its legal representative (or principal officer) and its telephone number 0760-22186367 (“Party A”);
AMENDMENT NO. 1 TO LOAN AND SECURITY AGREEMENTLoan and Security Agreement • March 30th, 2010 • Viasystems Group Inc • Printed circuit boards • New York
AMENDMENT NO. 1 TO LOAN AND SECURITY AGREEMENT, dated as of March 24, 2010 (this “Amendment No. 1”), is by and among Wachovia Capital Finance Corporation (New England), a Massachusetts corporation, in its capacity as agent pursuant to the Loan Agreement defined below (in such capacity, “Agent”), the parties to the Loan Agreement as lenders (individually, each a “Lender” and collectively, “Lenders”), Viasystems Technologies Corp., L.L.C., a Delaware limited liability company (“Technologies”), Merix Corporation, an Oregon corporation (“Merix” and, together with Technologies, each individually a “Borrower” and collectively, “Borrowers”), Viasystems, Inc., a Delaware corporation (“Parent”), Viasystems International, Inc., a Delaware corporation (“International”) and Merix Asia, Inc., an Oregon corporation (“Asia” and together with Parent and International, each individually a “Guarantor” and collectively, “Guarantors”).
