March 31, 2010 Diodes Incorporated Diodes Zetex Limited 15660 Dallas Parkway Suite 850 Dallas, Texas 75248Diodes Inc /Del/ • May 7th, 2010 • Semiconductors & related devices
Re: Credit Agreement (as amended, the “Credit Agreement”), as of November 25, 2009, among Diodes Incorporated, a Delaware corporation, and Diodes Zetex Limited, a United Kingdom corporation (“Borrowers”), the lenders party thereto (the “Lenders”) and Bank of America, N.A., as administrative agent for the Lenders (“Administrative Agent”). The capitalized terms used herein shall have the same meanings as are provided therefor in the Credit Agreement unless the context hereof otherwise requires or provides.
Third Floor of the Accommodation Building Lease AgreementAccommodation Building Lease Agreement • May 7th, 2010 • Diodes Inc /Del/ • Semiconductors & related devices
This Third Floor of the Accommodation Building Lease Agreement (the “Lease Agreement”) is entered into as of April 12, 2010 (“Effective Date”) in the city of Shanghai, by and between SHANGHAI KAI HONG TECHNOLOGY CO., LTD. (hereinafter referred to as “DSH”) with its registered office at No.1 Lane 18 San Zhuang Road, Songjiang Export Processing Zone, Shanghai, P.R.China and SHANGHAI DING HONG ELECTRONIC CO., LTD. (hereinafter referred to as “Ding Hong”) with its registered office at No.999 Chenchun Road, Xinqiao Town, Songjiang, Shanghai, P.R.China.
