FLEXTRONICS INTERNATIONAL LTD. 2010 EQUITY INCENTIVE PLAN FORM OF RESTRICTED SHARE UNIT AWARD AGREEMENTRestricted Share Unit Award Agreement • August 5th, 2010 • Flextronics International Ltd. • Printed circuit boards • California
This Restricted Share Unit Award Agreement (the “Agreement”) is made and entered into as of [insert date], (the “Effective Date”) by and between Flextronics International Ltd., a Singapore corporation (the “Company”), and the participant named below (the “Participant”). Capitalized terms not defined herein shall have the meaning ascribed to them in the Flextronics International Ltd. 2010 Equity Incentive Plan (the “Plan”). The Participant understands and agrees that this Restricted Share Unit Award (the “RSU Award”) is granted subject to and in accordance with the express terms and conditions of the Plan and this Agreement including any country-specific terms set forth in Exhibit A to this Agreement. The Participant further agrees to be bound by the terms and conditions of the Plan and the terms and conditions of this Agreement. The Participant acknowledges receipt of a copy of Plan and the official prospectus for the Plan. A copy of the Plan and the official prospectus for the Plan ar
FLEXTRONICS INTERNATIONAL LTD. 2010 EQUITY INCENTIVE PLAN FORM OF SHARE OPTION AWARD AGREEMENTShare Option Award Agreement • August 5th, 2010 • Flextronics International Ltd. • Printed circuit boards • California
This Share Option Agreement (the “Agreement”) is made and entered into as of the date of grant set forth below (the “Date of Grant”) by and between Flextronics International Ltd., a Singapore corporation (the “Company”), and the participant named below (the “Participant”). Capitalized terms not defined herein shall have the meaning ascribed to them in the Company’s 2010 Equity Incentive Plan (the “Plan”) and this Agreement. The Participant understands and agrees that this share option (“Option”) is granted subject to and in accordance with the express terms and conditions of the Plan and the Agreement including any country-specific provisions set forth in Exhibit B and the Participant further agrees to be bound by the terms and conditions of the Plan and the Agreement.
FLEXTRONICS INTERNATIONAL LTD. 2001 EQUITY INCENTIVE PLAN FORM OF SHARE BONUS AWARD AGREEMENTShare Bonus Award Agreement • August 5th, 2010 • Flextronics International Ltd. • Printed circuit boards • California
This Share Bonus Award Agreement (the “Agreement”) is made and entered into as of _______________ (the “Effective Date”) by and between Flextronics International Ltd., a Singapore corporation (the “Company”), and the participant named below (the “Participant”). Capitalized terms not defined herein shall have the meaning ascribed to them in the Company’s 2001 Equity Incentive Plan (the “Plan”). The Participant understands and agrees that this Share Bonus Award is granted subject to and in accordance with the express terms and conditions of the Plan. The Participant further agrees to be bound by the terms and conditions of the Plan and the terms and conditions of this Agreement, including any country-specific Exhibit thereto. The Participant acknowledges receipt of a copy of Plan and the official prospectus for the Plan. A copy of the Plan and the official prospectus for the Plan are available on the Flextronics website at http://home.sjc.flextronics.com/options/reference.asp and at the
Award Agreement for Francois Barbier Deferred Compensation PlanAward Agreement for Deferred Compensation Plan • August 5th, 2010 • Flextronics International Ltd. • Printed circuit boards
