FLEXTRONICS INTERNATIONAL LTD. 2001 EQUITY INCENTIVE PLAN FORM OF AMENDMENT TO SHARE BONUS AWARD AGREEMENTShare Bonus Award Agreement • February 4th, 2013 • Flextronics International Ltd. • Printed circuit boards • California
This AMENDMENT TO SHARE BONUS AWARD AGREEMENT (this “Amendment”) is entered into as of [<<DATE>>], by and between Flextronics International Ltd., a Singapore corporation (the “Company”) and [<<NAME>>] (the “Participant”), and amends that certain Share Bonus Award Agreement dated as of [<<Original Date>>] (the “Agreement”), by and between the Company and the Participant.
FLEXTRONICS INTERNATIONAL LTD. 2001 EQUITY INCENTIVE PLAN FORM OF SHARE BONUS AWARD AGREEMENTShare Bonus Award Agreement • August 5th, 2010 • Flextronics International Ltd. • Printed circuit boards • California
This Share Bonus Award Agreement (the “Agreement”) is made and entered into as of _______________ (the “Effective Date”) by and between Flextronics International Ltd., a Singapore corporation (the “Company”), and the participant named below (the “Participant”). Capitalized terms not defined herein shall have the meaning ascribed to them in the Company’s 2001 Equity Incentive Plan (the “Plan”). The Participant understands and agrees that this Share Bonus Award is granted subject to and in accordance with the express terms and conditions of the Plan. The Participant further agrees to be bound by the terms and conditions of the Plan and the terms and conditions of this Agreement, including any country-specific Exhibit thereto. The Participant acknowledges receipt of a copy of Plan and the official prospectus for the Plan. A copy of the Plan and the official prospectus for the Plan are available on the Flextronics website at http://home.sjc.flextronics.com/options/reference.asp and at the
