COMPREHENSIVE CREDIT FACILITY AGREEMENTComprehensive Credit Facility Agreement • August 9th, 2011 • Diodes Inc /Del/ • Semiconductors & related devices
Parties to the Agreement Diodes Taiwan Inc. (hereinafter referred to as the “Contractor”) and Mega International Commercial Bank Co., Ltd. (hereinafter referred to as the “Bank”), to meet the multiple credit facility needs and in an attempt to summarize the process, hereby officially consolidate all sorts of credit facility relationship into this Comprehensive Credit Facility Agreement (hereinafter referred to as the “Agreement”);
Supplement Agreement to the Power Facility Construction Application AgreementPower Facility Construction Application Agreement • August 9th, 2011 • Diodes Inc /Del/ • Semiconductors & related devices
This Supplement Agreement to the Power Facility Construction Application Agreement (the “Supplement”) is entered into as of March 21, 2011 (“Effective Date”) in the city of Shanghai, by and between SHANGHAI KAI HONG TECHNOLOGY CO., LTD. (hereinafter referred to as “DSH”) with its registered office at No.1 Lane 18 San Zhuang Road, Songjiang Export Processing Zone, Shanghai, People’s Republic of China and SHANGHAI YUAN HAO ELECTRONIC CO., LTD. (hereinafter referred to as “Yuan Hao”) with its registered office at No.8 Lane 18 San Zhuang Road, Songjiang Export Processing Zone, Shanghai, P.R.China. DSH and Yuan Hao are collectively referred to as the “Parties” and individually as a “Party”.
