INDEMNIFICATION AGREEMENTIndemnification Agreement • May 20th, 2009 • Flextronics International Ltd. • Printed circuit boards
THIS INDEMNIFICATION AGREEMENT is made and entered into this ___day of ___, 2009 between Flextronics International Ltd., a Singapore corporation (the “Company”), and ___, a director and/or officer of the Company (the “Indemnitee”).
June 23, 2008 Mr. Thomas J. Smach 4504 Spruce Ridge Drive Manlius, New York 13104 Re: Separation Dear Tom:Separation Agreement • May 20th, 2009 • Flextronics International Ltd. • Printed circuit boards
This letter, upon your signature, will constitute the separation agreement between you, on the one hand, and Flextronics International USA, Inc., a wholly owned subsidiary of Flextronics International Ltd (“FIL”), and its and their affiliates, parents, subsidiaries, and related entities, on the other hand (collectively referred to herein as “Flextronics” or the “Company”) (the “Letter Agreement”).
Award Agreement for Michael Clarke Deferred Compensation PlanDeferred Compensation Agreement • May 20th, 2009 • Flextronics International Ltd. • Printed circuit boards • California
Award Agreement for Deferred Compensation PlanAward Agreement for Deferred Compensation Plan • May 20th, 2009 • Flextronics International Ltd. • Printed circuit boards • California
