SECOND AMENDED AND RESTATED LOAN AGREEMENTLoan Agreement • December 28th, 2007 • Hutchinson Technology Inc • Electronic components, nec • Illinois
This AMENDED AND RESTATED LOAN AGREEMENT dated as of December 21, 2007 (the “Agreement”), is executed by and between HUTCHINSON TECHNOLOGY INCORPORATED (“HTI”), a Minnesota corporation, HUTCHINSON TECHNOLOGY ASIA, INC. a Minnesota corporation (“Asia”; collectively HTI and Asia shall be referred to as the “Borrower”), whose address is 40 W. Highland Park, Hutchinson, Minnesota 55350, and LASALLE BANK NATIONAL ASSOCIATION, a national banking association, (the “Bank”), whose address is 135 South La Salle Street, Chicago, Illinois 60603.
