Additional AgreementAdditional Agreement • May 4th, 2007 • Amkor Technology Inc • Semiconductors & related devices
As to the Credit Facility Agreement dated as of March 30, 2007, for a loan of 300,000,000 U.S. dollars (the “Credit Facility Agreement”), the parties to the Credit Facility Agreement hereby additionally agree to the following:
ContractAmkor Technology Inc • May 4th, 2007 • Semiconductors & related devices
Woori Bank must explain the material contents hereof to the Borrower, and deliver the General Terms and Conditions for Bank Credit Transactions and a copy of this Credit Facility Agreement to the Borrower.
FRONT PAGE OF THE KUN-MORTGAGE AGREEMENT]Amkor Technology Inc • May 4th, 2007 • Semiconductors & related devices
Woori Bank must explain the material contents hereof to the Mortgagor and deliver the General Terms and Conditions for Bank Credit Transactions and a copy of this Kun-mortgage Agreement to the Mortgagor.
SECOND AMENDMENT TO LOAN AND SECURITY AGREEMENTLoan and Security Agreement • May 4th, 2007 • Amkor Technology Inc • Semiconductors & related devices • Texas
THIS SECOND AMENDMENT TO LOAN AND SECURITY AGREEMENT (“Amendment”), dated as of March 27, 2007 (the “Amendment Date”), is among Amkor Technology, Inc. and its Subsidiaries party hereto, the Lenders party to the Loan and Security Agreement referred to below, and Bank of America, N.A., as administrative agent for the Lenders.
