Amendment to Kun-Mortgage AgreementKun-Mortgage Agreement • August 2nd, 2013 • Amkor Technology Inc • Semiconductors & related devices
Whereas the above mentioned parties entered into the Kun-Mortgage Agreement (the “Agreement”) dated July 2, 2012 on the properties described in the attachment and completed the following registrations of kun-mortgage submitted to the Registration Division of the Seoul Eastern District Court under the submission No. 39384 on July 4, 2012:
Amendment to Kun-Mortgage Agreement (Increase of Maximum Credit Amount)Kun-Mortgage Agreement • November 27th, 2012 • Amkor Technology Inc • Semiconductors & related devices
Whereas the above mentioned parties entered into the Kun-Mortgage Agreement (the “Agreement”) dated July 2, 2012 on the properties described in the attachment and completed the following registrations of kun-mortgage submitted to the Registration Division of the Seoul Eastern District Court under the submission No. 39384 on July 4, 2012:
ContractKun-Mortgage Agreement • March 17th, 2023
The Bank shall explain important contents of this agreement and deliver a copy of the General Terms and Conditions for Bank Credit Transaction and this agreement to the Mortgagor.
FRONT PAGE OF THE KUN-MORTGAGE AGREEMENT]Kun-Mortgage Agreement • May 4th, 2007 • Amkor Technology Inc • Semiconductors & related devices
Woori Bank must explain the material contents hereof to the Mortgagor and deliver the General Terms and Conditions for Bank Credit Transactions and a copy of this Kun-mortgage Agreement to the Mortgagor.
KUN-MORTGAGE AGREEMENTKun-Mortgage Agreement • July 2nd, 2012 • Amkor Technology Inc • Semiconductors & related devices
